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PIC16F18326T-I

Microchip Tech · Microcontroller Units (MCUs/MPUs/SOCs) · TSSOP-14

PIC16F18326T-I from Microchip Tech, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Positive supply; 2.3V to 5.5V for PIC16F18326 (1.8V to 3.6V for PIC16LF18326), decoupled with a 0.1 µF capacitor and must always be connected.
2 RA5 bidirectional General purpose I/O RA5 multiplexed with ANA5, T1CKI, SOSCIN/SOSCI, CLCIN3, CLKIN and OSC1 (crystal/resonator or external clock input).
3 RA4 bidirectional General purpose I/O RA4 multiplexed with ANA4, T1G, SOSCO, CLKOUT (FOSC/4 output) and OSC2 (crystal/resonator).
4 RA3/MCLR/VPP input Input-only RA3 that serves as Master Clear (with internal weak pull-up) and the VPP programming voltage input.
5 RC5 bidirectional General purpose I/O RC5 multiplexed with ANC5, MDCIN2, T3CKI, CCP1, SDI2, SDA2 (I2C) and RX/DT of the EUSART.
6 RC4 bidirectional General purpose I/O RC4 multiplexed with ANC4, T3G, SCK2, SCL2 (I2C) and CLCIN1.
7 RC3 bidirectional General purpose I/O RC3 multiplexed with ANC3, C1IN3-, C2IN3-, MDMIN, T5G, CCP2, SS1 and CLCIN0.
8 RC2 bidirectional General purpose I/O RC2 multiplexed with ANC2, C1IN2-, C2IN2- and MDCIN1.
9 RC1 bidirectional General purpose I/O RC1 multiplexed with ANC1, C1IN1-, C2IN1-, CCP4, SDI1, SDA1 (I2C) and CLCIN2.
10 RC0 bidirectional General purpose I/O RC0 multiplexed with ANC0, C2IN0+, T5CKI, SCK1 and SCL1 (I2C).
11 RA2 bidirectional General purpose I/O RA2 multiplexed with ANA2, VREF-, DAC1REF-, T0CKI, CCP3, CWG1IN, CWG2IN and INT external interrupt input.
12 RA1 bidirectional General purpose I/O RA1 multiplexed with ANA1, VREF+, C1IN0-, C2IN0-, DAC1REF+ and ICSPCLK/ICDCLK clock for programming and debug.
13 RA0 bidirectional General purpose I/O RA0 multiplexed with ANA0, C1IN0+, DAC1OUT, SS2 and ICSPDAT/ICDDAT data for programming and debug.
14 VSS power_in Ground reference; must always be connected.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TSSOP-14
Category Single Chip Microcomputer/Microcontroller
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage on VDD pin (abs max) VDD -0.3 6.5 V PIC16F18326/18346, with respect to VSS 411
Voltage on MCLR pin (abs max) -0.3 9 V with respect to VSS 411
Voltage on all other pins (abs max) -0.3 V -0.3V to (VDD + 0.3V) 411
Storage temperature -65 150 °C 411
Ambient temperature under bias -40 125 °C 411
Maximum current on VSS pin 350 mA -40°C ≤ TA ≤ +85°C 411
Maximum current on VDD pin 250 mA -40°C ≤ TA ≤ +85°C, 28L-Pin Devices 411
Maximum current on any I/O pin 50 mA 411
Clamp current IK 20 mA VPIN < 0 or VPIN > VDD 411
Total power dissipation 800 mW 411
Operating supply voltage VDD 2.3 5.5 V FOSC ≤ 16 MHz 414
Operating supply voltage VDD 2.5 5.5 V FOSC > 16 MHz 414
Operating ambient temperature, industrial TA -40 85 °C Industrial Temperature 412
RAM data retention voltage VDR 1.7 V Device in Sleep mode 414
Power-on Reset release voltage VPOR 1.6 V BOR and LPBOR disabled 414
Power-on Reset ReARM voltage VPORR 1.5 V BOR and LPBOR disabled 414
VDD rise rate for internal POR SVDD 0.05 V/ms BOR and LPBOR disabled 414
Supply current, XT = 4 MHz IDDXT4 332 479 uA VDD = 3.0V 416
Supply current, HFO = 16 MHz IDDHFO16 1.4 1.9 mA VDD = 3.0V 416
Supply current, HFO = 32 MHz IDDHFOPLL 2.3 2.9 mA VDD = 3.0V 416
Supply current, HS+PLL = 32 MHz IDDHSPLL32 2.3 2.9 mA VDD = 3.0V 416
Supply current, IDLE mode IDDIDLE 816 uA IDLE Mode, HFINTOSC = 16 MHz, VDD = 3.0V 416
Supply current, DOZE mode IDDDOZE 875 uA DOZE mode, HFO = 16 MHz, DOZE Ratio = 16, VDD = 3.0V 416
Power-down current base IPD 0.4 2.5 µA VDD = 3.0V, Max at +85°C (6 at +125°C) 417
Power-down current base, VREGPM = 0 IPD 13 22 µA VDD = 3.0V, Max at +85°C (27 at +125°C) 417
Power-down current, WDT IPD_WDT 1.1 3.3 µA VDD = 3.0V, Max at +85°C (6.6 at +125°C) 417
Power-down current, secondary oscillator IPD_SOSC 3 6.8 µA VDD = 3.0V, Max at +85°C (10 at +125°C) 417
Power-down current, FVR IPD_FVR 33 76 µA VDD = 3.0V, Max at +85°C (76 at +125°C) 417
Power-down current, BOR IPD_BOR 12 21 µA VDD = 3.0V, Max at +85°C (23 at +125°C) 417
Power-down current, LPBOR IPD_LPBOR 1.2 5 µA VDD = 3.0V, Max at +85°C (13 at +125°C) 417
Power-down current, comparator IPD_CMP 36 44 µA VDD = 3.0V, High-Power Mode, Max at +85°C (50 at +125°C) 417
Input low voltage, TTL buffer VIL 0.8 V 4.5V ≤ VDD ≤ 5.5V 418
Input low voltage, Schmitt Trigger buffer VIL 0.2 V 2.0V ≤ VDD ≤ 5.5V, max 0.2 VDD 418
Input high voltage, TTL buffer VIH 2 V 4.5V ≤ VDD ≤ 5.5V 418
Input high voltage, Schmitt Trigger buffer VIH 0.8 V 2.0V ≤ VDD ≤ 5.5V, min 0.8 VDD 418
Input leakage current, I/O ports IIL -125 5 125 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C 418
Input leakage current, MCLR IIL -200 50 200 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C 418
Weak pull-up current IPUR 25 120 200 µA VDD = 3.0V, VPIN = VSS 418
Output low voltage, I/O ports VOL 0.6 V IOL = 10.0 mA, VDD = 3.0V 418
I/O pin capacitance CIO 5 50 pF All I/O pins 418
Brown-out Reset voltage, BORV = 0 VBOR 2.55 2.7 2.85 V BORV = 0 428
Brown-out Reset voltage, BORV = 1 VBOR 2.3 2.45 2.6 V BORV = 1 (PIC16F18326/18346) 428
Precision calibrated HFINTOSC frequency FHFOSC 3.92 4 4.08 MHz 25°C 423
ADC resolution NR 10 bit VDD = 3.0V, TA = 25°C 429
ADC integral error EIL -1 0.1 1 LSb ADCREF+ = 3.0V, ADCREF- = 0V 429
ADC differential error EDL -1 0.1 1 LSb ADCREF+ = 3.0V, ADCREF-= 0V 429
ADC gain error EGN -1 0.2 1 LSb ADCREF+ = 3.0V, ADCREF- = 0V 429
ADC offset error EOFF 0.5 2 LSb ADCREF+ = 3.0V, ADCREF- = 0V 429
FVR 1x gain (1.024V) tolerance VFVR1 -4 4 % VDD ≥ 2.5V, -40°C to 85°C 432
FVR 2x gain (2.048V) tolerance VFVR2 -4 4 % VDD ≥ 2.5V, -40°C to 85°C 432
FVR 4x gain (4.096V) tolerance VFVR4 -5 5 % VDD ≥ 4.75V, -40°C to 85°C 432
Comparator input offset voltage VIOFF -50 50 mV VICM = VDD/2 432
Thermal resistance junction to ambient, 14-pin TSSOP θJA 100 °C/W 14-pin TSSOP package 420
Thermal resistance junction to case, 14-pin TSSOP θJC 24.4 °C/W 14-pin TSSOP package 420
Maximum junction temperature TJMAX 150 °C 420
Power dissipation PD 0.8 W PD = PINTERNAL + PI/O 420

CAD (KiCad official)

  • Symbol: PIC16F18326T-I
  • Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
  • 3D model: TSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: pic16f18326t-i-etched.step / pic16f18326t-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pic16f18326t-i.step / pic16f18326t-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (500 pp, sha256 caaf66beaba7d548, retrieved 2026-10-26, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF