component
RS100N120S
Public Made by Adomby adom
REASUNOS MOSFETs, TO-263. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
RS100N120S
REASUNOS · MOSFETs · TO-263
RS100N120S from REASUNOS, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate, with a gate-to-source voltage rating of ±20 V and a 2 to 4 V threshold (VGS(TH)) at ID=250 µA. |
| 2 | D | passive | Drain, which is also the exposed tab, rated for 100 V drain-to-source and 120 A continuous at TC=25℃ (480 A pulsed). |
| 3 | S | passive | Source, the current return terminal of the N-channel MOSFET, with a continuous source current (IS) of 120 A through the integral body diode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | REASUNOS |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Voltage | VDSS | 100 | V | 1 | |||
| Continuous Drain Current | ID | 120 | A | TC=25℃ | 1 | ||
| Continuous Drain Current | ID | 80 | A | TC=100℃ | 1 | ||
| Pulsed Drain Current | IDM | 480 | A | 1 | |||
| Power Dissipation | PD | 178 | W | 1 | |||
| Gate-to-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Single Pulse Avalanche Energy | EAS | 486 | mJ | L = 3.0mH, VDS = 50V, RG = 25Ω, Tj = 25℃ | 1 | ||
| Maximum Temperature for Soldering, leads at 0.063in (1.6mm) from case for 10 seconds | TL | 300 | ℃ | Leads at 0.063in (1.6mm) from case for 10 seconds | 1 | ||
| Maximum Temperature for Soldering, package body for 10 seconds | TPKG | 260 | ℃ | Package body for 10 seconds | 1 | ||
| Operating Junction and Storage Temperature Range | TJ and TSTG | -55 | 150 | ℃ | 1 | ||
| Junction-to-Case Thermal Resistance | RθJC | 0.7 | ℃/W | Drain lead soldered to water cooled heatsink, PD adjusted for a peak junction temperature of +150℃ | 2 | ||
| Junction-to-Ambient Thermal Resistance | RθJA | 46 | ℃/W | 1 cubic foot chamber, free air | 2 | ||
| Drain-to-Source Breakdown Voltage | BVDSS | 100 | V | VGS=0V, ID=250µA | 2 | ||
| Drain-to-Source Leakage Current | IDSS | 1 | µA | VDS=80V, VGS=0V | 2 | ||
| Gate-to-Source Forward Leakage Current | IGSS | 100 | nA | VGS=20V, VDS=0V | 2 | ||
| Gate-to-Source Reverse Leakage Current | IGSS | -100 | nA | VGS=-20V, VDS=0V | 2 | ||
| Static Drain-to-Source On-Resistance | RDS(on) | 4.3 | 5.3 | mΩ | VGS=10V, ID=20A | 2 | |
| Static Drain-to-Source On-Resistance | RDS(on) | 5.5 | 7.5 | mΩ | VGS=4.5V, ID=10A | 2 | |
| Gate Threshold Voltage | VGS(TH) | 2 | 3 | 4 | V | VGS=VDS, ID=250µA | 2 |
| Continuous Source Current (integral pn-diode in MOSFET) | IS | 120 | A | Integral pn-diode in MOSFET | 3 | ||
| Maximum Pulsed Current | ISM | 480 | A | 3 | |||
| Diode Forward Voltage | VSD | 1 | V | IS=20A, VGS=0V | 3 |
CAD (KiCad official)
- Symbol:
RS100N120S - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files:
rs100n120s-etched.step/rs100n120s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs100n120s.step/rs100n120s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: REASUNOS datasheet (9 pp, sha256
29d578f76143d51b, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# RS100N120S
**REASUNOS** · MOSFETs · TO-263
RS100N120S from REASUNOS, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate, with a gate-to-source voltage rating of ±20 V and a 2 to 4 V threshold (VGS(TH)) at ID=250 µA. |
| 2 | D | passive | Drain, which is also the exposed tab, rated for 100 V drain-to-source and 120 A continuous at TC=25℃ (480 A pulsed). |
| 3 | S | passive | Source, the current return terminal of the N-channel MOSFET, with a continuous source current (IS) of 120 A through the integral body diode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | REASUNOS |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Voltage | VDSS | | | 100 | V | | 1 |
| Continuous Drain Current | ID | | | 120 | A | TC=25℃ | 1 |
| Continuous Drain Current | ID | | | 80 | A | TC=100℃ | 1 |
| Pulsed Drain Current | IDM | | | 480 | A | | 1 |
| Power Dissipation | PD | | | 178 | W | | 1 |
| Gate-to-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Single Pulse Avalanche Energy | EAS | | | 486 | mJ | L = 3.0mH, VDS = 50V, RG = 25Ω, Tj = 25℃ | 1 |
| Maximum Temperature for Soldering, leads at 0.063in (1.6mm) from case for 10 seconds | TL | | | 300 | ℃ | Leads at 0.063in (1.6mm) from case for 10 seconds | 1 |
| Maximum Temperature for Soldering, package body for 10 seconds | TPKG | | | 260 | ℃ | Package body for 10 seconds | 1 |
| Operating Junction and Storage Temperature Range | TJ and TSTG | -55 | | 150 | ℃ | | 1 |
| Junction-to-Case Thermal Resistance | RθJC | | | 0.7 | ℃/W | Drain lead soldered to water cooled heatsink, PD adjusted for a peak junction temperature of +150℃ | 2 |
| Junction-to-Ambient Thermal Resistance | RθJA | | | 46 | ℃/W | 1 cubic foot chamber, free air | 2 |
| Drain-to-Source Breakdown Voltage | BVDSS | 100 | | | V | VGS=0V, ID=250µA | 2 |
| Drain-to-Source Leakage Current | IDSS | | | 1 | µA | VDS=80V, VGS=0V | 2 |
| Gate-to-Source Forward Leakage Current | IGSS | | | 100 | nA | VGS=20V, VDS=0V | 2 |
| Gate-to-Source Reverse Leakage Current | IGSS | | | -100 | nA | VGS=-20V, VDS=0V | 2 |
| Static Drain-to-Source On-Resistance | RDS(on) | | 4.3 | 5.3 | mΩ | VGS=10V, ID=20A | 2 |
| Static Drain-to-Source On-Resistance | RDS(on) | | 5.5 | 7.5 | mΩ | VGS=4.5V, ID=10A | 2 |
| Gate Threshold Voltage | VGS(TH) | 2 | 3 | 4 | V | VGS=VDS, ID=250µA | 2 |
| Continuous Source Current (integral pn-diode in MOSFET) | IS | | | 120 | A | Integral pn-diode in MOSFET | 3 |
| Maximum Pulsed Current | ISM | | | 480 | A | | 3 |
| Diode Forward Voltage | VSD | | | 1 | V | IS=20A, VGS=0V | 3 |
## CAD (KiCad official)
- Symbol: `RS100N120S`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files: `rs100n120s-etched.step` / `rs100n120s-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rs100n120s.step` / `rs100n120s.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [REASUNOS datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590921091294707712) (9 pp, sha256 `29d578f76143d51b`, retrieved 2026-10-20, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/rs100n120s-datasheet.pdf)