component
PIC16F18326T-I
Public Made by Adomby adom
Microchip Tech Microcontroller Units (MCUs/MPUs/SOCs), TSSOP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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PIC16F18326T-I
Microchip Tech · Microcontroller Units (MCUs/MPUs/SOCs) · TSSOP-14
PIC16F18326T-I from Microchip Tech, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Positive supply; 2.3V to 5.5V for PIC16F18326 (1.8V to 3.6V for PIC16LF18326), decoupled with a 0.1 µF capacitor and must always be connected. |
| 2 | RA5 | bidirectional | General purpose I/O RA5 multiplexed with ANA5, T1CKI, SOSCIN/SOSCI, CLCIN3, CLKIN and OSC1 (crystal/resonator or external clock input). |
| 3 | RA4 | bidirectional | General purpose I/O RA4 multiplexed with ANA4, T1G, SOSCO, CLKOUT (FOSC/4 output) and OSC2 (crystal/resonator). |
| 4 | RA3/MCLR/VPP | input | Input-only RA3 that serves as Master Clear (with internal weak pull-up) and the VPP programming voltage input. |
| 5 | RC5 | bidirectional | General purpose I/O RC5 multiplexed with ANC5, MDCIN2, T3CKI, CCP1, SDI2, SDA2 (I2C) and RX/DT of the EUSART. |
| 6 | RC4 | bidirectional | General purpose I/O RC4 multiplexed with ANC4, T3G, SCK2, SCL2 (I2C) and CLCIN1. |
| 7 | RC3 | bidirectional | General purpose I/O RC3 multiplexed with ANC3, C1IN3-, C2IN3-, MDMIN, T5G, CCP2, SS1 and CLCIN0. |
| 8 | RC2 | bidirectional | General purpose I/O RC2 multiplexed with ANC2, C1IN2-, C2IN2- and MDCIN1. |
| 9 | RC1 | bidirectional | General purpose I/O RC1 multiplexed with ANC1, C1IN1-, C2IN1-, CCP4, SDI1, SDA1 (I2C) and CLCIN2. |
| 10 | RC0 | bidirectional | General purpose I/O RC0 multiplexed with ANC0, C2IN0+, T5CKI, SCK1 and SCL1 (I2C). |
| 11 | RA2 | bidirectional | General purpose I/O RA2 multiplexed with ANA2, VREF-, DAC1REF-, T0CKI, CCP3, CWG1IN, CWG2IN and INT external interrupt input. |
| 12 | RA1 | bidirectional | General purpose I/O RA1 multiplexed with ANA1, VREF+, C1IN0-, C2IN0-, DAC1REF+ and ICSPCLK/ICDCLK clock for programming and debug. |
| 13 | RA0 | bidirectional | General purpose I/O RA0 multiplexed with ANA0, C1IN0+, DAC1OUT, SS2 and ICSPDAT/ICDDAT data for programming and debug. |
| 14 | VSS | power_in | Ground reference; must always be connected. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | TSSOP-14 |
| Category | Single Chip Microcomputer/Microcontroller |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage on VDD pin (abs max) | VDD | -0.3 | 6.5 | V | PIC16F18326/18346, with respect to VSS | 411 | |
| Voltage on MCLR pin (abs max) | -0.3 | 9 | V | with respect to VSS | 411 | ||
| Voltage on all other pins (abs max) | -0.3 | V | -0.3V to (VDD + 0.3V) | 411 | |||
| Storage temperature | -65 | 150 | °C | 411 | |||
| Ambient temperature under bias | -40 | 125 | °C | 411 | |||
| Maximum current on VSS pin | 350 | mA | -40°C ≤ TA ≤ +85°C | 411 | |||
| Maximum current on VDD pin | 250 | mA | -40°C ≤ TA ≤ +85°C, 28L-Pin Devices | 411 | |||
| Maximum current on any I/O pin | 50 | mA | 411 | ||||
| Clamp current | IK | 20 | mA | VPIN < 0 or VPIN > VDD | 411 | ||
| Total power dissipation | 800 | mW | 411 | ||||
| Operating supply voltage | VDD | 2.3 | 5.5 | V | FOSC ≤ 16 MHz | 414 | |
| Operating supply voltage | VDD | 2.5 | 5.5 | V | FOSC > 16 MHz | 414 | |
| Operating ambient temperature, industrial | TA | -40 | 85 | °C | Industrial Temperature | 412 | |
| RAM data retention voltage | VDR | 1.7 | V | Device in Sleep mode | 414 | ||
| Power-on Reset release voltage | VPOR | 1.6 | V | BOR and LPBOR disabled | 414 | ||
| Power-on Reset ReARM voltage | VPORR | 1.5 | V | BOR and LPBOR disabled | 414 | ||
| VDD rise rate for internal POR | SVDD | 0.05 | V/ms | BOR and LPBOR disabled | 414 | ||
| Supply current, XT = 4 MHz | IDDXT4 | 332 | 479 | uA | VDD = 3.0V | 416 | |
| Supply current, HFO = 16 MHz | IDDHFO16 | 1.4 | 1.9 | mA | VDD = 3.0V | 416 | |
| Supply current, HFO = 32 MHz | IDDHFOPLL | 2.3 | 2.9 | mA | VDD = 3.0V | 416 | |
| Supply current, HS+PLL = 32 MHz | IDDHSPLL32 | 2.3 | 2.9 | mA | VDD = 3.0V | 416 | |
| Supply current, IDLE mode | IDDIDLE | 816 | uA | IDLE Mode, HFINTOSC = 16 MHz, VDD = 3.0V | 416 | ||
| Supply current, DOZE mode | IDDDOZE | 875 | uA | DOZE mode, HFO = 16 MHz, DOZE Ratio = 16, VDD = 3.0V | 416 | ||
| Power-down current base | IPD | 0.4 | 2.5 | µA | VDD = 3.0V, Max at +85°C (6 at +125°C) | 417 | |
| Power-down current base, VREGPM = 0 | IPD | 13 | 22 | µA | VDD = 3.0V, Max at +85°C (27 at +125°C) | 417 | |
| Power-down current, WDT | IPD_WDT | 1.1 | 3.3 | µA | VDD = 3.0V, Max at +85°C (6.6 at +125°C) | 417 | |
| Power-down current, secondary oscillator | IPD_SOSC | 3 | 6.8 | µA | VDD = 3.0V, Max at +85°C (10 at +125°C) | 417 | |
| Power-down current, FVR | IPD_FVR | 33 | 76 | µA | VDD = 3.0V, Max at +85°C (76 at +125°C) | 417 | |
| Power-down current, BOR | IPD_BOR | 12 | 21 | µA | VDD = 3.0V, Max at +85°C (23 at +125°C) | 417 | |
| Power-down current, LPBOR | IPD_LPBOR | 1.2 | 5 | µA | VDD = 3.0V, Max at +85°C (13 at +125°C) | 417 | |
| Power-down current, comparator | IPD_CMP | 36 | 44 | µA | VDD = 3.0V, High-Power Mode, Max at +85°C (50 at +125°C) | 417 | |
| Input low voltage, TTL buffer | VIL | 0.8 | V | 4.5V ≤ VDD ≤ 5.5V | 418 | ||
| Input low voltage, Schmitt Trigger buffer | VIL | 0.2 | V | 2.0V ≤ VDD ≤ 5.5V, max 0.2 VDD | 418 | ||
| Input high voltage, TTL buffer | VIH | 2 | V | 4.5V ≤ VDD ≤ 5.5V | 418 | ||
| Input high voltage, Schmitt Trigger buffer | VIH | 0.8 | V | 2.0V ≤ VDD ≤ 5.5V, min 0.8 VDD | 418 | ||
| Input leakage current, I/O ports | IIL | -125 | 5 | 125 | nA | VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C | 418 |
| Input leakage current, MCLR | IIL | -200 | 50 | 200 | nA | VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C | 418 |
| Weak pull-up current | IPUR | 25 | 120 | 200 | µA | VDD = 3.0V, VPIN = VSS | 418 |
| Output low voltage, I/O ports | VOL | 0.6 | V | IOL = 10.0 mA, VDD = 3.0V | 418 | ||
| I/O pin capacitance | CIO | 5 | 50 | pF | All I/O pins | 418 | |
| Brown-out Reset voltage, BORV = 0 | VBOR | 2.55 | 2.7 | 2.85 | V | BORV = 0 | 428 |
| Brown-out Reset voltage, BORV = 1 | VBOR | 2.3 | 2.45 | 2.6 | V | BORV = 1 (PIC16F18326/18346) | 428 |
| Precision calibrated HFINTOSC frequency | FHFOSC | 3.92 | 4 | 4.08 | MHz | 25°C | 423 |
| ADC resolution | NR | 10 | bit | VDD = 3.0V, TA = 25°C | 429 | ||
| ADC integral error | EIL | -1 | 0.1 | 1 | LSb | ADCREF+ = 3.0V, ADCREF- = 0V | 429 |
| ADC differential error | EDL | -1 | 0.1 | 1 | LSb | ADCREF+ = 3.0V, ADCREF-= 0V | 429 |
| ADC gain error | EGN | -1 | 0.2 | 1 | LSb | ADCREF+ = 3.0V, ADCREF- = 0V | 429 |
| ADC offset error | EOFF | 0.5 | 2 | LSb | ADCREF+ = 3.0V, ADCREF- = 0V | 429 | |
| FVR 1x gain (1.024V) tolerance | VFVR1 | -4 | 4 | % | VDD ≥ 2.5V, -40°C to 85°C | 432 | |
| FVR 2x gain (2.048V) tolerance | VFVR2 | -4 | 4 | % | VDD ≥ 2.5V, -40°C to 85°C | 432 | |
| FVR 4x gain (4.096V) tolerance | VFVR4 | -5 | 5 | % | VDD ≥ 4.75V, -40°C to 85°C | 432 | |
| Comparator input offset voltage | VIOFF | -50 | 50 | mV | VICM = VDD/2 | 432 | |
| Thermal resistance junction to ambient, 14-pin TSSOP | θJA | 100 | °C/W | 14-pin TSSOP package | 420 | ||
| Thermal resistance junction to case, 14-pin TSSOP | θJC | 24.4 | °C/W | 14-pin TSSOP package | 420 | ||
| Maximum junction temperature | TJMAX | 150 | °C | 420 | |||
| Power dissipation | PD | 0.8 | W | PD = PINTERNAL + PI/O | 420 |
CAD (KiCad official)
- Symbol:
PIC16F18326T-I - Footprint:
Package_SO:TSSOP-14_4.4x5mm_P0.65mm - 3D model: TSSOP-14 (KiCad packages3D, STEP)
- 3D model files:
pic16f18326t-i-etched.step/pic16f18326t-i-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pic16f18326t-i.step/pic16f18326t-i.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (500 pp, sha256
caaf66beaba7d548, retrieved 2026-10-26, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# PIC16F18326T-I
**Microchip Tech** · Microcontroller Units (MCUs/MPUs/SOCs) · TSSOP-14
PIC16F18326T-I from Microchip Tech, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Positive supply; 2.3V to 5.5V for PIC16F18326 (1.8V to 3.6V for PIC16LF18326), decoupled with a 0.1 µF capacitor and must always be connected. |
| 2 | RA5 | bidirectional | General purpose I/O RA5 multiplexed with ANA5, T1CKI, SOSCIN/SOSCI, CLCIN3, CLKIN and OSC1 (crystal/resonator or external clock input). |
| 3 | RA4 | bidirectional | General purpose I/O RA4 multiplexed with ANA4, T1G, SOSCO, CLKOUT (FOSC/4 output) and OSC2 (crystal/resonator). |
| 4 | RA3/MCLR/VPP | input | Input-only RA3 that serves as Master Clear (with internal weak pull-up) and the VPP programming voltage input. |
| 5 | RC5 | bidirectional | General purpose I/O RC5 multiplexed with ANC5, MDCIN2, T3CKI, CCP1, SDI2, SDA2 (I2C) and RX/DT of the EUSART. |
| 6 | RC4 | bidirectional | General purpose I/O RC4 multiplexed with ANC4, T3G, SCK2, SCL2 (I2C) and CLCIN1. |
| 7 | RC3 | bidirectional | General purpose I/O RC3 multiplexed with ANC3, C1IN3-, C2IN3-, MDMIN, T5G, CCP2, SS1 and CLCIN0. |
| 8 | RC2 | bidirectional | General purpose I/O RC2 multiplexed with ANC2, C1IN2-, C2IN2- and MDCIN1. |
| 9 | RC1 | bidirectional | General purpose I/O RC1 multiplexed with ANC1, C1IN1-, C2IN1-, CCP4, SDI1, SDA1 (I2C) and CLCIN2. |
| 10 | RC0 | bidirectional | General purpose I/O RC0 multiplexed with ANC0, C2IN0+, T5CKI, SCK1 and SCL1 (I2C). |
| 11 | RA2 | bidirectional | General purpose I/O RA2 multiplexed with ANA2, VREF-, DAC1REF-, T0CKI, CCP3, CWG1IN, CWG2IN and INT external interrupt input. |
| 12 | RA1 | bidirectional | General purpose I/O RA1 multiplexed with ANA1, VREF+, C1IN0-, C2IN0-, DAC1REF+ and ICSPCLK/ICDCLK clock for programming and debug. |
| 13 | RA0 | bidirectional | General purpose I/O RA0 multiplexed with ANA0, C1IN0+, DAC1OUT, SS2 and ICSPDAT/ICDDAT data for programming and debug. |
| 14 | VSS | power_in | Ground reference; must always be connected. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | TSSOP-14 |
| Category | Single Chip Microcomputer/Microcontroller |
| Pins | 14 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage on VDD pin (abs max) | VDD | -0.3 | | 6.5 | V | PIC16F18326/18346, with respect to VSS | 411 |
| Voltage on MCLR pin (abs max) | | -0.3 | | 9 | V | with respect to VSS | 411 |
| Voltage on all other pins (abs max) | | -0.3 | | | V | -0.3V to (VDD + 0.3V) | 411 |
| Storage temperature | | -65 | | 150 | °C | | 411 |
| Ambient temperature under bias | | -40 | | 125 | °C | | 411 |
| Maximum current on VSS pin | | | | 350 | mA | -40°C ≤ TA ≤ +85°C | 411 |
| Maximum current on VDD pin | | | | 250 | mA | -40°C ≤ TA ≤ +85°C, 28L-Pin Devices | 411 |
| Maximum current on any I/O pin | | | | 50 | mA | | 411 |
| Clamp current | IK | | | 20 | mA | VPIN < 0 or VPIN > VDD | 411 |
| Total power dissipation | | | | 800 | mW | | 411 |
| Operating supply voltage | VDD | 2.3 | | 5.5 | V | FOSC ≤ 16 MHz | 414 |
| Operating supply voltage | VDD | 2.5 | | 5.5 | V | FOSC > 16 MHz | 414 |
| Operating ambient temperature, industrial | TA | -40 | | 85 | °C | Industrial Temperature | 412 |
| RAM data retention voltage | VDR | 1.7 | | | V | Device in Sleep mode | 414 |
| Power-on Reset release voltage | VPOR | | 1.6 | | V | BOR and LPBOR disabled | 414 |
| Power-on Reset ReARM voltage | VPORR | | 1.5 | | V | BOR and LPBOR disabled | 414 |
| VDD rise rate for internal POR | SVDD | 0.05 | | | V/ms | BOR and LPBOR disabled | 414 |
| Supply current, XT = 4 MHz | IDDXT4 | | 332 | 479 | uA | VDD = 3.0V | 416 |
| Supply current, HFO = 16 MHz | IDDHFO16 | | 1.4 | 1.9 | mA | VDD = 3.0V | 416 |
| Supply current, HFO = 32 MHz | IDDHFOPLL | | 2.3 | 2.9 | mA | VDD = 3.0V | 416 |
| Supply current, HS+PLL = 32 MHz | IDDHSPLL32 | | 2.3 | 2.9 | mA | VDD = 3.0V | 416 |
| Supply current, IDLE mode | IDDIDLE | | 816 | | uA | IDLE Mode, HFINTOSC = 16 MHz, VDD = 3.0V | 416 |
| Supply current, DOZE mode | IDDDOZE | | 875 | | uA | DOZE mode, HFO = 16 MHz, DOZE Ratio = 16, VDD = 3.0V | 416 |
| Power-down current base | IPD | | 0.4 | 2.5 | µA | VDD = 3.0V, Max at +85°C (6 at +125°C) | 417 |
| Power-down current base, VREGPM = 0 | IPD | | 13 | 22 | µA | VDD = 3.0V, Max at +85°C (27 at +125°C) | 417 |
| Power-down current, WDT | IPD_WDT | | 1.1 | 3.3 | µA | VDD = 3.0V, Max at +85°C (6.6 at +125°C) | 417 |
| Power-down current, secondary oscillator | IPD_SOSC | | 3 | 6.8 | µA | VDD = 3.0V, Max at +85°C (10 at +125°C) | 417 |
| Power-down current, FVR | IPD_FVR | | 33 | 76 | µA | VDD = 3.0V, Max at +85°C (76 at +125°C) | 417 |
| Power-down current, BOR | IPD_BOR | | 12 | 21 | µA | VDD = 3.0V, Max at +85°C (23 at +125°C) | 417 |
| Power-down current, LPBOR | IPD_LPBOR | | 1.2 | 5 | µA | VDD = 3.0V, Max at +85°C (13 at +125°C) | 417 |
| Power-down current, comparator | IPD_CMP | | 36 | 44 | µA | VDD = 3.0V, High-Power Mode, Max at +85°C (50 at +125°C) | 417 |
| Input low voltage, TTL buffer | VIL | | | 0.8 | V | 4.5V ≤ VDD ≤ 5.5V | 418 |
| Input low voltage, Schmitt Trigger buffer | VIL | | | 0.2 | V | 2.0V ≤ VDD ≤ 5.5V, max 0.2 VDD | 418 |
| Input high voltage, TTL buffer | VIH | 2 | | | V | 4.5V ≤ VDD ≤ 5.5V | 418 |
| Input high voltage, Schmitt Trigger buffer | VIH | 0.8 | | | V | 2.0V ≤ VDD ≤ 5.5V, min 0.8 VDD | 418 |
| Input leakage current, I/O ports | IIL | -125 | 5 | 125 | nA | VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C | 418 |
| Input leakage current, MCLR | IIL | -200 | 50 | 200 | nA | VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C | 418 |
| Weak pull-up current | IPUR | 25 | 120 | 200 | µA | VDD = 3.0V, VPIN = VSS | 418 |
| Output low voltage, I/O ports | VOL | | | 0.6 | V | IOL = 10.0 mA, VDD = 3.0V | 418 |
| I/O pin capacitance | CIO | | 5 | 50 | pF | All I/O pins | 418 |
| Brown-out Reset voltage, BORV = 0 | VBOR | 2.55 | 2.7 | 2.85 | V | BORV = 0 | 428 |
| Brown-out Reset voltage, BORV = 1 | VBOR | 2.3 | 2.45 | 2.6 | V | BORV = 1 (PIC16F18326/18346) | 428 |
| Precision calibrated HFINTOSC frequency | FHFOSC | 3.92 | 4 | 4.08 | MHz | 25°C | 423 |
| ADC resolution | NR | | | 10 | bit | VDD = 3.0V, TA = 25°C | 429 |
| ADC integral error | EIL | -1 | 0.1 | 1 | LSb | ADCREF+ = 3.0V, ADCREF- = 0V | 429 |
| ADC differential error | EDL | -1 | 0.1 | 1 | LSb | ADCREF+ = 3.0V, ADCREF-= 0V | 429 |
| ADC gain error | EGN | -1 | 0.2 | 1 | LSb | ADCREF+ = 3.0V, ADCREF- = 0V | 429 |
| ADC offset error | EOFF | | 0.5 | 2 | LSb | ADCREF+ = 3.0V, ADCREF- = 0V | 429 |
| FVR 1x gain (1.024V) tolerance | VFVR1 | -4 | | 4 | % | VDD ≥ 2.5V, -40°C to 85°C | 432 |
| FVR 2x gain (2.048V) tolerance | VFVR2 | -4 | | 4 | % | VDD ≥ 2.5V, -40°C to 85°C | 432 |
| FVR 4x gain (4.096V) tolerance | VFVR4 | -5 | | 5 | % | VDD ≥ 4.75V, -40°C to 85°C | 432 |
| Comparator input offset voltage | VIOFF | -50 | | 50 | mV | VICM = VDD/2 | 432 |
| Thermal resistance junction to ambient, 14-pin TSSOP | θJA | | 100 | | °C/W | 14-pin TSSOP package | 420 |
| Thermal resistance junction to case, 14-pin TSSOP | θJC | | 24.4 | | °C/W | 14-pin TSSOP package | 420 |
| Maximum junction temperature | TJMAX | | 150 | | °C | | 420 |
| Power dissipation | PD | | 0.8 | | W | PD = PINTERNAL + PI/O | 420 |
## CAD (KiCad official)
- Symbol: `PIC16F18326T-I`
- Footprint: `Package_SO:TSSOP-14_4.4x5mm_P0.65mm`
- 3D model: TSSOP-14 (KiCad packages3D, STEP)
- 3D model files: `pic16f18326t-i-etched.step` / `pic16f18326t-i-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `pic16f18326t-i.step` / `pic16f18326t-i.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Microchip Tech datasheet](https://ww1.microchip.com/downloads/en/DeviceDoc/40001839E.pdf) (500 pp, sha256 `caaf66beaba7d548`, retrieved 2026-10-26, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/pic16f18326t-i-datasheet.pdf)