component
RS60N50D
Public Made by Adomby adom
REASUNOS MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownRS60N50D
REASUNOS · MOSFETs · TO-252
RS60N50D from REASUNOS, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; drive with VGS limited to ±20 V, threshold 1.2 V min to 2.5 V max at ID=250 µA, RDS(on) specified at VGS=10 V and 4.5 V. |
| 2 | D | passive | Drain (center lead and mounting tab); VDSS 60 V, continuous 50 A at TC=25℃, pulsed 200 A. |
| 3 | S | passive | Source; continuous source current 50 A, pulsed 200 A through the integral body diode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | REASUNOS |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Voltage | VDSS | 60 | V | 1 | |||
| Continuous Drain Current | ID | 50 | A | TC=25℃ | 1 | ||
| Continuous Drain Current | ID | 35 | A | TC=100℃ | 1 | ||
| Pulsed Drain Current | IDM | 200 | A | 1 | |||
| Power Dissipation | PD | 89 | W | 1 | |||
| Gate-to-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Single Pulse Avalanche Energy | EAS | 85 | mJ | L = 0.5mH,VDD = 30V, VG = 10V, Tj = 25℃ | 1 | ||
| Maximum Temperature for Soldering, leads at 0.063in (1.6mm) from case for 10 seconds | TL | 300 | ℃ | 1 | |||
| Maximum Temperature for Soldering, package body for 10 seconds | TPKG | 260 | ℃ | 1 | |||
| Operating Junction and Storage Temperature Range | TJ and TSTG | -55 | 150 | ℃ | 1 | ||
| Junction-to-Case Thermal Resistance | RθJC | 1.8 | ℃/W | Drain lead soldered to water cooled heatsink, PD adjusted for a peak junction temperature of +150℃ | 2 | ||
| Junction-to-Ambient Thermal Resistance | RθJA | 60 | ℃/W | 1 cubic foot chamber, free air | 2 | ||
| Drain-to-Source Breakdown Voltage | BVDSS | 60 | V | VGS=0V, ID=250µA | 2 | ||
| Drain-to-Source Leakage Current | IDSS | 1 | µA | VDS=60V, VGS=0V | 2 | ||
| Gate-to-Source Forward Leakage Current | IGSS | 100 | nA | VGS=20V, VDS=0V | 2 | ||
| Gate-to-Source Reverse Leakage Current | IGSS | -100 | nA | VGS=-20V, VDS=0 | 2 | ||
| Static Drain-to-Source On-Resistance | RDS(on) | 14 | 20 | mΩ | VGS=10V, ID=30A | 2 | |
| Static Drain-to-Source On-Resistance | RDS(on) | 17 | 25 | mΩ | VGS=4.5V, ID=30A | 2 | |
| Gate Threshold Voltage | VGS(TH) | 1.2 | 1.6 | 2.5 | V | VGS=VDS, ID=250µA | 2 |
| Continuous Source Current (integral pn-diode in MOSFET) | IS | 50 | A | 3 | |||
| Maximum Pulsed Current | ISM | 200 | A | 3 | |||
| Diode Forward Voltage | VSD | 1.2 | V | IS=20A, VGS=0V | 3 | ||
| Turn-on Delay Time | td(ON) | 7.4 | nS | VDS=30V, RL=6.7Ω, RG=3Ω, VGS=10V | 2 | ||
| Rise Time | trise | 5.1 | nS | VDS=30V, RL=6.7Ω, RG=3Ω, VGS=10V | 2 | ||
| Turn-OFF Delay Time | td(OFF) | 28.2 | nS | VDS=30V, RL=6.7Ω, RG=3Ω, VGS=10V | 2 | ||
| Fall Time | tfall | 5.5 | nS | VDS=30V, RL=6.7Ω, RG=3Ω, VGS=10V | 2 | ||
| Input Capacitance | Ciss | 2050 | pF | VGS=0V, VDS=30V, f=1.0MHz | 3 | ||
| Output Capacitance | Coss | 158 | pF | VGS=0V, VDS=30V, f=1.0MHz | 3 | ||
| Reverse Transfer Capacitance | Crss | 120 | pF | VGS=0V, VDS=30V, f=1.0MHz | 3 | ||
| Total Gate Charge | Qg | 50 | nC | VDS=30V, ID=20A, VGS=10V | 3 | ||
| Gate-to-Source Charge | Qgs | 6 | nC | VDS=30V, ID=20A, VGS=10V | 3 | ||
| Gate-to-Drain (Miller) Charge | Qgd | 15 | nC | VDS=30V, ID=20A, VGS=10V | 3 | ||
| Reverse Recovery Time | trr | 28 | nS | VGS=0V, IS=20A, di/dt=100A/µs | 3 | ||
| Reverse Recovery Charge | Qrr | 40 | nC | 3 |
CAD (KiCad official)
- Symbol:
RS60N50D - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
rs60n50d-etched.step/rs60n50d-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs60n50d.step/rs60n50d.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: REASUNOS datasheet (9 pp, sha256
6db8f5f4f5b6672f, retrieved 2026-11-05, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).