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NTK3043NT1G

onsemi · MOSFETs · SOT-723

NTK3043NT1G from onsemi, in a SOT-723. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal of the N-channel MOSFET; the gate-to-source voltage is rated at VGS = 10 V maximum.
2 Source passive Source terminal of the MOSFET; source (body diode) current IS is rated at 286 mA maximum.
3 Drain passive Drain terminal of the MOSFET; drain-to-source voltage is rated at VDSS = 20 V, with continuous drain current ID of 255 mA at TA = 25C steady state (285 mA for t ≤ 5 s).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-723
Category Transistors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDSS 20 V 1
Gate-to-Source Voltage VGS 10 V 1
Continuous Drain Current ID 255 mA Steady state, TA = 25C (Note 1) 1
Continuous Drain Current ID 185 mA Steady state, TA = 85C (Note 1) 1
Continuous Drain Current ID 285 mA t ≤ 5 s, TA = 25C (Note 1) 1
Continuous Drain Current ID 210 mA Steady state, TA = 25C (Note 2) 1
Continuous Drain Current ID 155 mA Steady state, TA = 85C (Note 2) 1
Power Dissipation PD 440 mW Steady state, TA = 25C (Note 1) 1
Power Dissipation PD 545 mW t ≤ 5 s, TA = 25C (Note 1) 1
Power Dissipation PD 310 mW TA = 25C (Note 2) 1
Pulsed Drain Current IDM 400 mA tp = 10 s 1
Operating Junction and Storage Temperature TJ, TSTG -55 150 C 1
Source Current (Body Diode) (Note 2) IS 286 mA 1
Lead Temperature for Soldering Purposes TL 260 C 1/8 in from case for 10 s 1
Junction-to-Ambient, Steady State (Note 3) RθJA 280 C/W Surface-mounted on FR4, 1 in sq pad 2
Junction-to-Ambient, t = 5 s (Note 3) RθJA 228 C/W t = 5 s, surface-mounted on FR4, 1 in sq pad 2
Junction-to-Ambient, Steady State Minimum Pad (Note 4) RθJA 400 C/W Surface-mounted on FR4, minimum recommended pad size 2
Drain-to-Source Breakdown Voltage V(BR)DSS 20 V VGS = 0 V, ID = 100 µA 2
Zero Gate Voltage Drain Current IDSS 1 µA VGS = 0 V, VDS = 16 V, TJ = 25C 2
Zero Gate Voltage Drain Current IDSS 10 µA VGS = 0 V, VDS = 16 V, TJ = 125C 2
Gate-to-Source Leakage Current IGSS 1 µA VDS = 0 V, VGS = 5 V 2
Gate Threshold Voltage VGS(TH) 0.4 1.3 V VGS = VDS, ID = 250 µA 2
Drain-to-Source On Resistance RDS(ON) 1.5 3.4 Ω VGS = 4.5 V, ID = 10 mA 2
Drain-to-Source On Resistance RDS(ON) 1.6 3.8 Ω VGS = 4.5 V, ID = 255 mA 2
Drain-to-Source On Resistance RDS(ON) 2.4 4.5 Ω VGS = 2.5 V, ID = 1 mA 2
Drain-to-Source On Resistance RDS(ON) 5.1 10 Ω VGS = 1.8 V, ID = 1 mA 2
Drain-to-Source On Resistance RDS(ON) 6.8 15 Ω VGS = 1.65 V, ID = 1 mA 2
Forward Diode Voltage VSD 0.83 1.2 V VGS = 0 V, IS = 286 mA, TJ = 25C 2

CAD (KiCad official)

  • Symbol: NTK3043NT1G
  • Footprint: Package_TO_SOT_SMD:SOT-723
  • 3D model: SOT-723, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.5 mm nominal SOT-723 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: ntk3043nt1g-etched.step / ntk3043nt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ntk3043nt1g.step / ntk3043nt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 e079b1f7af2ffd1a, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF