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PI6C49X0201WIEX

Diodes Incorporated · Translators / Level Shifters · SOIC-8

PI6C49X0201WIEX from Diodes Incorporated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 nc unconnected No connect; the datasheet lists this pin as unused.
2 CLK input Non-inverting differential clock input with an internal pulldown resistor of 51 kΩ; it accepts LVPECL, LVDS, LVHSTL, SSTL, and HCSL levels.
3 nCLK input Inverting differential clock input with an internal pullup resistor of 51 kΩ; it accepts LVPECL, LVDS, LVHSTL, SSTL, and HCSL levels.
4 nc unconnected No connect; the datasheet lists this pin as unused.
5 GND power_in Power supply ground.
6 nc unconnected No connect; the datasheet lists this pin as unused.
7 Q0 output Single-ended clock output with LVCMOS/LVTTL interface levels.
8 VDD power_in Positive supply pin; the datasheet specifies 3.0 V to 3.6 V (3.3 V ±0.3 V) or 2.375 V to 2.625 V (2.5 V ±5%).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOIC-8
Category Logic ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VDD 4.6 V 3
Inputs VI -0.5 V 3
Output VO -0.5 V 3
Storage Temperature TSTG -65 150 °C 3
ESD Protection (Input) 2000 V HBM 3
Positive Supply Voltage (3.3V option) VDD 3 3.3 3.6 V VDD = 3.3V ± 0.3V or 2.5V ± 5%, TA = -40°C to 85°C 3
Positive Supply Voltage (2.5V option) VDD 2.375 2.5 2.625 V VDD = 3.3V ± 0.3V or 2.5V ± 5%, TA = -40°C to 85°C 3
Output High Voltage (VDD = 3.6V) VOH 2.6 3.6 V VDD = 3.6V; NOTE 1 3
Output High Voltage (VDD = 2.625V) VOH 1.8 2.625 V VDD = 2.625V; NOTE 1 3
Peak-to-Peak Input Voltage VPP 0.15 1.3 V 3
Output Low Voltage VOL 0.5 V VDD = 3.6V or 2.625V; NOTE 1 3
Input High Current nCLK IIH 5 μA nCLK VIN = VDD = 3.6V or 2.625V 3
Input High Current CLK IIH 150 μA CLK VIN = VDD = 3.6V or 2.625V 3
Input Low Current nCLK IIL -150 μA nCLK VIN = 0V, VDD = 3.6V or 2.625V 3
Input Low Current CLK IIL -5 μA CLK VIN = 0V, VDD = 3.6V or 2.625V 3
Power Supply Current (25MHz) IDD 25 mA 25MHz, unloaded 3
Power Supply Current (250MHz) IDD 35 mA 250MHz, unloaded 3
Output Frequency (2.5V) fMAX 4 360 MHz VDD = 2.5V ± 5%, TA = -40°C to 85°C 4
Propagation Delay (2.5V) tPD 1.9 2.2 2.5 ns VDD = 2.5V ± 5%; ƒ ≤ 350MHz 4
Part-to-Part Skew (2.5V) tsk(pp) 500 ps VDD = 2.5V ± 5% 4
Output Duty Cycle (2.5V, ƒ ≤ 250MHz) odc 45 50 55 % VDD = 2.5V ± 5%; ƒ ≤ 250MHz 4
Output Duty Cycle (2.5V, 250MHz < ƒ ≤ 350MHz) odc 40 50 60 % VDD = 2.5V ± 5%; 250MHz < ƒ ≤ 350MHz 4
Buffer Additive Phase Jitter, RMS (2.5V, 156.25MHz) tjit 0.04 ps VDD = 2.5V ± 5%; 156.25MHz, Integration Range (12kHz, 20MHz) 4
Buffer Additive Phase Jitter, RMS (2.5V, 125MHz) tjit 0.14 ps VDD = 2.5V ± 5%; 125MHz, Integration Range (12kHz, 20MHz) 4
Output Rise/Fall Time (2.5V) tR/tF 180 350 ps VDD = 2.5V ± 5%; 20% to 80% 4
Output Frequency (3.3V) fMAX 4 360 MHz VDD = 3.3V ± 0.3V, TA = -40°C to 85°C 4
Propagation Delay (3.3V) tPD 1.6 1.8 2 ns VDD = 3.3V ± 0.3V; ƒ ≤ 350MHz 4
Part-to-Part Skew (3.3V) tsk(pp) 500 ps VDD = 3.3V ± 0.3V 4
Output Duty Cycle (3.3V, ƒ ≤ 166MHz) odc 45 50 55 % VDD = 3.3V ± 0.3V; ƒ ≤ 166MHz 4
Output Duty Cycle (3.3V, 166MHz < ƒ ≤ 350MHz) odc 40 50 60 % VDD = 3.3V ± 0.3V; 166MHz < ƒ ≤ 350MHz 4
Output Rise/Fall Time (3.3V) tR/tF 80 250 350 ps VDD = 3.3V ± 0.3V; 0.8V to 2V 4
Buffer Additive Phase Jitter, RMS (3.3V, 156.25MHz) tjit 0.09 ps VDD = 3.3V ± 0.3V; 156.25MHz, Integration Range (12kHz, 20MHz) 4
Buffer Additive Phase Jitter, RMS (3.3V, 125MHz) tjit 0.15 ps VDD = 3.3V ± 0.3V; 125MHz, Integration Range (12kHz, 20MHz) 4
Input Capacitance CIN 4 pF 2
Input Pullup Resistor RPULLUP 51 kΩ 2
Input Pulldown Resistor RPULLDOWN 51 kΩ 2
Power Dissipation Capacitance CPD 23 pF VDD = 3.6V 2
Output Impedance ROUT 5 7 13 Ω 2
Package Thermal Impedance, θJA θJA 103 °C/W 0 lfpm 3
Junction-to-ambient thermal resistance ΘJA 157 °C/W Still air 5
Junction-to-case thermal resistance ΘJC 42 °C/W 5

CAD (KiCad official)

  • Symbol: PI6C49X0201WIEX
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: pi6c49x0201wiex-etched.step / pi6c49x0201wiex-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pi6c49x0201wiex.step / pi6c49x0201wiex.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 6543420a15a9a9af, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF