component
RB098BM-60FHTL
Public Made by Adomby adom
ROHM Semicon Schottky Diodes, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownRB098BM-60FHTL
ROHM Semicon · Schottky Diodes · TO-252
RB098BM-60FHTL from ROHM Semicon, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode of the first Schottky diode (1), with VR 60 V and Io 6 A per device (Io/2 per diode). |
| 2 | K | passive | Common cathode of both Schottky diodes (2), also connected to the exposed tab, with VR 60 V. |
| 3 | A2 | passive | Anode of the second Schottky diode (3), with VR 60 V and Io 6 A per device (Io/2 per diode). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | TO-252 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRM | 60 | V | Duty≦0.5 | 1 | ||
| Reverse voltage | VR | 60 | V | Reverse direct voltage | 1 | ||
| Average rectified forward current | Io | 6 | A | 60Hz half sin waveform, resistive load, Io/2 per diode, Tc=120℃ | 1 | ||
| Peak forward surge current | IFSM | 50 | A | 60Hz half sin waveform, non-repetitive, per diode, Ta=25℃ | 1 | ||
| Junction temperature | Tj | 150 | ℃ | 1 | |||
| Storage temperature | Tstg | -55 | 150 | ℃ | 1 | ||
| Forward voltage (per diode) | VF | 0.83 | V | IF=3A | 2 | ||
| Reverse current (per diode) | IR | 1.5 | μA | VR=60V | 2 | ||
| Thermal resistance, junction to case, per diode | RθJC | 4 | ℃/W | Transient dual interface measurement (TDIM) method | 2 | ||
| Thermal resistance, junction to case, per device | RθJC | 2.5 | ℃/W | Transient dual interface measurement (TDIM) method | 2 | ||
| Thermal resistance, junction to ambient | RθJA | 75 | ℃/W | Mounted on 50 x 50 x 1.6mm FR4 board, single-sided copper, 35μm thickness, reference footprint | 2 |
CAD (KiCad official)
- Symbol:
RB098BM-60FHTL - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
rb098bm-60fhtl-etched.step/rb098bm-60fhtl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rb098bm-60fhtl.step/rb098bm-60fhtl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (9 pp, sha256
6c13a7c670d2e832, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).