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OP162GSZ-REEL7

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Analog Devices Precision Op Amps, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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OP162GSZ-REEL7

Analog Devices · Precision Op Amps · SOIC-8

OP162GSZ-REEL7 from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NULL passive Offset null pin: a potentiometer (recommended 20 kΩ) can be connected between Pin 1 and Pin 8 for offset adjustment, and the wiper must go to VCC, never VEE, or the device can be damaged.
2 -IN A input Inverting input of amplifier A; the input voltage should be limited to ±6 V and the input current to less than 5 mA to avoid damage.
3 +IN A input Non-inverting input of amplifier A; the common-mode input range is 0 V to within 1 V of the positive supply, and the input voltage should be limited to ±6 V.
4 V- power_in Negative power supply; the device operates from single supplies as low as 2.7 V or dual supplies up to ±6 V.
5 NC unconnected No connect; the datasheet specifies no internal connection to this pin.
6 OUT A output Amplifier A output, which swings to within 60 mV of each supply rail at 5 mA load and is not short-circuit protected, so the output current must be kept within ±30 mA.
7 V+ power_in Positive power supply; single-supply operation is specified from 2.7 V to 12 V.
8 NULL passive Offset null pin: the second terminal for the optional offset-adjust potentiometer connected between Pin 1 and Pin 8.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage (OP162G) VOS 45 325 µV OP162G, OP262G, OP462G 3
Input Offset Voltage over temperature (OP162G) VOS 800 µV -40°C ≤ TA ≤ +125°C 3
Input Bias Current IB 360 600 nA 3
Input Bias Current over temperature IB 650 nA -40°C ≤ TA ≤ +125°C 3
Input Offset Current IOS -25 2.5 25 nA 3
Input Offset Current over temperature IOS -40 40 nA -40°C ≤ TA ≤ +125°C 3
Input Voltage Range VCM 0 4 V 3
Common-Mode Rejection CMRR 70 110 dB 0 V ≤ VCM ≤ 4.0 V, -40°C ≤ TA ≤ +125°C 3
Large Signal Voltage Gain AVO 30 V/mV RL = 2 kΩ, 0.5 ≤ VOUT ≤ 4.5 V 3
Large Signal Voltage Gain AVO 65 88 V/mV RL = 10 kΩ, 0.5 ≤ VOUT ≤ 4.5 V 3
Large Signal Voltage Gain over temperature AVO 40 V/mV RL = 10 kΩ, -40°C ≤ TA ≤ +125°C 3
Long-Term Offset Voltage (G grade) VOS 600 µV G grade 3
Output Voltage Swing High VOH 4.95 4.99 V IL = 250 µA, -40°C ≤ TA ≤ +125°C 3
Output Voltage Swing High VOH 4.85 4.94 V IL = 5 mA 3
Output Voltage Swing Low VOL 14 50 mV IL = 250 µA, -40°C ≤ TA ≤ +125°C 3
Output Voltage Swing Low VOL 65 150 mV IL = 5 mA 3
Short-Circuit Current ISC -80 80 mA Short to ground 3
Maximum Output Current IOUT -30 30 mA 3
Power Supply Rejection Ratio PSRR 120 dB VS = 2.7 V to 7 V 3
Power Supply Rejection Ratio over temperature PSRR 90 dB -40°C ≤ TA ≤ +125°C 3
Supply Current/Amplifier (OP162) ISY 600 750 µA OP162, VOUT = 2.5 V 3
Supply Current/Amplifier over temperature (OP162) ISY 1 mA -40°C ≤ TA ≤ +125°C 3
Slew Rate SR 10 V/µs 1 V < VOUT < 4 V, RL = 10 kΩ 3
Settling Time tS 540 ns To 0.1%, AV = -1, VO = 2 V step 3
Supply Voltage (absolute maximum, printed ±6 V) VS 6 V 6
Input Voltage VIN 6 V For supply voltages greater than 6 V, input limited to ≤ supply voltage 6
Differential Input Voltage VID 0.6 V Input current limited to < 5 mA above 0.6 V 6
Storage Temperature Range TSTG -65 150 °C 6
Operating Temperature Range TA -40 125 °C 6
Junction Temperature Range TJ -65 150 °C 6
Lead Temperature Range TLEAD 300 °C Soldering, 10 sec 6
Thermal Resistance, junction-to-ambient, 8-Lead SOIC (S) θJA 157 °C/W Device soldered in circuit board (SOIC) 6
Thermal Resistance, junction-to-case, 8-Lead SOIC (S) θJC 56 °C/W 6

CAD (KiCad official)

  • Symbol: OP162GSZ-REEL7
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: op162gsz-reel7-etched.step / op162gsz-reel7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); op162gsz-reel7.step / op162gsz-reel7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (20 pp, sha256 07ec7633d2004ae1, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF