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PD70101ILQ-TR

Microchip Tech · Power Over Ethernet (PoE) Controllers · QFN-32(5x5)

PD70101ILQ-TR from Microchip Tech, in a QFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RDET passive Connect a 24.9 kΩ, 1% detection resistor from this pin to VPP.
2 PGOOD output Open-drain active-low output that flags the power rails (VPN_OUT) are ready, with the MOSFET rated for 5 mA and pull-up to VPP.
3 RREF passive Connect a 240k 1% bias resistor between this pin and VPN_IN for the PD interface.
4 RCLASS passive Connect an external classification resistor between this pin and VPN_IN to set the power class.
5 VPN_IN power_in VPort negative input connected to the isolation switch N-channel MOSFET source.
6 N/C unconnected Not used.
7 N/C unconnected Not used on PD70101; AT_FLAG open-drain output (active low) is a PD70201 function.
8 VPN_OUT power_out VPort negative output connected to the isolation switch output and N-channel MOSFET drain.
9 N/C unconnected Not used.
10 ENABLE input Logic-level enable input for the DC-DC controller, turned on by pulling this pin to VL, with thresholds VHI 2.0 V and VLO 0.8 V.
11 VINS input VPP input voltage sensing for the UVLO comparator, connected through an external divider from VPP to GND with a 1.2 V threshold.
12 HYST passive Output of the VINS/UVLO comparator used to program VPP UVLO hysteresis.
13 SYNC input External clock synchronization input that sets the DC-DC switching frequency to the applied clock.
14 RFREQ passive Connect a resistor from this pin to GND to set the DC-DC switching frequency.
15 SS passive Connect a capacitor from this pin to GND to set the DC-DC soft-start time, charged to 1.2 V.
16 RCLP passive Connect a resistor to GND to program the low power mode clamp voltage, or tie to GND to disable LPM.
17 VSN input Negative input of the differential amplifier, connected to the resistor divider junction from Vo- to GND.
18 VSP input Positive input of the differential amplifier, connected to the resistor divider junction from Vo+ to GND.
19 COMP output Error amplifier output, shorted to FB for isolated converters or connected to FB via RC compensation for non-isolated converters.
20 DAO output Differential amplifier output, connected to FB externally for non-isolated direct buck converter.
21 FB input Inverting input of the error amplifier, connected to the optocoupler for isolated DC-DC or to RC compensation for non-isolated DC-DC.
22 GND power_in Analog ground, connected to a local AGND plane with the soft-start capacitor and frequency resistor returned to it.
23 VL power_out 5 V (GND referenced) internal LDO output that requires a 1 µF or higher ceramic capacitor to GND.
24 SG output Secondary gate driver output, the complement of PG, left open if unused and low in low power skip mode.
25 PGND power_in Power ground connected to a local PGND plane for VCC decoupling, PG and SG drivers, and the primary current sense return.
26 CSN input Negative input of the current sense amplifier, Kelvin connected to the PGND side of the primary current sense resistor.
27 CSP input Positive input of the current sense amplifier, Kelvin connected to the non-PGND side of the primary current sense resistor.
28 PG output Primary gate driver output connected to the gate of the primary side power MOSFET, directly or via a resistor.
29 VH power_out 5 V high-side (VCC referenced) internal LDO output that requires a 0.1 µF or higher ceramic capacitor to VCC.
30 VCC power_in Input supply to the DC-DC controller that requires a 4.7 µF or higher ceramic capacitor to PGND.
31 VAUX power_out Auxiliary voltage reference to VPN_OUT used for DC-DC start-up, connected directly to VCC for PoE-only power or through a 30 V schottky diode for multiple sources.
32 VPP power_in Positive terminal of the PoE input port, connected to the positive terminal of the input bridges on the CDET positive side.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package QFN-32(5x5)
Category Power Management (PMIC)
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VPP, RDET, VPN_OUT (with respect to VPN_IN) -0.3 74 VDC 7
RREF, RCLASS (with respect to VPN_IN) -0.3 6 V 7
PGOOD, AT_FLAG, VAUX (with respect to VPN_OUT) -0.3 74 V 7
VCC (with respect to PGND) VCC -0.3 40 VDC 7
PG, SG (with respect to PGND) -0.3 20 VDC 7
VL, VSN, VSP (with respect to PGND) -0.3 6 V 7
VH (with respect to VCC) VH -0.3 VDC 7
All other pins (with respect to GND) -0.3 VDC 7
ESD (HBM) protection at all I/O pins -1 1 kV Pins 2 and 31 are ±150 V HBM 7
Maximum junction temperature (TJMAX) TJMAX 150 °C 7
Operational ambient temperature -40 85 °C 7
Storage temperature range -65 150 °C 7
Peak package solder re-flow temperature 260 °C 40 seconds maximum exposure, MSL3 7
Junction to case thermal resistance θJC 5 °C/W No forced airflow; four-layer JESD-51 board 7
Junction to pad thermal resistance θJP 4 °C/W No forced airflow; four-layer JESD-51 board 7
Junction to ambient thermal resistance θJA 23 °C/W No forced airflow; four-layer JESD-51 board 7
Input voltage VPP 0 55 57 V 8
Detection voltage range DETRANGE 1.3 10.1 V Measured between VPP and VPN IN 8
Detection switch ON resistance RDET-ON 50 Ω 2.5V ≤ (ΔVPP to VPNIN) ≤ 10.1 V; measured between RDET and VPN IN 8
Detection is disconnected VDET-OFF 10.1 12.8 V Measured between VPP and VPN IN 8
Detection switch OFF resistance RDET-OFF 2 MΩ 12.8 V ≤ (ΔVPP to VPNIN) ≤ 57.0 V; measured between RDET and VPNIN 8
Input offset current IOFFSET 16 µA 2.5 V ≤ VPP ≤ 10.1 V; -40 °C ≤ TJ ≤ 85 °C 8
Input offset current IOFFSET 10 µA 2.5 V ≤ VPP ≤ 10.1 V; -40 °C ≤ TJ ≤ 55 °C 8
RDET reconnection level VRDET-ON 1.95 3 4.85 V Measured between VPP and VPNIN 8
Classification current source, turn ON threshold range VTH-LOW-ON 11.4 13.7 V Measured at VPP; turn on for any ICLASS while VPP increases 9
Classification disconnection minimum hysteresis voltage VHST 1 V Hysteresis between VTH-low-on and VTH-low-off 9
Classification current source, turn OFF threshold range VTH-HIGH-OFF 20.9 23.9 V Measured at VPP; turn off while VPP increases 9
Current limit threshold ICLASS-LIM 50 68 80 mA 9
Input current IPP when classification function is enabled, Class 1 ICLASS-EN 9.5 10.5 11.5 mA Class 1 RCLASS = 133 Ω ±1% 9
Input current IPP when classification function is enabled, Class 2 ICLASS-EN 17.5 18.5 19.5 mA Class 2 RCLASS = 69.8 Ω ±1% 9
Input current IPP when classification function is enabled, Class 3 ICLASS-EN 26.5 28 29.5 mA Class 3 RCLASS = 45.3 Ω ±1% 9
Input current IPP when classification function is enabled, Class 4 ICLASS-EN 38 40 42 mA Class 4 RCLASS = 30.9 Ω ±1% 9
RCLASS voltage RCLASS 1.142 1.278 V 9
Mark, working range VMARK 4.9 10.1 V VPP failing edge 9
Mark current IMARK 0.25 4 mA 9

CAD (KiCad official)

  • Symbol: PD70101ILQ-TR
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: QFN-32(5x5) (KiCad packages3D, STEP)
  • 3D model files: pd70101ilq-tr-etched.step / pd70101ilq-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pd70101ilq-tr.step / pd70101ilq-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (31 pp, sha256 25d7605430c73dad, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF