component
QS6M4TR
Public Made by Adomby adom
ROHM Semicon MOSFETs, SOT-23-6. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 12d ago |
| viewers | 12d ago |
| package.json | 12d ago |
| page.json | 12d ago |
| qs6m4tr-etched.glb | 12d ago |
| qs6m4tr-etched.step | 12d ago |
| qs6m4tr-hero.glb | 12d ago |
| qs6m4tr-hero.overlay.json | 12d ago |
| qs6m4tr.glb | 12d ago |
| qs6m4tr.kicad_mod | 12d ago |
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| qs6m4tr.lbr | 12d ago |
| qs6m4tr.step | 12d ago |
| README.md | 12d ago |
QS6M4TR
ROHM Semicon · MOSFETs · SOT-23-6
QS6M4TR from ROHM Semicon, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Tr1 (Nch) Source | passive | Source of the N-channel MOSFET Tr1; VDSS 30 V, ID ±1.5 A continuous, body diode IS 0.8 A. |
| 2 | Tr1 (Nch) Gate | input | Gate of the N-channel MOSFET Tr1; VGSS ±12 V, threshold 0.5 to 1.5 V, protected by an ESD protection diode. |
| 3 | Tr2 (Pch) Drain | passive | Drain of the P-channel MOSFET Tr2; VDSS −20 V, ID ±1.5 A continuous, ±6.0 A pulsed. |
| 4 | Tr2 (Pch) Source | passive | Source of the P-channel MOSFET Tr2; body diode source current −0.75 A continuous, −6.0 A pulsed. |
| 5 | Tr2 (Pch) Gate | input | Gate of the P-channel MOSFET Tr2; VGSS ±12 V, threshold −0.7 to −2.0 V, protected by an ESD protection diode. |
| 6 | Tr1 (Nch) Drain | passive | Drain of the N-channel MOSFET Tr1; VDSS 30 V, ID ±1.5 A continuous, ±6.0 A pulsed. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOT-23-6 |
| Category | Transistors/Thyristors |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage, Nch | VDSS | 30 | V | Ta=25°C | 1 | ||
| Drain-source voltage, Pch | VDSS | -20 | V | Ta=25°C | 1 | ||
| Gate-source voltage (Nch and Pch) | VGSS | -12 | 12 | V | Ta=25°C | 1 | |
| Drain current, continuous (Nch and Pch) | ID | -1.5 | 1.5 | A | Ta=25°C | 1 | |
| Drain current, pulsed (Nch and Pch) | IDP | -6 | 6 | A | Pw≤10µs, duty cycle≤1% | 1 | |
| Source current (body diode), continuous, Nch | IS | 0.8 | A | Ta=25°C | 1 | ||
| Source current (body diode), continuous, Pch | IS | -0.75 | A | Ta=25°C | 1 | ||
| Source current (body diode), pulsed, Nch | ISP | 6 | A | Pw≤10µs, duty cycle≤1% | 1 | ||
| Source current (body diode), pulsed, Pch | ISP | -6 | A | Pw≤10µs, duty cycle≤1% | 1 | ||
| Total power dissipation, TOTAL | PD | 1.25 | W | Mounted on a ceramic board | 1 | ||
| Total power dissipation, per ELEMENT | PD | 0.9 | W | Mounted on a ceramic board | 1 | ||
| Channel temperature | Tch | 150 | °C | 1 | |||
| Storage temperature | Tstg | -55 | 150 | °C | 1 | ||
| Thermal resistance, channel to ambient, TOTAL | Rth(ch-a) | 100 | °C/W | Channel to ambient, mounted on a ceramic board | 1 | ||
| Thermal resistance, channel to ambient, ELEMENT | Rth(ch-a) | 139 | °C/W | Channel to ambient, mounted on a ceramic board | 1 | ||
| Gate-source leakage, Nch | IGSS | -10 | 10 | µA | VGS=±12V / VDS=0V | 2 | |
| Drain-source breakdown voltage, Nch | V(BR)DSS | 30 | V | ID=1mA / VGS=0V | 2 | ||
| Zero gate voltage drain current, Nch | IDSS | 1 | µA | VDS=30V / VGS=0V | 2 | ||
| Gate threshold voltage, Nch | VGS(th) | 0.5 | 1.5 | V | VDS=10V / ID=1mA | 2 | |
| Static drain-source on-state resistance, Nch | RDS(on) | 170 | 230 | mΩ | ID=1.5A / VGS=4.5V | 2 | |
| Static drain-source on-state resistance, Nch | RDS(on) | 180 | 245 | mΩ | ID=1.5A / VGS=4.0V | 2 | |
| Static drain-source on-state resistance, Nch | RDS(on) | 260 | 360 | mΩ | ID=1.0A / VGS=2.5V | 2 | |
| Forward transfer admittance, Nch | Yfs | 1 | S | VDS=10V / ID=1.0A | 2 | ||
| Forward voltage (body diode), Nch | VSD | 1.2 | V | IS=3.2A / VGS=0V, pulsed | 2 | ||
| Gate-source leakage, Pch | IGSS | -10 | 10 | µA | VGS=±12V / VDS=0V | 3 | |
| Drain-source breakdown voltage, Pch | V(BR)DSS | -20 | V | ID=-1mA / VGS=0V | 3 | ||
| Zero gate voltage drain current, Pch | IDSS | -1 | µA | VDS=-20V / VGS=0V | 3 | ||
| Gate threshold voltage, Pch | VGS(th) | -0.7 | -2 | V | VDS=-10V / ID=-1mA | 3 | |
| Static drain-source on-state resistance, Pch | RDS(on) | 155 | 215 | mΩ | ID=-1.5A / VGS=-4.5V | 3 | |
| Static drain-source on-state resistance, Pch | RDS(on) | 170 | 235 | mΩ | ID=-1.5A / VGS=-4.0V | 3 | |
| Static drain-source on-state resistance, Pch | RDS(on) | 310 | 430 | mΩ | ID=-0.75A / VGS=-2.5V | 3 | |
| Forward transfer admittance, Pch | Yfs | 1 | S | VDS=-10V / ID=-0.75A | 3 | ||
| Forward voltage (body diode), Pch | VSD | -1.2 | V | IS=-0.75A / VGS=0V, pulsed | 3 |
CAD (KiCad official)
- Symbol:
QS6M4TR - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
qs6m4tr-etched.step/qs6m4tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);qs6m4tr.step/qs6m4tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (6 pp, sha256
bae897aabec34058, retrieved 2026-10-21, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).