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RD3P175SNFRATL

ROHM Semicon · MOSFETs · TO-252

RD3P175SNFRATL from ROHM Semicon, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal with ESD protection diode to source; gate-source voltage limited to ±20 V and threshold 1.0 to 2.5 V at VDS = 10 V, ID = 1 mA.
2 Drain passive Drain terminal (also the exposed tab) rated for VDSS of 100 V and continuous drain current of ±17.5 A.
3 Source passive Source terminal connected to the body diode anode, with continuous forward current of 17.5 A and pulsed 35 A.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source voltage VDSS 100 V Ta = 25°C 1
Continuous drain current ID -17.5 17.5 A Ta = 25°C, limited only by maximum temperature allowed 1
Pulsed drain current IDP -35 35 A Pw≦10μs, Duty cycle≦1% 1
Gate-Source voltage VGSS -20 20 V Ta = 25°C 1
Power dissipation PD 20 W TC=25°C 1
Junction temperature Tj 150 ℃ 1
Operating junction and storage temperature range Tstg -55 150 ℃ 1
Thermal resistance, junction-case RthJC 6.25 ℃/W TC=25°C 2
Drain-Source breakdown voltage V(BR)DSS 100 V VGS = 0V, ID = 1mA 2
Breakdown voltage temperature coefficient ΔV(BR)DSS/ΔTj 116.9 mV/℃ ID = 1mA referenced to 25℃ 2
Zero gate voltage drain current IDSS 1 μA VDS = 100V, VGS = 0V 2
Gate-Source leakage current IGSS -10 10 μA VGS = ±20V, VDS = 0V 2
Gate threshold voltage VGS(th) 1 2.5 V VDS = 10V, ID = 1mA 2
Gate threshold voltage temperature coefficient ΔVGS(th)/ΔTj -3.6 mV/℃ ID = 1mA referenced to 25℃ 2
Static drain-source on-state resistance RDS(on) 75 105 mΩ VGS = 10V, ID = 8.8A, pulsed 2
Static drain-source on-state resistance RDS(on) 80 112 mΩ VGS = 4.5V, ID = 8.8A, pulsed 2
Static drain-source on-state resistance RDS(on) 85 119 mΩ VGS = 4V, ID = 8.8A, pulsed 2
Gate resistance RG 6 Ω f = 1MHz, open drain 2
Forward transfer admittance /Yfs/ 5 S VDS = 10V, ID = 8.8A, pulsed 2
Input capacitance Ciss 950 pF VGS = 0V, VDS = 25V, f = 1MHz 3
Output capacitance Coss 85 pF VGS = 0V, VDS = 25V, f = 1MHz 3
Reverse transfer capacitance Crss 55 pF VGS = 0V, VDS = 25V, f = 1MHz 3
Turn-on delay time td(on) 10 ns VDD ⋍ 50V, VGS = 10V, ID = 8.8A, RL ⋍ 5.7Ω, RG = 10Ω 3
Rise time tr 25 ns VDD ⋍ 50V, VGS = 10V, ID = 8.8A, RL ⋍ 5.7Ω, RG = 10Ω 3
Turn-off delay time td(off) 60 ns VDD ⋍ 50V, VGS = 10V, ID = 8.8A, RL ⋍ 5.7Ω, RG = 10Ω 3
Fall time tf 50 ns VDD ⋍ 50V, VGS = 10V, ID = 8.8A, RL ⋍ 5.7Ω, RG = 10Ω 3
Total gate charge Qg 24 nC VDD ⋍ 50V, ID = 17.5A, VGS = 10V 3
Gate-Source charge Qgs 3 nC VDD ⋍ 50V, ID = 17.5A, VGS = 10V 3
Gate-Drain charge Qgd 6 nC VDD ⋍ 50V, ID = 17.5A, VGS = 10V 3
Body diode continuous forward current IS 17.5 A Ta = 25℃ 3
Body diode pulse forward current ISP 35 A Pw≦10μs, Duty cycle≦1% 3
Body diode forward voltage VSD 1.5 V VGS = 0V, IS = 17.5A, pulsed 3

CAD (KiCad official)

  • Symbol: RD3P175SNFRATL
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: rd3p175snfratl-etched.step / rd3p175snfratl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rd3p175snfratl.step / rd3p175snfratl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (14 pp, sha256 53825f8668d39033, retrieved 2026-10-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF