component
RSF45N50W
Public Made by Adomby adom
REASUNOS MOSFETs, TO-247-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 16d ago |
| viewers | 16d ago |
| package.json | 16d ago |
| page.json | 16d ago |
| README.md | 16d ago |
| rsf45n50w-etched.glb | 16d ago |
| rsf45n50w-etched.step | 16d ago |
| rsf45n50w-hero.glb | 16d ago |
| rsf45n50w-hero.overlay.json | 16d ago |
| rsf45n50w.glb | 16d ago |
| rsf45n50w.kicad_mod | 16d ago |
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| rsf45n50w.lbr | 16d ago |
| rsf45n50w.step | 16d ago |
RSF45N50W
REASUNOS · MOSFETs · TO-247-3
RSF45N50W from REASUNOS, in a TO-247-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS limited to ±30 V absolute maximum and a threshold of 3 V min to 4 V max at ID=250µA. |
| 2 | D | passive | Drain, also connected to the mounting tab; rated for 500 V VDSS and 45 A continuous at TC=25℃ (180 A pulsed). |
| 3 | S | passive | Source; carries up to 45 A continuous through the MOSFET and its integral body diode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | REASUNOS |
| Package | TO-247-3 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Voltage | VDSS | 500 | V | 1 | |||
| Continuous Drain Current | ID | 45 | A | TC=25℃ | 1 | ||
| Pulsed Drain Current | IDM | 180 | A | Note*1 repetitive rating, pulse width limited by max junction temperature | 1 | ||
| Power Dissipation | PD | 250 | W | 1 | |||
| Gate-to-Source Voltage | VGS | -30 | 30 | V | 1 | ||
| Single Pulse Avalanche Energy | EAS | 2580 | mJ | L = 10mH, VDD = 50V, RG = 25 Ω | 1 | ||
| Maximum Temperature for Soldering Leads | TL | 300 | ℃ | Leads at 0.063in(1.6mm) from case for 10 seconds | 1 | ||
| Maximum Temperature for Soldering Package Body | TPKG | 260 | ℃ | Package body for 10 seconds | 1 | ||
| Operating Junction and Storage Temperature Range | TJ and TSTG | -55 | 150 | ℃ | 1 | ||
| Drain-to-Source Breakdown Voltage | BVDSS | 500 | V | VGS=0V, ID=250µA | 2 | ||
| Drain-to-Source Leakage Current | IDSS | 1 | µA | VDS=500V, VGS=0 | 2 | ||
| Gate-to-Source Forward Leakage Current | IGSS | 100 | nA | VGS=30V, VDS=0V | 2 | ||
| Gate-to-Source Reverse Leakage Current | IGSS | -100 | nA | VGS=-30V, VDS=0 | 2 | ||
| Static Drain-to-Source On-Resistance | RDS(on) | 0.105 | 0.12 | Ω | VGS=10V, ID=22.5A | 2 | |
| Gate Threshold Voltage | VGS(TH) | 3 | 4 | V | VGS=VDS, ID=250µA | 2 | |
| Continuous Source Current | IS | 45 | A | 3 | |||
| Maximum Pulsed Current | ISM | 180 | A | 3 | |||
| Diode Forward Voltage | VSD | 1.4 | V | IS=22.5A, VGS=0V | 3 | ||
| Junction-to-Case Thermal Resistance | RθJC | 0.5 | ℃/W | Drain lead soldered to water cooled heatsink, PD adjusted for a peak junction temperature of +150℃ | 2 | ||
| Junction-to-Ambient Thermal Resistance | RθJA | 40 | ℃/W | 1 cubic foot chamber, free air | 2 |
CAD (KiCad official)
- Symbol:
RSF45N50W - Footprint:
Package_TO_SOT_THT:TO-247-3_Vertical - 3D model: TO-247-3 (KiCad packages3D, STEP)
- 3D model files:
rsf45n50w-etched.step/rsf45n50w-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rsf45n50w.step/rsf45n50w.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: REASUNOS datasheet (8 pp, sha256
a36122bd603db6ef, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).