component
RT6214BHGJ6F
Public Made by Adomby adom
Richtek Tech DC-DC Converters, TSOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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RT6214BHGJ6F
Richtek Tech · DC-DC Converters · TSOT-23-6
RT6214BHGJ6F from Richtek Tech, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Power ground, connected to analog ground, must be soldered to a large PCB copper area for maximum power dissipation. |
| 2 | LX | output | Switch node between the internal switch and the synchronous rectifier, connected to the inductor and bootstrap capacitor. |
| 3 | VIN | power_in | Power input with an input voltage range of 4.5V to 18V; connect a suitable input capacitor between this pin and GND, with a typical capacitance of 22µF. |
| 4 | FB | input | Feedback voltage input connected to the midpoint of the external feedback divider; the device regulates FB to the feedback threshold, typically 0.765V/0.8V. |
| 5 | EN | input | Enable control input; logic high enables the device, while floating or connecting to GND disables it. |
| 6 | BOOT | passive | Bootstrap capacitor connection node supplying the high-side gate driver; connect a 0.1µF ceramic capacitor between this pin and LX. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Richtek Tech |
| Package | TSOT-23-6 |
| Category | Power Management ICs |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Input Voltage (absolute maximum) | -0.3 | 20 | V | 7 | |||
| Switch Node Voltage, LX (max is VIN + 0.3V) | LX | -0.3 | V | 7 | |||
| Switch Node Voltage, LX (<50ns) | LX | -5 | 25 | V | < 50ns | 7 | |
| BOOT to LX Voltage | VBOOT - VLX | -0.3 | 6 | V | 7 | ||
| Other Pins Voltage | -0.3 | 6 | V | 7 | |||
| Power Dissipation, PD | PD | 1.667 | W | TA = 25°C, TSOT-23-6 (FC) | 7 | ||
| Lead Temperature (soldering) | 260 | °C | 10 sec. soldering | 7 | |||
| Junction Temperature | TJ | 150 | °C | 7 | |||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 7 | ||
| ESD Susceptibility HBM | 2 | kV | Human Body Model | 7 | |||
| Supply Input Voltage (recommended) | 4.5 | 18 | V | 7 | |||
| Ambient Temperature Range | TA | -40 | 85 | °C | 7 | ||
| Junction Temperature Range | TJ | -40 | 125 | °C | 7 | ||
| VIN Supply Input Operating Voltage | VIN | 4.5 | 18 | V | 7 | ||
| Under-Voltage Lockout Threshold (RT6214A/BHGJ6F) | VUVLO | 3.6 | 3.9 | 4.2 | V | RT6214A/BHGJ6F | 7 |
| Supply Current (Shutdown) | ISHDN | 5 | μA | VEN = 0V | 7 | ||
| Enable Voltage Threshold (VEN rising, RT6214A/BHGJ6F) | VEN_R | 1.38 | 1.5 | 1.62 | V | VEN rising, RT6214A/BHGJ6F | 8 |
| Feedback Reference Voltage (RT6214A/BHGJ6F) | VREF | 0.788 | 0.8 | 0.812 | V | 4.5V ≤ VIN ≤ 18V, RT6214A/BHGJ6F | 8 |
| Current Limit (valley current) | ILIM | 4 | 4.5 | A | Valley current | 8 | |
| Switching Frequency | fSW | 420 | 500 | kHz | 8 | ||
| UVP Trip Threshold | 45 | 50 | 55 | % | UVP detect | 8 | |
| Supply Current (Quiescent) | IQ | 0.5 | mA | VEN = 2V, VFB = 0.85V | 7 | ||
| Under-Voltage Lockout Threshold Hysteresis | VUVLO | 340 | mV | 7 | |||
| Soft-Start Time | tSS | 1000 | μs | RT6214A/BHGJ6F, RT6214A/BHRGJ6F | 8 | ||
| Enable Voltage Hysteresis | 0.18 | V | 8 | ||||
| High-Side On-Resistance | RDS(ON)_H | 100 | mΩ | VBOOT - VLX = 4.8V | 8 | ||
| Low-Side On-Resistance | RDS(ON)_L | 50 | mΩ | 8 | |||
| Minimum On-Time | tON_MIN | 60 | ns | 8 | |||
| Minimum Off-Time | tOFF_MIN | 240 | ns | 8 | |||
| UVP Hysteresis | 10 | % | 8 | ||||
| Thermal Shutdown Threshold | TSD | 150 | °C | 8 | |||
| Thermal Shutdown Hysteresis | TSD | 20 | °C | 8 | |||
| Package Thermal Resistance, junction-to-ambient (TSOT-23-6 (FC)) | θJA | 60 | °C/W | JEDEC 51-7 four-layer test board | 7 | ||
| Package Thermal Resistance, junction-to-case (TSOT-23-6 (FC)) | θJC | 8 | °C/W | 7 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 1 1 GND Power ground. This pin, connected to analog ground, must be soldered to a large PCB copper area for maximum power dissipation. | 3 |
CAD (KiCad official)
- Symbol:
RT6214BHGJ6F - Footprint:
Package_TO_SOT_SMD:TSOT-23-6 - 3D model: TSOT-23-6 (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Richtek Tech datasheet (23 pp, sha256
eb6065cd86c2b86b, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).