component
OPA727AIDRBT
Public Made by Adomby adom
Texas Instruments Precision Op Amps, SON-8-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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OPA727AIDRBT
Texas Instruments · Precision Op Amps · SON-8-EP(3x3)
OPA727AIDRBT from Texas Instruments, in a SON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection. |
| 2 | -IN | input | Inverting input of the amplifier; input terminals are diode-clamped to the supply rails and signals more than 0.5V beyond the rails should be current limited to 10mA or less. |
| 3 | +IN | input | Non-inverting input of the amplifier; input common-mode range extends from V- to (V+) - 2.5V and signals more than 0.5V beyond the rails should be current limited to 10mA or less. |
| 4 | V- | power_in | Negative supply (or ground in single-supply operation); the exposed thermal die pad must also be connected to V-. |
| 5 | NC | unconnected | No internal connection. |
| 6 | OUT | output | Amplifier output with rail-to-rail swing, within 150mV of the rails for light loads (>100kΩ) and within 250mV with 1kΩ loads. |
| 7 | V+ | power_in | Positive supply, specified for 4V to 12V total supply (absolute maximum 13.2V) and to be bypassed with 1nF ceramic in parallel with 1µF tantalum capacitors. |
| 8 | NC | unconnected | No internal connection. |
| 9 | EP | power_in | Exposed thermal die pad on underside, to be connected to V- and soldered to the PCB thermal pad. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SON-8-EP(3x3) |
| Category | Amplifiers/Comparators |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
OPA727AIDRBT - Footprint:
Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm - 3D model: SON-8-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
opa727aidrbt-etched.step/opa727aidrbt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);opa727aidrbt.step/opa727aidrbt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (34 pp, sha256
dc46e8679e214df3, retrieved 2026-10-03, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# OPA727AIDRBT
**Texas Instruments** · Precision Op Amps · SON-8-EP(3x3)
OPA727AIDRBT from Texas Instruments, in a SON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection. |
| 2 | -IN | input | Inverting input of the amplifier; input terminals are diode-clamped to the supply rails and signals more than 0.5V beyond the rails should be current limited to 10mA or less. |
| 3 | +IN | input | Non-inverting input of the amplifier; input common-mode range extends from V- to (V+) - 2.5V and signals more than 0.5V beyond the rails should be current limited to 10mA or less. |
| 4 | V- | power_in | Negative supply (or ground in single-supply operation); the exposed thermal die pad must also be connected to V-. |
| 5 | NC | unconnected | No internal connection. |
| 6 | OUT | output | Amplifier output with rail-to-rail swing, within 150mV of the rails for light loads (>100kΩ) and within 250mV with 1kΩ loads. |
| 7 | V+ | power_in | Positive supply, specified for 4V to 12V total supply (absolute maximum 13.2V) and to be bypassed with 1nF ceramic in parallel with 1µF tantalum capacitors. |
| 8 | NC | unconnected | No internal connection. |
| 9 | EP | power_in | Exposed thermal die pad on underside, to be connected to V- and soldered to the PCB thermal pad. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SON-8-EP(3x3) |
| Category | Amplifiers/Comparators |
| Pins | 9 |
## CAD (KiCad official)
- Symbol: `OPA727AIDRBT`
- Footprint: `Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm`
- 3D model: SON-8-EP(3x3) (KiCad packages3D, STEP)
- 3D model files: `opa727aidrbt-etched.step` / `opa727aidrbt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `opa727aidrbt.step` / `opa727aidrbt.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/opa728) (34 pp, sha256 `dc46e8679e214df3`, retrieved 2026-10-03, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/opa727aidrbt-datasheet.pdf)