component
NTK3043NT1G
Public Made by Adomby adom
onsemi MOSFETs, SOT-723. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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NTK3043NT1G
onsemi · MOSFETs · SOT-723
NTK3043NT1G from onsemi, in a SOT-723. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the N-channel MOSFET; the gate-to-source voltage is rated at VGS = 10 V maximum. |
| 2 | Source | passive | Source terminal of the MOSFET; source (body diode) current IS is rated at 286 mA maximum. |
| 3 | Drain | passive | Drain terminal of the MOSFET; drain-to-source voltage is rated at VDSS = 20 V, with continuous drain current ID of 255 mA at TA = 25C steady state (285 mA for t ≤ 5 s). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-723 |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Voltage | VDSS | 20 | V | 1 | |||
| Gate-to-Source Voltage | VGS | 10 | V | 1 | |||
| Continuous Drain Current | ID | 255 | mA | Steady state, TA = 25C (Note 1) | 1 | ||
| Continuous Drain Current | ID | 185 | mA | Steady state, TA = 85C (Note 1) | 1 | ||
| Continuous Drain Current | ID | 285 | mA | t ≤ 5 s, TA = 25C (Note 1) | 1 | ||
| Continuous Drain Current | ID | 210 | mA | Steady state, TA = 25C (Note 2) | 1 | ||
| Continuous Drain Current | ID | 155 | mA | Steady state, TA = 85C (Note 2) | 1 | ||
| Power Dissipation | PD | 440 | mW | Steady state, TA = 25C (Note 1) | 1 | ||
| Power Dissipation | PD | 545 | mW | t ≤ 5 s, TA = 25C (Note 1) | 1 | ||
| Power Dissipation | PD | 310 | mW | TA = 25C (Note 2) | 1 | ||
| Pulsed Drain Current | IDM | 400 | mA | tp = 10 s | 1 | ||
| Operating Junction and Storage Temperature | TJ, TSTG | -55 | 150 | C | 1 | ||
| Source Current (Body Diode) (Note 2) | IS | 286 | mA | 1 | |||
| Lead Temperature for Soldering Purposes | TL | 260 | C | 1/8 in from case for 10 s | 1 | ||
| Junction-to-Ambient, Steady State (Note 3) | RθJA | 280 | C/W | Surface-mounted on FR4, 1 in sq pad | 2 | ||
| Junction-to-Ambient, t = 5 s (Note 3) | RθJA | 228 | C/W | t = 5 s, surface-mounted on FR4, 1 in sq pad | 2 | ||
| Junction-to-Ambient, Steady State Minimum Pad (Note 4) | RθJA | 400 | C/W | Surface-mounted on FR4, minimum recommended pad size | 2 | ||
| Drain-to-Source Breakdown Voltage | V(BR)DSS | 20 | V | VGS = 0 V, ID = 100 µA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VGS = 0 V, VDS = 16 V, TJ = 25C | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 10 | µA | VGS = 0 V, VDS = 16 V, TJ = 125C | 2 | ||
| Gate-to-Source Leakage Current | IGSS | 1 | µA | VDS = 0 V, VGS = 5 V | 2 | ||
| Gate Threshold Voltage | VGS(TH) | 0.4 | 1.3 | V | VGS = VDS, ID = 250 µA | 2 | |
| Drain-to-Source On Resistance | RDS(ON) | 1.5 | 3.4 | Ω | VGS = 4.5 V, ID = 10 mA | 2 | |
| Drain-to-Source On Resistance | RDS(ON) | 1.6 | 3.8 | Ω | VGS = 4.5 V, ID = 255 mA | 2 | |
| Drain-to-Source On Resistance | RDS(ON) | 2.4 | 4.5 | Ω | VGS = 2.5 V, ID = 1 mA | 2 | |
| Drain-to-Source On Resistance | RDS(ON) | 5.1 | 10 | Ω | VGS = 1.8 V, ID = 1 mA | 2 | |
| Drain-to-Source On Resistance | RDS(ON) | 6.8 | 15 | Ω | VGS = 1.65 V, ID = 1 mA | 2 | |
| Forward Diode Voltage | VSD | 0.83 | 1.2 | V | VGS = 0 V, IS = 286 mA, TJ = 25C | 2 |
CAD (KiCad official)
- Symbol:
NTK3043NT1G - Footprint:
Package_TO_SOT_SMD:SOT-723 - 3D model: SOT-723, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.5 mm nominal SOT-723 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
ntk3043nt1g-etched.step/ntk3043nt1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ntk3043nt1g.step/ntk3043nt1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (5 pp, sha256
e079b1f7af2ffd1a, retrieved 2026-10-21, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# NTK3043NT1G
**onsemi** · MOSFETs · SOT-723
NTK3043NT1G from onsemi, in a SOT-723. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the N-channel MOSFET; the gate-to-source voltage is rated at VGS = 10 V maximum. |
| 2 | Source | passive | Source terminal of the MOSFET; source (body diode) current IS is rated at 286 mA maximum. |
| 3 | Drain | passive | Drain terminal of the MOSFET; drain-to-source voltage is rated at VDSS = 20 V, with continuous drain current ID of 255 mA at TA = 25C steady state (285 mA for t ≤ 5 s). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-723 |
| Category | Transistors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Voltage | VDSS | | | 20 | V | | 1 |
| Gate-to-Source Voltage | VGS | | | 10 | V | | 1 |
| Continuous Drain Current | ID | | | 255 | mA | Steady state, TA = 25C (Note 1) | 1 |
| Continuous Drain Current | ID | | | 185 | mA | Steady state, TA = 85C (Note 1) | 1 |
| Continuous Drain Current | ID | | | 285 | mA | t ≤ 5 s, TA = 25C (Note 1) | 1 |
| Continuous Drain Current | ID | | | 210 | mA | Steady state, TA = 25C (Note 2) | 1 |
| Continuous Drain Current | ID | | | 155 | mA | Steady state, TA = 85C (Note 2) | 1 |
| Power Dissipation | PD | | | 440 | mW | Steady state, TA = 25C (Note 1) | 1 |
| Power Dissipation | PD | | | 545 | mW | t ≤ 5 s, TA = 25C (Note 1) | 1 |
| Power Dissipation | PD | | | 310 | mW | TA = 25C (Note 2) | 1 |
| Pulsed Drain Current | IDM | | | 400 | mA | tp = 10 s | 1 |
| Operating Junction and Storage Temperature | TJ, TSTG | -55 | | 150 | C | | 1 |
| Source Current (Body Diode) (Note 2) | IS | | | 286 | mA | | 1 |
| Lead Temperature for Soldering Purposes | TL | | | 260 | C | 1/8 in from case for 10 s | 1 |
| Junction-to-Ambient, Steady State (Note 3) | RθJA | | | 280 | C/W | Surface-mounted on FR4, 1 in sq pad | 2 |
| Junction-to-Ambient, t = 5 s (Note 3) | RθJA | | | 228 | C/W | t = 5 s, surface-mounted on FR4, 1 in sq pad | 2 |
| Junction-to-Ambient, Steady State Minimum Pad (Note 4) | RθJA | | | 400 | C/W | Surface-mounted on FR4, minimum recommended pad size | 2 |
| Drain-to-Source Breakdown Voltage | V(BR)DSS | 20 | | | V | VGS = 0 V, ID = 100 µA | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | µA | VGS = 0 V, VDS = 16 V, TJ = 25C | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 10 | µA | VGS = 0 V, VDS = 16 V, TJ = 125C | 2 |
| Gate-to-Source Leakage Current | IGSS | | | 1 | µA | VDS = 0 V, VGS = 5 V | 2 |
| Gate Threshold Voltage | VGS(TH) | 0.4 | | 1.3 | V | VGS = VDS, ID = 250 µA | 2 |
| Drain-to-Source On Resistance | RDS(ON) | | 1.5 | 3.4 | Ω | VGS = 4.5 V, ID = 10 mA | 2 |
| Drain-to-Source On Resistance | RDS(ON) | | 1.6 | 3.8 | Ω | VGS = 4.5 V, ID = 255 mA | 2 |
| Drain-to-Source On Resistance | RDS(ON) | | 2.4 | 4.5 | Ω | VGS = 2.5 V, ID = 1 mA | 2 |
| Drain-to-Source On Resistance | RDS(ON) | | 5.1 | 10 | Ω | VGS = 1.8 V, ID = 1 mA | 2 |
| Drain-to-Source On Resistance | RDS(ON) | | 6.8 | 15 | Ω | VGS = 1.65 V, ID = 1 mA | 2 |
| Forward Diode Voltage | VSD | | 0.83 | 1.2 | V | VGS = 0 V, IS = 286 mA, TJ = 25C | 2 |
## CAD (KiCad official)
- Symbol: `NTK3043NT1G`
- Footprint: `Package_TO_SOT_SMD:SOT-723`
- 3D model: SOT-723, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.5 mm nominal SOT-723 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `ntk3043nt1g-etched.step` / `ntk3043nt1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ntk3043nt1g.step` / `ntk3043nt1g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/ntk3043nt1-d.pdf) (5 pp, sha256 `e079b1f7af2ffd1a`, retrieved 2026-10-21, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ntk3043nt1g-datasheet.pdf)