# PMEG6020ER

**Shikues** · Schottky Barrier Diodes (SBD) · SOD-123FL

PMEG6020ER from Shikues, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shikues |
| Package | SOD-123FL |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM |  |  | 60 | V |  | 1 |
| Maximum RMS voltage | VRMS |  |  | 42 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 60 | V |  | 1 |
| Maximum Average Forward Rectified Current | IF(AV) |  |  | 2 | A |  | 1 |
| Peak Forward Surge Current, 8.3ms single half sine-wave | IFSM |  |  | 50 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC method) | 1 |
| Peak Forward Surge Current, 1.0ms single half sine-wave | IFSM |  |  | 100 | A | 1.0ms single half sine-wave superimposed on rated load (JEDEC method) | 1 |
| I2t Rating for fusing | I2t |  |  | 10.3 | A | 3ms≤t≤8.3ms | 1 |
| Max Instantaneous Forward Voltage | VF |  |  | 0.7 | V | at 2 A | 1 |
| Maximum DC Reverse Current | IR |  |  | 0.5 | mA | At Rated DC Reverse Voltage, TA=25℃ | 1 |
| Maximum DC Reverse Current | IR |  |  | 5 | mA | At Rated DC Reverse Voltage, TA=100℃ | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 125 | ℃ |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | ℃ |  | 1 |
| Typical Junction Capacitance | CJ |  | 70 |  | pF | Measured at 1 MHz and applied reverse voltage of 4 V D.C | 1 |
| Typical Thermal Resistance, junction to ambient | RθJA |  | 105 |  | ℃/W | P.C.B. mounted with 2.0" * 2.0" (5 * 5 mm) copper pad areas | 1 |
| Typical Thermal Resistance, junction to case | RθJC |  | 25 |  | ℃/W |  | 1 |
| Typical Thermal Resistance, junction to lead | RθJL |  | 32 |  | ℃/W |  | 1 |

## CAD (KiCad official)

- Symbol: `PMEG6020ER`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files: `pmeg6020er-etched.step` / `pmeg6020er-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `pmeg6020er.step` / `pmeg6020er.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shikues datasheet](docs/pmeg6020er-datasheet.pdf) (4 pp, sha256 `bf390f1dc8d03bee`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/pmeg6020er-datasheet.pdf)