component

RB098BM-60FHTL

Public Made by Adom

by adom

ROHM Semicon Schottky Diodes, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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RB098BM-60FHTL

ROHM Semicon · Schottky Diodes · TO-252

RB098BM-60FHTL from ROHM Semicon, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first Schottky diode (1), with VR 60 V and Io 6 A per device (Io/2 per diode).
2 K passive Common cathode of both Schottky diodes (2), also connected to the exposed tab, with VR 60 V.
3 A2 passive Anode of the second Schottky diode (3), with VR 60 V and Io 6 A per device (Io/2 per diode).

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package TO-252
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRM 60 V Duty≦0.5 1
Reverse voltage VR 60 V Reverse direct voltage 1
Average rectified forward current Io 6 A 60Hz half sin waveform, resistive load, Io/2 per diode, Tc=120℃ 1
Peak forward surge current IFSM 50 A 60Hz half sin waveform, non-repetitive, per diode, Ta=25℃ 1
Junction temperature Tj 150 ℃ 1
Storage temperature Tstg -55 150 ℃ 1
Forward voltage (per diode) VF 0.83 V IF=3A 2
Reverse current (per diode) IR 1.5 μA VR=60V 2
Thermal resistance, junction to case, per diode RθJC 4 ℃/W Transient dual interface measurement (TDIM) method 2
Thermal resistance, junction to case, per device RθJC 2.5 ℃/W Transient dual interface measurement (TDIM) method 2
Thermal resistance, junction to ambient RθJA 75 ℃/W Mounted on 50 x 50 x 1.6mm FR4 board, single-sided copper, 35μm thickness, reference footprint 2

CAD (KiCad official)

  • Symbol: RB098BM-60FHTL
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: rb098bm-60fhtl-etched.step / rb098bm-60fhtl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rb098bm-60fhtl.step / rb098bm-60fhtl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (9 pp, sha256 6c13a7c670d2e832, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF