# RT6214BHGJ6F

**Richtek Tech** · DC-DC Converters · TSOT-23-6

RT6214BHGJ6F from Richtek Tech, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Power ground, connected to analog ground, must be soldered to a large PCB copper area for maximum power dissipation. |
| 2 | LX | output | Switch node between the internal switch and the synchronous rectifier, connected to the inductor and bootstrap capacitor. |
| 3 | VIN | power_in | Power input with an input voltage range of 4.5V to 18V; connect a suitable input capacitor between this pin and GND, with a typical capacitance of 22µF. |
| 4 | FB | input | Feedback voltage input connected to the midpoint of the external feedback divider; the device regulates FB to the feedback threshold, typically 0.765V/0.8V. |
| 5 | EN | input | Enable control input; logic high enables the device, while floating or connecting to GND disables it. |
| 6 | BOOT | passive | Bootstrap capacitor connection node supplying the high-side gate driver; connect a 0.1µF ceramic capacitor between this pin and LX. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Richtek Tech |
| Package | TSOT-23-6 |
| Category | Power Management ICs |
| Pins | 6 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Input Voltage (absolute maximum) |  | -0.3 |  | 20 | V |  | 7 |
| Switch Node Voltage, LX (max is VIN + 0.3V) | LX | -0.3 |  |  | V |  | 7 |
| Switch Node Voltage, LX (<50ns) | LX | -5 |  | 25 | V | < 50ns | 7 |
| BOOT to LX Voltage | VBOOT - VLX | -0.3 |  | 6 | V |  | 7 |
| Other Pins Voltage |  | -0.3 |  | 6 | V |  | 7 |
| Power Dissipation, PD | PD |  |  | 1.667 | W | TA = 25°C, TSOT-23-6 (FC) | 7 |
| Lead Temperature (soldering) |  |  |  | 260 | °C | 10 sec. soldering | 7 |
| Junction Temperature | TJ |  |  | 150 | °C |  | 7 |
| Storage Temperature Range | TSTG | -65 |  | 150 | °C |  | 7 |
| ESD Susceptibility HBM |  |  |  | 2 | kV | Human Body Model | 7 |
| Supply Input Voltage (recommended) |  | 4.5 |  | 18 | V |  | 7 |
| Ambient Temperature Range | TA | -40 |  | 85 | °C |  | 7 |
| Junction Temperature Range | TJ | -40 |  | 125 | °C |  | 7 |
| VIN Supply Input Operating Voltage | VIN | 4.5 |  | 18 | V |  | 7 |
| Under-Voltage Lockout Threshold (RT6214A/BHGJ6F) | VUVLO | 3.6 | 3.9 | 4.2 | V | RT6214A/BHGJ6F | 7 |
| Supply Current (Shutdown) | ISHDN |  |  | 5 | μA | VEN = 0V | 7 |
| Enable Voltage Threshold (VEN rising, RT6214A/BHGJ6F) | VEN_R | 1.38 | 1.5 | 1.62 | V | VEN rising, RT6214A/BHGJ6F | 8 |
| Feedback Reference Voltage (RT6214A/BHGJ6F) | VREF | 0.788 | 0.8 | 0.812 | V | 4.5V ≤ VIN ≤ 18V, RT6214A/BHGJ6F | 8 |
| Current Limit (valley current) | ILIM | 4 | 4.5 |  | A | Valley current | 8 |
| Switching Frequency | fSW | 420 | 500 |  | kHz |  | 8 |
| UVP Trip Threshold |  | 45 | 50 | 55 | % | UVP detect | 8 |
| Supply Current (Quiescent) | IQ |  | 0.5 |  | mA | VEN = 2V, VFB = 0.85V | 7 |
| Under-Voltage Lockout Threshold Hysteresis | VUVLO |  | 340 |  | mV |  | 7 |
| Soft-Start Time | tSS |  | 1000 |  | μs | RT6214A/BHGJ6F, RT6214A/BHRGJ6F | 8 |
| Enable Voltage Hysteresis |  |  | 0.18 |  | V |  | 8 |
| High-Side On-Resistance | RDS(ON)_H |  | 100 |  | mΩ | VBOOT - VLX = 4.8V | 8 |
| Low-Side On-Resistance | RDS(ON)_L |  | 50 |  | mΩ |  | 8 |
| Minimum On-Time | tON_MIN |  | 60 |  | ns |  | 8 |
| Minimum Off-Time | tOFF_MIN |  | 240 |  | ns |  | 8 |
| UVP Hysteresis |  |  | 10 |  | % |  | 8 |
| Thermal Shutdown Threshold | TSD |  | 150 |  | °C |  | 8 |
| Thermal Shutdown Hysteresis | TSD |  | 20 |  | °C |  | 8 |
| Package Thermal Resistance, junction-to-ambient (TSOT-23-6 (FC)) | θJA |  | 60 |  | °C/W | JEDEC 51-7 four-layer test board | 7 |
| Package Thermal Resistance, junction-to-case (TSOT-23-6 (FC)) | θJC |  | 8 |  | °C/W |  | 7 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | 1 1 GND Power ground. This pin, connected to analog ground, must be soldered to a large PCB copper area for maximum power dissipation. | 3 |

## CAD (KiCad official)

- Symbol: `RT6214BHGJ6F`
- Footprint: `Package_TO_SOT_SMD:TSOT-23-6`
- 3D model: TSOT-23-6 (KiCad packages3D, STEP)

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Richtek Tech datasheet](docs/rt6214bhgj6f-datasheet.pdf) (23 pp, sha256 `eb6065cd86c2b86b`, retrieved 2026-11-05, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/rt6214bhgj6f-datasheet.pdf)