# RFP50N06

**onsemi** · MOSFETs · TO-220AB

RFP50N06 from onsemi, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; the gate-to-source voltage is rated at ±20 V and the threshold VGS(TH) is 2 V to 4 V at ID = 250 µA. |
| 2 | D | passive | Drain, connected to the flange; the drain-to-source voltage is rated at 60 V and the continuous drain current at 50 A. |
| 3 | S | passive | Source; this is the reference terminal for the gate drive and the anode of the body diode (VSD max 1.5 V at ISD = 50 A). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TO-220AB |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain to Source Breakdown Voltage | BVDSS | 60 |  |  | V | ID = 250µA, VGS = 0V (Figure 11) | 3 |
| Gate to Source Threshold Voltage | VGS(TH) | 2 |  | 4 | V | VGS = VDS, ID = 250µA (Figure 10) | 3 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | µA | VDS = 60V, VGS = 0V, TC = 25oC | 3 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 50 | µA | VDS = 60V, VGS = 0V, TC = 150oC | 3 |
| Gate to Source Leakage Current | IGSS | -100 |  | 100 | nA | VGS = ±20V | 3 |
| Drain to Source On Resistance | rDS(ON) |  |  | 0.022 | Ω | ID = 50A, VGS = 10V (Figures 9) | 3 |
| Turn-On Time | tON |  |  | 95 | ns | VDD = 30V, ID = 50A, RL = 0.6Ω, VGS = 10V, RGS = 3.6Ω (Figure 13) | 3 |
| Turn-Off Time | tOFF |  |  | 75 | ns | VDD = 30V, ID = 50A, RL = 0.6Ω, VGS = 10V, RGS = 3.6Ω (Figure 13) | 3 |
| Total Gate Charge | Qg(TOT) |  | 125 | 150 | nC | VGS = 0 to 20V, VDD = 48V, ID = 50A, RL = 0.96Ω, Ig(REF) = 1.45mA (Figure 13) | 3 |
| Gate Charge at 10V | Qg(10) |  | 67 | 80 | nC | VGS = 0 to 10V | 3 |
| Threshold Gate Charge | Qg(TH) |  | 3.7 | 4.5 | nC | VGS = 0 to 2V | 3 |
| Thermal Resistance Junction to Case | RθJC |  |  | 1.14 | oC/W | (Figure 3) | 3 |
| Thermal Resistance Junction to Ambient | RθJA |  |  | 62 | oC/W | TO-220 | 3 |
| Source to Drain Diode Voltage | VSD |  |  | 1.5 | V | ISD = 50A | 3 |
| Reverse Recovery Time | trr |  |  | 125 | ns | ISD = 50A, dISD/dt = 100A/µs | 3 |
| Drain to Source Voltage | VDSS |  |  | 60 | V | TJ = 25oC to 150oC (Note 1) | 3 |
| Drain to Gate Voltage | VDGR |  |  | 60 | V | RGS = 20kΩ, TJ = 25oC to 150oC (Note 1) | 3 |
| Gate to Source Voltage | VGS | -20 |  | 20 | V | TC = 25oC | 3 |
| Continuous Drain Current | ID |  |  | 50 | A | TC = 25oC (Figure 2) | 3 |
| Power Dissipation | PD |  |  | 131 | W | TC = 25oC | 3 |
| Linear Derating Factor |  |  |  | 0.877 | W/oC | TC = 25oC | 3 |
| Operating and Storage Temperature | TJ, TSTG | -55 |  | 175 | oC |  | 3 |
| Maximum Temperature for Soldering, Leads | TL |  |  | 300 | oC | Leads at 0.063in (1.6mm) from Case for 10s | 3 |
| Maximum Temperature for Soldering, Package Body | Tpkg |  |  | 260 | oC | Package Body for 10s, see Techbrief 334 | 3 |
| Turn-On Delay Time | td(ON) |  | 12 |  | ns | VDD = 30V, ID = 50A, RL = 0.6Ω, VGS = 10V, RGS = 3.6Ω (Figure 13) | 3 |
| Rise Time | tr |  | 55 |  | ns | VDD = 30V, ID = 50A, RL = 0.6Ω, VGS = 10V, RGS = 3.6Ω (Figure 13) | 3 |
| Turn-Off Delay Time | td(OFF) |  | 37 |  | ns | VDD = 30V, ID = 50A, RL = 0.6Ω, VGS = 10V, RGS = 3.6Ω (Figure 13) | 3 |
| Fall Time | tf |  | 13 |  | ns | VDD = 30V, ID = 50A, RL = 0.6Ω, VGS = 10V, RGS = 3.6Ω (Figure 13) | 3 |
| Input Capacitance | CISS |  | 2020 |  | pF | VDS = 25V, VGS = 0V, f = 1MHz (Figure 12) | 3 |
| Output Capacitance | COSS |  | 600 |  | pF | VDS = 25V, VGS = 0V, f = 1MHz (Figure 12) | 3 |
| Reverse Transfer Capacitance | CRSS |  | 200 |  | pF | VDS = 25V, VGS = 0V, f = 1MHz (Figure 12) | 3 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | Abs |  | Package Body for 10s, see Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to t | 3 |

## CAD (KiCad official)

- Symbol: `RFP50N06`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files: `rfp50n06-etched.step` / `rfp50n06-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rfp50n06.step` / `rfp50n06.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/rfp50n06-d.pdf) (10 pp, sha256 `11c450035993b9bc`, retrieved 2026-10-23, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/rfp50n06-datasheet.pdf)