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NSIC2020JBT3G

Public Made by Adom

by adom

onsemi LED Drivers, DO-214AA(SMB). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NSIC2020JBT3G

onsemi · LED Drivers · DO-214AA(SMB)

NSIC2020JBT3G from onsemi, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the constant current regulator, which regulates about 20 mA (17-23 mA) at Vak = 7.5 V and withstands up to 120 V anode-cathode.
2 Anode passive Anode terminal of the constant current regulator, with a maximum anode-cathode voltage (Vak) of 120 V and a reverse voltage (VR) limit of 500 mV.

Key specifications

Parameter Value
Manufacturer onsemi
Package DO-214AA(SMB)
Category Display Modules / LED Drivers / Display Drivers
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Steady State Current Ireg(SS) 17 20 23 mA Vak = 7.5 V, TA = 25°C (Note 1) 2
Pulse Current Ireg(P) 17.3 20.9 24.3 mA Vak = 7.5 V, TA = 25°C (Note 3) 2
Voltage Overhead Voverhead 1.8 V Note 2, typical value for 85% Ireg(SS) 2
Anode-Cathode Voltage Vak 120 V TA = 25°C 2
Reverse Voltage VR 500 mV TA = 25°C 2
Operating Junction and Storage Temperature Range TJ, Tstg -55 175 °C TA = 25°C 2
Total Device Dissipation PD 1210 mW TA = 25°C, 100 mm2, 1 oz. Cu, still air (Note 1) 3
Thermal Resistance, Junction-to-Ambient RθJA 124 °C/W 100 mm2, 1 oz. Cu, still air (Note 1) 3
Thermal Reference, Junction-to-Tab RψJL 17.5 °C/W 100 mm2, 1 oz. Cu, still air (Note 1) 3
Total Device Dissipation PD 1282 mW TA = 25°C, 100 mm2, 2 oz. Cu, still air (Note 2) 3
Thermal Resistance, Junction-to-Ambient RθJA 117 °C/W 100 mm2, 2 oz. Cu, still air (Note 2) 3
Total Device Dissipation PD 1667 mW TA = 25°C, 300 mm2, 1 oz. Cu, still air (Note 3) 3
Thermal Resistance, Junction-to-Ambient RθJA 90 °C/W 300 mm2, 1 oz. Cu, still air (Note 3) 3
Total Device Dissipation PD 1765 mW TA = 25°C, 300 mm2, 2 oz. Cu, still air (Note 4) 3
Thermal Resistance, Junction-to-Ambient RθJA 85 °C/W 300 mm2, 2 oz. Cu, still air (Note 4) 3
Total Device Dissipation PD 1948 mW TA = 25°C, 500 mm2, 1 oz. Cu, still air (Note 5) 3
Thermal Resistance, Junction-to-Ambient RθJA 77 °C/W 500 mm2, 1 oz. Cu, still air (Note 5) 3
Total Device Dissipation PD 2055 mW TA = 25°C, 500 mm2, 2 oz. Cu, still air (Note 6) 3
Thermal Resistance, Junction-to-Ambient RθJA 73 °C/W 500 mm2, 2 oz. Cu, still air (Note 6) 3
Total Device Dissipation PD 2149 mW TA = 25°C, 700 mm2, 1 oz. Cu, still air (Note 7) 3
Thermal Resistance, Junction-to-Ambient RθJA 69.8 °C/W 700 mm2, 1 oz. Cu, still air (Note 7) 3
Total Device Dissipation PD 2269 mW TA = 25°C, 700 mm2, 2 oz. Cu, still air (Note 8) 3
Thermal Resistance, Junction-to-Ambient RθJA 66.1 °C/W 700 mm2, 2 oz. Cu, still air (Note 8) 3
Total Device Dissipation PD 2609 mW TA = 25°C, 1000 mm2, 3 oz. Cu, still air (Note 9) 3
Thermal Resistance, Junction-to-Ambient RθJA 57.5 °C/W 1000 mm2, 3 oz. Cu, still air (Note 9) 3
Total Device Dissipation PD 2500 mW TA = 25°C, 400 mm2, DENKA K1 PCB, 2 oz. Cu, still air (Note 10) 3
Thermal Resistance, Junction-to-Ambient RθJA 60 °C/W 400 mm2, DENKA K1 PCB, 2 oz. Cu, still air (Note 10) 3
Total Device Dissipation PD 3000 mW TA = 25°C, 900 mm2, DENKA K1 PCB, 2 oz. Cu, still air (Note 11) 3
Thermal Resistance, Junction-to-Ambient RθJA 50 °C/W 900 mm2, DENKA K1 PCB, 2 oz. Cu, still air (Note 11) 3
Thermal Reference, Junction-to-Tab RψJL 16 °C/W 900 mm2, DENKA K1 PCB, 2 oz. Cu, still air (Note 11) 3
Current temperature coefficient -0.04 mA/°C approximate, Figure 2, Vak @ 7.5 V 4

CAD (KiCad official)

  • Symbol: NSIC2020JBT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
  • 3D model files: nsic2020jbt3g-etched.step / nsic2020jbt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nsic2020jbt3g.step / nsic2020jbt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 8d7f3f46da9d99ee, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF