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NSI45030AZT1G

Public Made by Adom

by adom

onsemi LED Drivers, SOT-223-4. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentdisplay modules - led drivers - display driversnsi45030azt1gfactory-2.0.0extractor-text
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Contents

README

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NSI45030AZT1G

onsemi · LED Drivers · SOT-223-4

NSI45030AZT1G from onsemi, in a SOT-223-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the constant current regulator; Vak max 45 V, regulates 30 mA ±10% at Vak = 7.5 V, can be used as high-side or low-side regulator.
2 Cathode passive Cathode of the constant current regulator (Style 2 pin 2), internally common with pin 4; Vak max 45 V and reverse voltage VR max 500 mV.
3 NC unconnected No connect pin per Style 2 pinout.
4 Cathode passive Cathode tab (Style 2 pin 4, shown as Cathode 2/4) used as the thermal lead with RψJL4 of 37.7 to 42 °C/W depending on board copper.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-223-4
Category Display Modules / LED Drivers / Display Drivers
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Steady State Current Ireg(SS) 27 30 33 mA Vak = 7.5 V, TA = 25°C 2
Pulse Current Ireg(P) 28.4 31.55 34.7 mA Vak = 7.5 V, pulse test 2
Anode-Cathode Voltage Vak 45 V TA = 25°C 1
Reverse Voltage VR 500 mV TA = 25°C 1
Operating and Storage Junction Temperature Range TJ, Tstg -55 150 °C TA = 25°C 1
Total Device Dissipation (FR-4 100 mm2, 1 oz) PD 954 mW TA = 25°C, FR-4 @ 100 mm2, 1 oz. copper, still air 2
Thermal Resistance Junction-to-Ambient (100 mm2, 1 oz) RθJA 131 °C/W FR-4 @ 100 mm2, 1 oz. copper, still air 2
Thermal Reference Junction-to-Lead 4 (100 mm2, 1 oz) RψJL4 40.8 °C/W FR-4 @ 100 mm2, 1 oz. copper, still air 2
Total Device Dissipation (FR-4 100 mm2, 2 oz) PD 1074 mW TA = 25°C, FR-4 @ 100 mm2, 2 oz. copper, still air 2
Thermal Resistance Junction-to-Ambient (100 mm2, 2 oz) RθJA 116 °C/W FR-4 @ 100 mm2, 2 oz. copper, still air 2
Thermal Reference Junction-to-Lead 4 (100 mm2, 2 oz) RψJL4 39.9 °C/W FR-4 @ 100 mm2, 2 oz. copper, still air 2
Total Device Dissipation (FR-4 300 mm2, 1 oz) PD 1150 mW TA = 25°C, FR-4 @ 300 mm2, 1 oz. copper, still air 2
Thermal Resistance Junction-to-Ambient (300 mm2, 1 oz) RθJA 109 °C/W FR-4 @ 300 mm2, 1 oz. copper, still air 2
Thermal Reference Junction-to-Lead 4 (300 mm2, 1 oz) RψJL4 42 °C/W FR-4 @ 300 mm2, 1 oz. copper, still air 2
Total Device Dissipation (FR-4 300 mm2, 2 oz) PD 1300 mW TA = 25°C, FR-4 @ 300 mm2, 2 oz. copper, still air 2
Thermal Resistance Junction-to-Ambient (300 mm2, 2 oz) RθJA 96 °C/W FR-4 @ 300 mm2, 2 oz. copper, still air 2
Thermal Reference Junction-to-Lead 4 (300 mm2, 2 oz) RψJL4 39.4 °C/W FR-4 @ 300 mm2, 2 oz. copper, still air 2
Total Device Dissipation (FR-4 500 mm2, 1 oz) PD 1214 mW TA = 25°C, FR-4 @ 500 mm2, 1 oz. copper, still air 2
Thermal Resistance Junction-to-Ambient (500 mm2, 1 oz) RθJA 103 °C/W FR-4 @ 500 mm2, 1 oz. copper, still air 2
Thermal Reference Junction-to-Lead 4 (500 mm2, 1 oz) RψJL4 40.2 °C/W FR-4 @ 500 mm2, 1 oz. copper, still air 2
Total Device Dissipation (FR-4 500 mm2, 2 oz) PD 1389 mW TA = 25°C, FR-4 @ 500 mm2, 2 oz. copper, still air 2
Thermal Resistance Junction-to-Ambient (500 mm2, 2 oz) RθJA 90 °C/W FR-4 @ 500 mm2, 2 oz. copper, still air 2
Thermal Reference Junction-to-Lead 4 (500 mm2, 2 oz) RψJL4 37.7 °C/W FR-4 @ 500 mm2, 2 oz. copper, still air 2
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 2
Voltage Overhead Voverhead 1.8 V Voverhead = Vin - VLEDs, typical value for 70% Ireg(SS) 2
Capacitance C 2.6 pF Vak = 7.5 V, f = 1 MHz, 0.02 V RMS 2
Capacitance C 6.9 pF Vak = 0 V, f = 1 MHz, 0.02 V RMS 2
Derating above 25°C (100 mm2, 1 oz) PD 7.6 mW/°C FR-4 @ 100 mm2, 1 oz. copper, still air 2
Derating above 25°C (100 mm2, 2 oz) PD 8.6 mW/°C FR-4 @ 100 mm2, 2 oz. copper, still air 2
Derating above 25°C (300 mm2, 1 oz) PD 9.2 mW/°C FR-4 @ 300 mm2, 1 oz. copper, still air 2
Derating above 25°C (300 mm2, 2 oz) PD 10.4 mW/°C FR-4 @ 300 mm2, 2 oz. copper, still air 2
Derating above 25°C (500 mm2, 1 oz) PD 9.7 mW/°C FR-4 @ 500 mm2, 1 oz. copper, still air 2
Derating above 25°C (500 mm2, 2 oz) PD 11.1 mW/°C FR-4 @ 500 mm2, 2 oz. copper, still air 2

CAD (KiCad official)

  • Symbol: NSI45030AZT1G
  • Footprint: Package_TO_SOT_SMD:SOT-223
  • 3D model: SOT-223-4 (KiCad packages3D, STEP)
  • 3D model files: nsi45030azt1g-etched.step / nsi45030azt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nsi45030azt1g.step / nsi45030azt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 7e0412cecdde7146, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF