component
NSIC2020JBT3G
Public Made by Adomby adom
onsemi LED Drivers, DO-214AA(SMB). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownNSIC2020JBT3G
onsemi · LED Drivers · DO-214AA(SMB)
NSIC2020JBT3G from onsemi, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the constant current regulator, which regulates about 20 mA (17-23 mA) at Vak = 7.5 V and withstands up to 120 V anode-cathode. |
| 2 | Anode | passive | Anode terminal of the constant current regulator, with a maximum anode-cathode voltage (Vak) of 120 V and a reverse voltage (VR) limit of 500 mV. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | DO-214AA(SMB) |
| Category | Display Modules / LED Drivers / Display Drivers |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Steady State Current | Ireg(SS) | 17 | 20 | 23 | mA | Vak = 7.5 V, TA = 25°C (Note 1) | 2 |
| Pulse Current | Ireg(P) | 17.3 | 20.9 | 24.3 | mA | Vak = 7.5 V, TA = 25°C (Note 3) | 2 |
| Voltage Overhead | Voverhead | 1.8 | V | Note 2, typical value for 85% Ireg(SS) | 2 | ||
| Anode-Cathode Voltage | Vak | 120 | V | TA = 25°C | 2 | ||
| Reverse Voltage | VR | 500 | mV | TA = 25°C | 2 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 175 | °C | TA = 25°C | 2 | |
| Total Device Dissipation | PD | 1210 | mW | TA = 25°C, 100 mm2, 1 oz. Cu, still air (Note 1) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 124 | °C/W | 100 mm2, 1 oz. Cu, still air (Note 1) | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 17.5 | °C/W | 100 mm2, 1 oz. Cu, still air (Note 1) | 3 | ||
| Total Device Dissipation | PD | 1282 | mW | TA = 25°C, 100 mm2, 2 oz. Cu, still air (Note 2) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 117 | °C/W | 100 mm2, 2 oz. Cu, still air (Note 2) | 3 | ||
| Total Device Dissipation | PD | 1667 | mW | TA = 25°C, 300 mm2, 1 oz. Cu, still air (Note 3) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 90 | °C/W | 300 mm2, 1 oz. Cu, still air (Note 3) | 3 | ||
| Total Device Dissipation | PD | 1765 | mW | TA = 25°C, 300 mm2, 2 oz. Cu, still air (Note 4) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 85 | °C/W | 300 mm2, 2 oz. Cu, still air (Note 4) | 3 | ||
| Total Device Dissipation | PD | 1948 | mW | TA = 25°C, 500 mm2, 1 oz. Cu, still air (Note 5) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 77 | °C/W | 500 mm2, 1 oz. Cu, still air (Note 5) | 3 | ||
| Total Device Dissipation | PD | 2055 | mW | TA = 25°C, 500 mm2, 2 oz. Cu, still air (Note 6) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 73 | °C/W | 500 mm2, 2 oz. Cu, still air (Note 6) | 3 | ||
| Total Device Dissipation | PD | 2149 | mW | TA = 25°C, 700 mm2, 1 oz. Cu, still air (Note 7) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 69.8 | °C/W | 700 mm2, 1 oz. Cu, still air (Note 7) | 3 | ||
| Total Device Dissipation | PD | 2269 | mW | TA = 25°C, 700 mm2, 2 oz. Cu, still air (Note 8) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 66.1 | °C/W | 700 mm2, 2 oz. Cu, still air (Note 8) | 3 | ||
| Total Device Dissipation | PD | 2609 | mW | TA = 25°C, 1000 mm2, 3 oz. Cu, still air (Note 9) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 57.5 | °C/W | 1000 mm2, 3 oz. Cu, still air (Note 9) | 3 | ||
| Total Device Dissipation | PD | 2500 | mW | TA = 25°C, 400 mm2, DENKA K1 PCB, 2 oz. Cu, still air (Note 10) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 60 | °C/W | 400 mm2, DENKA K1 PCB, 2 oz. Cu, still air (Note 10) | 3 | ||
| Total Device Dissipation | PD | 3000 | mW | TA = 25°C, 900 mm2, DENKA K1 PCB, 2 oz. Cu, still air (Note 11) | 3 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 50 | °C/W | 900 mm2, DENKA K1 PCB, 2 oz. Cu, still air (Note 11) | 3 | ||
| Thermal Reference, Junction-to-Tab | RψJL | 16 | °C/W | 900 mm2, DENKA K1 PCB, 2 oz. Cu, still air (Note 11) | 3 | ||
| Current temperature coefficient | -0.04 | mA/°C | approximate, Figure 2, Vak @ 7.5 V | 4 |
CAD (KiCad official)
- Symbol:
NSIC2020JBT3G - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
nsic2020jbt3g-etched.step/nsic2020jbt3g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);nsic2020jbt3g.step/nsic2020jbt3g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (8 pp, sha256
8d7f3f46da9d99ee, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).