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RB521S30YL

Nexperia · Schottky Barrier Diodes (SBD) · SOD-523

RB521S30YL from Nexperia, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky barrier rectifier, marked by the marking bar on the package; VR ≤ 30 V and IF(AV) ≤ 0.2 A.
2 A passive Anode of the Schottky barrier rectifier, with a forward voltage of 500 mV max at IF = 200 mA.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-523
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse voltage VR 30 V Tj = 25 °C 3
Average forward current IF(AV) 0.2 A δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 120 °C; FR4 PCB, 1 cm2 cathode pad 3
Non-repetitive peak forward current IFSM 1 A tp = 8.3 ms; half sine wave; JEDEC method; Tj(init) = 25 °C 3
Total power dissipation Ptot 275 mW Tamb ≤ 25 °C; FR4 PCB, standard footprint 3
Total power dissipation Ptot 420 mW Tamb ≤ 25 °C; FR4 PCB, 1 cm2 cathode pad 3
Total power dissipation Ptot 500 mW Tamb ≤ 25 °C; ceramic PCB Al2O3, standard footprint 3
Junction temperature Tj 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
Forward voltage VF 130 190 mV IF = 0.1 mA; pulsed tp ≤ 300 μs; δ ≤ 0.02 5
Forward voltage VF 190 250 mV IF = 1 mA; pulsed tp ≤ 300 μs; δ ≤ 0.02 5
Forward voltage VF 255 300 mV IF = 10 mA; pulsed tp ≤ 300 μs; δ ≤ 0.02 5
Forward voltage VF 355 410 mV IF = 100 mA; pulsed tp ≤ 300 μs; δ ≤ 0.02 5
Forward voltage VF 420 500 mV IF = 200 mA; pulsed tp ≤ 300 μs; δ ≤ 0.02 5
Reverse current IR 2.5 30 µA VR = 10 V 5
Diode capacitance Cd 20 25 pF VR = 1 V; f = 1 MHz 5
Thermal resistance junction to ambient Rth(j-a) 455 K/W in free air; FR4 PCB, standard footprint 3
Thermal resistance junction to ambient Rth(j-a) 300 K/W in free air; FR4 PCB, 1 cm2 cathode pad 3
Thermal resistance junction to ambient Rth(j-a) 250 K/W in free air; ceramic PCB Al2O3, standard footprint 3
Thermal resistance junction to solder point Rth(j-sp) 90 K/W soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: RB521S30YL
  • Footprint: Diode_SMD:D_SOD-523
  • 3D model: SOD-523 (KiCad packages3D, STEP)
  • 3D model files: rb521s30yl-etched.step / rb521s30yl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rb521s30yl.step / rb521s30yl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (11 pp, sha256 3cb7c09f082eb807, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF