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PC817X2YSZW

Sharp Microelectronics · Transistor, Photovoltaic Output Optoisolators · DIP-4

PC817X2YSZW from Sharp Microelectronics, in a DIP-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the input light-emitting diode; forward current IF is rated to 50 mA (peak IFM 1 A at pulse width ≤100 µs, duty ratio 0.001).
2 Cathode passive Cathode of the input light-emitting diode; the input reverse voltage is rated at VR = 6 V.
3 Emitter passive Emitter of the output phototransistor; the emitter-collector voltage is rated at VECO = 6 V.
4 Collector passive Collector of the output phototransistor; rated at VCEO = 80 V, collector current IC = 50 mA, and collector power dissipation PC = 150 mW.

Key specifications

Parameter Value
Manufacturer Sharp Microelectronics
Package DIP-4
Category Optoisolators
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-emitter saturation voltage VCE(sat) 0.1 0.2 V IF=20mA, IC=1mA 6
Collector-emitter breakdown voltage BVCEO 80 V IC=0.1mA, IF=0 6
Emitter-collector breakdown voltage BVECO 6 V IE=10μA, IF=0 6
Dark current ICEO 100 nA VCE=50V, IF=0 6
Forward voltage VF 1.2 1.4 V IF=20mA 6
Peak forward voltage VFM 3 V IFM=0.5A 6
Reverse current IR 10 μA VR=4V 6
Terminal capacitance Ct 30 250 pF V=0, f=1kHz 6
Floating capacitance Cf 0.6 1 pF V=0, f=1MHz 6
Cut-off frequency fc 80 kHz VCE=5V, IC=2mA, RL=100Ω, -3dB 6
Rise time tr 4 18 μs VCE=2V, IC=2mA, RL=100Ω 6
Fall time tf 3 18 μs 6
Forward current IF 50 mA 6
Peak forward current IFM 1 A Pulse width ≦100μs, Duty ratio 0.001 6
Reverse voltage VR 6 V 6
Power dissipation (input) P 70 mW 6
Collector-emitter voltage VCEO 80 V 6
Emitter-collector voltage VECO 6 V 6
Collector current IC 50 mA 6
Collector power dissipation PC 150 mW 6
Total power dissipation Ptot 200 mW 6
Operating temperature Topr -30 100 °C 6
Storage temperature Tstg -55 125 °C 6
Isolation voltage Viso(rms) 5 kV AC for 1 min, 40 to 60%RH 6
Soldering temperature Tsol 270 °C For 10 s 6
Maximum operating isolation voltage (VDE option) VIORM 890 V Peak; EN 60747-5-5 13
Partial discharge test voltage, Diagram 1 (VDE option) Vm 1430 V Peak; Diagram 1, tp=10s, qc<=5pC 13
Partial discharge test voltage, Diagram 2 (VDE option) Vm 1670 V Peak; Diagram 2, tp=1s, qc<=5pC 13
Maximum over-voltage (VDE option) Vini,a 9000 V Peak; tINI=60s 13
Safety maximum case temperature (VDE option) Tsi 150 °C IF=0, PC=0 13
Safety maximum input current (VDE option) Isi 200 mA PC=0 13
Safety maximum electric power (VDE option) Psi 300 mW Output or total power dissipation 13

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper Alloy Pin material : Copper Alloy 5

CAD (KiCad official)

  • Symbol: PC817X2YSZW
  • Footprint: Package_DIP:DIP-4_W7.62mm
  • 3D model: DIP-4 (KiCad packages3D, STEP)
  • 3D model files: pc817x2yszw-etched.step / pc817x2yszw-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pc817x2yszw.step / pc817x2yszw.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Sharp Microelectronics datasheet (15 pp, sha256 3f4e7b11a630676a, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF