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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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docs pam2863ecr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
package.json Publish 0.2.0 · Ray
pads.json add symbol pin "9" for the exposed thermal pad: the footprint carries the pad and the symbol had none, so it reached no… · Ray
page.json pam2863ecr: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray
pam2863ecr-etched.fit.json pam2863ecr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
pam2863ecr-etched.glb pam2863ecr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
pam2863ecr-etched.step pam2863ecr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
pam2863ecr.glb fix footprint: Diodes_SO-8EP -> Diodes_SO-8EP (3d refresh; body regenerated from the footprint F.Fab outline) · Ray
pam2863ecr.kicad_mod fix footprint: SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm -> Diodes_SO-8EP (ep_dropped, 8 pins; datasheet EP 3.502x2.613mm… · Ray
pam2863ecr.kicad_sym add symbol pin "9" for the exposed thermal pad: the footprint carries the pad and the symbol had none, so it reached no… · Ray
pam2863ecr.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
pam2863ecr.step fix footprint: Diodes_SO-8EP -> Diodes_SO-8EP (3d refresh; body regenerated from the footprint F.Fab outline) · Ray
README.md pam2863ecr: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray

PAM2863ECR

Diodes Incorporated · LED Drivers · SOIC-8-EP

PAM2863ECR from Diodes Incorporated, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input supply voltage, 4.5V to 40V (absolute max -0.3V to +40V). Decouple to ground with a 10µF or higher X7R ceramic capacitor placed close to the device.
2 ISENSE input High-side current-sense input. Connect resistor Rs from this pin to VIN to program the nominal average output current: IOUT(nom) = 0.1V / Rs (VSENSE typical 100mV). Input current typ. 8µA.
3 AGND power_in Analog ground (0V). Shown as AGND on the pin-assignment diagram; the pin-description table groups pins 3, 7, 8 together as GND. Tie to the ground plane.
4 VSET input Multi-function on/off and brightness control. Leave floating for normal operation. Drive <0.2V to disable output; DC voltage 0.3V-2.5V adjusts output current from 12% to 100% of IOUT(nom); PWM (open-collector/open-drain) at f<500Hz gives 1%-100% range. A capacitor from VSET to GND sets soft-start time (default ~0.1ms; ~1.5ms with 1nF). Abs max -0.3V to +6.0V.
5 LX output Drain of internal 40V NDMOS switch. Connect to the external Schottky diode / inductor node of the step-down power stage. Rated to 40V, RDS(on) typ. 0.3Ω @ 100mA, peak inductor current limit 2.5A. Pins 5 and 6 are internally tied and should both be soldered.
6 LX output Drain of internal 40V NDMOS switch (paralleled with pin 5 for current handling / thermal). Same electrical net as pin 5.
7 PGND power_in Power ground return for the internal NDMOS switch (0V). Pin-assignment diagram labels PGND; pin-description table groups pins 3,7,8 as GND. Tie to ground plane; keep return path to the input capacitor short.
8 PGND power_in Power ground return for the internal NDMOS switch (0V), paralleled with pin 7.
EP EP passive Exposed thermal pad on package underside (SO-8EP). Solder to ground copper for heat dissipation; electrically tied to GND.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOIC-8-EP
Category LED-drv
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • PAM2863ECR

CAD (KiCad official)

  • Symbol: PAM2863ECR
  • Footprint: Package_SO:Diodes_SO-8EP
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)
  • 3D model files: pam2863ecr-etched.step / pam2863ecr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pam2863ecr.step / pam2863ecr.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
pam2863ecr.step 194 KB You want the bare part, or you mark your own boards.
pam2863ecr-etched.step 2.0 MB You want the part with PAM2863ECR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 499 faces against 63 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (11 pp, sha256 f591051d0579f29b, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF