component
NSS40301MDR2G
Public Made by Adomby adom
onsemi Bipolar (BJT), SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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NSS40301MDR2G
onsemi · Bipolar (BJT) · SOIC-8
NSS40301MDR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | E1 | passive | Emitter of NPN die #1 (Style 16 pinout); transistor rated VCEO 40 V, IC 3.0 A continuous. |
| 2 | B1 | input | Base of NPN die #1 (Style 16 pinout); VEBO max 6.0 Vdc. |
| 3 | E2 | passive | Emitter of NPN die #2 (Style 16 pinout); transistor rated VCEO 40 V, IC 3.0 A continuous. |
| 4 | B2 | input | Base of NPN die #2 (Style 16 pinout); VEBO max 6.0 Vdc. |
| 5 | C2 | passive | Collector of NPN die #2, tied with pin 6 (Style 16 pinout); VCEO 40 V, IC 3.0 A continuous, 6.0 A peak. |
| 6 | C2 | passive | Collector of NPN die #2, tied with pin 5 (Style 16 pinout); VCEO 40 V, IC 3.0 A continuous, 6.0 A peak. |
| 7 | C1 | passive | Collector of NPN die #1, tied with pin 8 (Style 16 pinout); VCEO 40 V, IC 3.0 A continuous, 6.0 A peak. |
| 8 | C1 | passive | Collector of NPN die #1, tied with pin 7 (Style 16 pinout); VCEO 40 V, IC 3.0 A continuous, 6.0 A peak. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector−Emitter Voltage | VCEO | 40 | Vdc | Maximum Ratings, TA = 25°C | 1 | ||
| Collector−Base Voltage | VCBO | 40 | Vdc | Maximum Ratings, TA = 25°C | 1 | ||
| Emitter−Base Voltage | VEBO | 6 | Vdc | Maximum Ratings, TA = 25°C | 1 | ||
| Collector Current − Continuous | IC | 3 | A | Maximum Ratings, TA = 25°C | 1 | ||
| Collector Current − Peak | ICM | 6 | A | Maximum Ratings, TA = 25°C | 1 | ||
| Total Device Dissipation, single heated | PD | 576 | mW | Single heated; TA = 25°C; FR-4 @ 10 mm2, 1 oz. copper traces, still air (Note 1) | 2 | ||
| Derate above 25°C, single heated | PD | 4.6 | mW/°C | Single heated; derate above 25°C; FR-4 @ 10 mm2 (Note 1) | 2 | ||
| Thermal Resistance, Junction−to−Ambient, single heated | RJA | 217 | °C/W | Single heated; FR-4 @ 10 mm2, 1 oz. copper traces, still air (Note 1) | 2 | ||
| Total Device Dissipation, single heated | PD | 676 | mW | Single heated; TA = 25°C; FR-4 @ 100 mm2, 1 oz. copper traces, still air (Note 2) | 2 | ||
| Derate above 25°C, single heated | PD | 5.4 | mW/°C | Single heated; derate above 25°C; FR-4 @ 100 mm2 (Note 2) | 2 | ||
| Thermal Resistance, Junction−to−Ambient, single heated | RJA | 185 | °C/W | Single heated; FR-4 @ 100 mm2, 1 oz. copper traces, still air (Note 2) | 2 | ||
| Total Device Dissipation, dual heated | PD | 653 | mW | Dual heated; TA = 25°C; FR-4 @ 10 mm2, 1 oz. copper traces, still air (Note 1, Note 3) | 2 | ||
| Derate above 25°C, dual heated | PD | 5.2 | mW/°C | Dual heated; derate above 25°C; FR-4 @ 10 mm2 (Note 1, Note 3) | 2 | ||
| Thermal Resistance, Junction−to−Ambient, dual heated | RJA | 191 | °C/W | Dual heated; FR-4 @ 10 mm2, 1 oz. copper traces, still air (Note 1, Note 3) | 2 | ||
| Total Device Dissipation, dual heated | PD | 783 | mW | Dual heated; TA = 25°C; FR-4 @ 100 mm2, 1 oz. copper traces, still air (Note 2, Note 3) | 2 | ||
| Derate above 25°C, dual heated | PD | 6.3 | mW/°C | Dual heated; derate above 25°C; FR-4 @ 100 mm2 (Note 2, Note 3) | 2 | ||
| Thermal Resistance, Junction−to−Ambient, dual heated | RJA | 160 | °C/W | Dual heated; FR-4 @ 100 mm2, 1 oz. copper traces, still air (Note 2, Note 3) | 2 | ||
| Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 2 | ||
| Collector−Emitter Breakdown Voltage | V(BR)CEO | 40 | Vdc | IC = 10 mAdc, IB = 0 | 3 | ||
| Collector−Base Breakdown Voltage | V(BR)CBO | 40 | Vdc | IC = 0.1 mAdc, IE = 0 | 3 | ||
| Emitter−Base Breakdown Voltage | V(BR)EBO | 6 | Vdc | IE = 0.1 mAdc, IC = 0 | 3 | ||
| Collector Cutoff Current | ICBO | 0.1 | Adc | VCB = 40 Vdc, IE = 0 | 3 | ||
| Emitter Cutoff Current | IEBO | 0.1 | Adc | VEB = 6.0 Vdc | 3 | ||
| DC Current Gain | hFE | 200 | 400 | IC = 10 mA, VCE = 2.0 V (Note 4) | 3 | ||
| DC Current Gain | hFE | 200 | 350 | IC = 500 mA, VCE = 2.0 V (Note 4) | 3 | ||
| DC Current Gain | hFE | 180 | 340 | IC = 1.0 A, VCE = 2.0 V (Note 4) | 3 | ||
| DC Current Gain | hFE | 180 | 320 | IC = 2.0 A, VCE = 2.0 V (Note 4) | 3 | ||
| DC Current Gain ratio, one transistor to the other in same package | hFE(1)/hFE(2) | 0.9 | 0.99 | IC = 2.0 A, VCE = 2.0 V (Note 5) | 3 | ||
| Collector−Emitter Saturation Voltage | VCE(sat) | 0.008 | 0.011 | V | IC = 0.1 A, IB = 0.010 A (Note 4) | 3 | |
| Collector−Emitter Saturation Voltage | VCE(sat) | 0.044 | 0.06 | V | IC = 1.0 A, IB = 0.100 A (Note 4) | 3 | |
| Collector−Emitter Saturation Voltage | VCE(sat) | 0.08 | 0.115 | V | IC = 1.0 A, IB = 0.010 A (Note 4) | 3 | |
| Collector−Emitter Saturation Voltage | VCE(sat) | 0.082 | 0.115 | V | IC = 2.0 A, IB = 0.200 A (Note 4) | 3 | |
| Base−Emitter Saturation Voltage | VBE(sat) | 0.78 | 0.9 | V | IC = 1.0 A, IB = 0.01 A (Note 4) | 3 | |
| Base−Emitter Turn−on Voltage | VBE(on) | 0.65 | 0.75 | V | IC = 0.1 A, VCE = 2.0 V (Note 4) | 3 | |
| Base−Emitter Turn−on Voltage difference, one transistor to the other in same package | VBE(1) − VBE(2) | 0.3 | 2 | mV | IC = 0.1 A, VCE = 2.0 V (Note 6) | 3 | |
| Cutoff Frequency | fT | 100 | MHz | IC = 100 mA, VCE = 5.0 V, f = 100 MHz | 3 | ||
| Input Capacitance | Cibo | 320 | 450 | pF | VEB = 0.5 V, f = 1.0 MHz | 3 | |
| Output Capacitance | Cobo | 40 | 50 | pF | VCB = 3.0 V, f = 1.0 MHz | 3 | |
| Delay Time | td | 100 | ns | VCC = 30 V, IC = 750 mA, IB1 = 15 mA | 3 | ||
| Rise Time | tr | 100 | ns | VCC = 30 V, IC = 750 mA, IB1 = 15 mA | 3 | ||
| Storage Time | ts | 780 | ns | VCC = 30 V, IC = 750 mA, IB1 = 15 mA | 3 | ||
| Fall Time | tf | 110 | ns | VCC = 30 V, IC = 750 mA, IB1 = 15 mA | 3 |
CAD (KiCad official)
- Symbol:
NSS40301MDR2G - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
nss40301mdr2g-etched.step/nss40301mdr2g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);nss40301mdr2g.step/nss40301mdr2g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (8 pp, sha256
3539b8f545a7f7e7, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# NSS40301MDR2G
**onsemi** · Bipolar (BJT) · SOIC-8
NSS40301MDR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | E1 | passive | Emitter of NPN die #1 (Style 16 pinout); transistor rated VCEO 40 V, IC 3.0 A continuous. |
| 2 | B1 | input | Base of NPN die #1 (Style 16 pinout); VEBO max 6.0 Vdc. |
| 3 | E2 | passive | Emitter of NPN die #2 (Style 16 pinout); transistor rated VCEO 40 V, IC 3.0 A continuous. |
| 4 | B2 | input | Base of NPN die #2 (Style 16 pinout); VEBO max 6.0 Vdc. |
| 5 | C2 | passive | Collector of NPN die #2, tied with pin 6 (Style 16 pinout); VCEO 40 V, IC 3.0 A continuous, 6.0 A peak. |
| 6 | C2 | passive | Collector of NPN die #2, tied with pin 5 (Style 16 pinout); VCEO 40 V, IC 3.0 A continuous, 6.0 A peak. |
| 7 | C1 | passive | Collector of NPN die #1, tied with pin 8 (Style 16 pinout); VCEO 40 V, IC 3.0 A continuous, 6.0 A peak. |
| 8 | C1 | passive | Collector of NPN die #1, tied with pin 7 (Style 16 pinout); VCEO 40 V, IC 3.0 A continuous, 6.0 A peak. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector−Emitter Voltage | VCEO | | | 40 | Vdc | Maximum Ratings, TA = 25°C | 1 |
| Collector−Base Voltage | VCBO | | | 40 | Vdc | Maximum Ratings, TA = 25°C | 1 |
| Emitter−Base Voltage | VEBO | | | 6 | Vdc | Maximum Ratings, TA = 25°C | 1 |
| Collector Current − Continuous | IC | | | 3 | A | Maximum Ratings, TA = 25°C | 1 |
| Collector Current − Peak | ICM | | | 6 | A | Maximum Ratings, TA = 25°C | 1 |
| Total Device Dissipation, single heated | PD | | | 576 | mW | Single heated; TA = 25°C; FR-4 @ 10 mm2, 1 oz. copper traces, still air (Note 1) | 2 |
| Derate above 25°C, single heated | PD | | | 4.6 | mW/°C | Single heated; derate above 25°C; FR-4 @ 10 mm2 (Note 1) | 2 |
| Thermal Resistance, Junction−to−Ambient, single heated | RJA | | | 217 | °C/W | Single heated; FR-4 @ 10 mm2, 1 oz. copper traces, still air (Note 1) | 2 |
| Total Device Dissipation, single heated | PD | | | 676 | mW | Single heated; TA = 25°C; FR-4 @ 100 mm2, 1 oz. copper traces, still air (Note 2) | 2 |
| Derate above 25°C, single heated | PD | | | 5.4 | mW/°C | Single heated; derate above 25°C; FR-4 @ 100 mm2 (Note 2) | 2 |
| Thermal Resistance, Junction−to−Ambient, single heated | RJA | | | 185 | °C/W | Single heated; FR-4 @ 100 mm2, 1 oz. copper traces, still air (Note 2) | 2 |
| Total Device Dissipation, dual heated | PD | | | 653 | mW | Dual heated; TA = 25°C; FR-4 @ 10 mm2, 1 oz. copper traces, still air (Note 1, Note 3) | 2 |
| Derate above 25°C, dual heated | PD | | | 5.2 | mW/°C | Dual heated; derate above 25°C; FR-4 @ 10 mm2 (Note 1, Note 3) | 2 |
| Thermal Resistance, Junction−to−Ambient, dual heated | RJA | | | 191 | °C/W | Dual heated; FR-4 @ 10 mm2, 1 oz. copper traces, still air (Note 1, Note 3) | 2 |
| Total Device Dissipation, dual heated | PD | | | 783 | mW | Dual heated; TA = 25°C; FR-4 @ 100 mm2, 1 oz. copper traces, still air (Note 2, Note 3) | 2 |
| Derate above 25°C, dual heated | PD | | | 6.3 | mW/°C | Dual heated; derate above 25°C; FR-4 @ 100 mm2 (Note 2, Note 3) | 2 |
| Thermal Resistance, Junction−to−Ambient, dual heated | RJA | | | 160 | °C/W | Dual heated; FR-4 @ 100 mm2, 1 oz. copper traces, still air (Note 2, Note 3) | 2 |
| Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 2 |
| Collector−Emitter Breakdown Voltage | V(BR)CEO | 40 | | | Vdc | IC = 10 mAdc, IB = 0 | 3 |
| Collector−Base Breakdown Voltage | V(BR)CBO | 40 | | | Vdc | IC = 0.1 mAdc, IE = 0 | 3 |
| Emitter−Base Breakdown Voltage | V(BR)EBO | 6 | | | Vdc | IE = 0.1 mAdc, IC = 0 | 3 |
| Collector Cutoff Current | ICBO | | | 0.1 | Adc | VCB = 40 Vdc, IE = 0 | 3 |
| Emitter Cutoff Current | IEBO | | | 0.1 | Adc | VEB = 6.0 Vdc | 3 |
| DC Current Gain | hFE | 200 | | 400 | | IC = 10 mA, VCE = 2.0 V (Note 4) | 3 |
| DC Current Gain | hFE | 200 | | 350 | | IC = 500 mA, VCE = 2.0 V (Note 4) | 3 |
| DC Current Gain | hFE | 180 | | 340 | | IC = 1.0 A, VCE = 2.0 V (Note 4) | 3 |
| DC Current Gain | hFE | 180 | | 320 | | IC = 2.0 A, VCE = 2.0 V (Note 4) | 3 |
| DC Current Gain ratio, one transistor to the other in same package | hFE(1)/hFE(2) | 0.9 | | 0.99 | | IC = 2.0 A, VCE = 2.0 V (Note 5) | 3 |
| Collector−Emitter Saturation Voltage | VCE(sat) | | 0.008 | 0.011 | V | IC = 0.1 A, IB = 0.010 A (Note 4) | 3 |
| Collector−Emitter Saturation Voltage | VCE(sat) | | 0.044 | 0.06 | V | IC = 1.0 A, IB = 0.100 A (Note 4) | 3 |
| Collector−Emitter Saturation Voltage | VCE(sat) | | 0.08 | 0.115 | V | IC = 1.0 A, IB = 0.010 A (Note 4) | 3 |
| Collector−Emitter Saturation Voltage | VCE(sat) | | 0.082 | 0.115 | V | IC = 2.0 A, IB = 0.200 A (Note 4) | 3 |
| Base−Emitter Saturation Voltage | VBE(sat) | | 0.78 | 0.9 | V | IC = 1.0 A, IB = 0.01 A (Note 4) | 3 |
| Base−Emitter Turn−on Voltage | VBE(on) | | 0.65 | 0.75 | V | IC = 0.1 A, VCE = 2.0 V (Note 4) | 3 |
| Base−Emitter Turn−on Voltage difference, one transistor to the other in same package | VBE(1) − VBE(2) | | 0.3 | 2 | mV | IC = 0.1 A, VCE = 2.0 V (Note 6) | 3 |
| Cutoff Frequency | fT | 100 | | | MHz | IC = 100 mA, VCE = 5.0 V, f = 100 MHz | 3 |
| Input Capacitance | Cibo | | 320 | 450 | pF | VEB = 0.5 V, f = 1.0 MHz | 3 |
| Output Capacitance | Cobo | | 40 | 50 | pF | VCB = 3.0 V, f = 1.0 MHz | 3 |
| Delay Time | td | | | 100 | ns | VCC = 30 V, IC = 750 mA, IB1 = 15 mA | 3 |
| Rise Time | tr | | | 100 | ns | VCC = 30 V, IC = 750 mA, IB1 = 15 mA | 3 |
| Storage Time | ts | | | 780 | ns | VCC = 30 V, IC = 750 mA, IB1 = 15 mA | 3 |
| Fall Time | tf | | | 110 | ns | VCC = 30 V, IC = 750 mA, IB1 = 15 mA | 3 |
## CAD (KiCad official)
- Symbol: `NSS40301MDR2G`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `nss40301mdr2g-etched.step` / `nss40301mdr2g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `nss40301mdr2g.step` / `nss40301mdr2g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588929576034570240) (8 pp, sha256 `3539b8f545a7f7e7`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/nss40301mdr2g-datasheet.pdf)