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RAA2116054GP3#JA0

RENESAS ELECTRONICS AMERICA INC · Global Sourcing Parts · TSOT-23-6

RAA2116054GP3#JA0 from RENESAS ELECTRONICS AMERICA INC, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BST power_out The bootstrap circuit supply pin, connected to SW through a capacitor (16V X7R 0.1µF recommended) to provide bias for the integrated MOSFET gate driver.
2 GND power_in Ground connection pin; all voltages are referenced to this pin.
3 FB input Feedback pin connected to the inverting input of the error amplifier, driven from a resistor divider from VOUT to ground that sets the output voltage down to 0.8V.
4 EN input Enable pin, high-voltage tolerant (-0.3V to 65V absolute maximum) so it can be connected directly to VIN.
5 VIN power_in Input supply pin connected to the drain of the integrated MOSFET and to the internal linear regulator that biases the IC, to be connected to the input rail (4.5V to 60V operating, -0.3V to 65V absolute maximum).
6 SW output Phase node of the regulator, connected to the source of the integrated MOSFET and to the inductor, diode and boot capacitor (-0.7V to VIN + 0.3V absolute maximum).

Key specifications

Parameter Value
Manufacturer RENESAS ELECTRONICS AMERICA INC
Package TSOT-23-6
Category Global Sourcing Parts
Pins 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper ▪ If an aluminum electrolytic capacitor is used, place it as close as possible to the IC VIN pin. ▪ Keep the phase node copper area small for less parasitic capacitance but large enough to handle the 14

CAD (KiCad official)

  • Symbol: RAA2116054GP3#JA0
  • Footprint: Package_TO_SOT_SMD:TSOT-23-6
  • 3D model: TSOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: raa2116054gp3-ja0-etched.step / raa2116054gp3-ja0-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); raa2116054gp3-ja0.step / raa2116054gp3-ja0.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS ELECTRONICS AMERICA INC datasheet (17 pp, sha256 ae0a296e8f614cfd, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF