main
Ray Publish 0.1.0 3019d42 8d ago

NCP45525IMNTWG-H

onsemi · AC-DC Controllers & Regulators · DFN-8-EP(2x2)

NCP45525IMNTWG-H from onsemi, in a DFN-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Drain of the MOSFET with an input voltage range of 0.5 V to 13.5 V, and pin 1 must be connected to pin 9.
2 EN input For the NCP45525-H this active-high digital input turns on the MOSFET and has an internal pull-down resistor to GND, with VIH of 2 V minimum and VIL of 0.8 V maximum.
3 VCC power_in Supply voltage to the controller, specified at 3.0 V to 5.5 V.
4 GND power_in Controller ground.
5 BLEED passive Load bleed connection that must be tied to VOUT either directly or through a resistor of 100 MΩ or less.
6 SR passive Slew rate adjustment pin for the NCP45525; an external capacitor to GND can reduce the slew rate, and the pin may be left floating if not used.
7 VOUT power_out Source of the MOSFET connected to the load.
8 VOUT power_out Source of the MOSFET connected to the load, bonded in parallel with pin 7.
9 VIN power_in Drain of the MOSFET with an input voltage range of 0.5 V to 13.5 V, and must be connected to pin 1.

Key specifications

Parameter Value
Manufacturer onsemi
Package DFN-8-EP(2x2)
Category Power Management ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Range VCC -0.3 6 V 2
Input Voltage Range VIN -0.3 18 V 2
Output Voltage Range VOUT -0.3 18 V 2
EN Digital Input Range VEN -0.3 V upper limit is (VCC + 0.3) V as printed 2
Thermal Resistance, Junction-to-Ambient, Steady State RθJA 40 °C/W surface-mounted on FR4, 1 sq-in pad, 1 oz Cu (Note 2) 2
Thermal Resistance, Junction-to-Ambient, Steady State RθJA 72.7 °C/W surface-mounted on FR4, minimum recommended pad size, 1 oz Cu (Note 3) 2
Thermal Resistance, Junction-to-Case RθJC 5.3 °C/W VIN paddle 2
Continuous MOSFET Current IMAX 6 A TA = 25°C 2
Transient MOSFET Current IMAX_TRANS 24 A for up to 500 s 2
Total Power Dissipation PD 2.5 W TA = 25°C (Notes 2 and 4) 2
Total Power Dissipation PD 1.37 W TA = 25°C (Notes 3 and 4) 2
Storage Temperature Range TSTG -40 150 °C 2
Lead Temperature, Soldering TSLD 260 °C 10 sec. 2
ESD Capability, Human Body Model ESDHBM 3 kV Notes 5 and 6, TA = 25°C 2
ESD Capability, Machine Model ESDMM 200 V Note 5, TA = 25°C 2
ESD Capability, Charged Device Model ESDCDM 1 kV Note 5, TA = 25°C 2
Latch-up Current Immunity LU 100 mA Notes 5 and 6, TA = 25°C 2
Supply Voltage VCC 3 5.5 V 3
Input Voltage VIN 0.5 13.5 V 3
Ambient Temperature TA -40 85 °C 3
Junction Temperature TJ -40 125 °C 3
OFF to ON Transition Energy Dissipation Limit ETRANS 0 100 mJ see application section 3
On-Resistance RON 18 24 mΩ VCC = 3.3 V; VIN = 1.8 V 3
On-Resistance RON 18.8 25 mΩ VCC = 3.3 V; VIN = 5 V 3
On-Resistance RON 21.9 31.7 mΩ VCC = 3.3 V; VIN = 12 V 3
Leakage Current ILEAK 0.1 1 µA VEN = 0 V; VIN = 13.5 V (Note 8) 3
Supply Standby Current ISTBY 0.65 2 µA VEN = 0 V; VCC = 3 V (Note 9) 3
Supply Standby Current ISTBY 3.2 4.5 µA VEN = 0 V; VCC = 5.5 V (Note 9) 3
Supply Dynamic Current IDYN 180 300 µA VEN = VCC = 3 V; VIN = 12 V (Note 10) 3
Supply Dynamic Current IDYN 475 680 µA VEN = VCC = 5.5 V; VIN = 1.8 V (Note 10) 3
Bleed Resistance RBLEED 86 115 144 Ω VEN = 0 V; VCC = 3 V 3
Bleed Resistance RBLEED 72 97 121 Ω VEN = 0 V; VCC = 5.5 V 3
EN Input High Voltage VIH 2 V VCC = 3 V - 5.5 V 3
EN Input Low Voltage VIL 0.8 V VCC = 3 V - 5.5 V 3
EN Input Leakage Current IIL 90 500 nA NCP45525-H; VEN = 0 V 3
EN Pull Down Resistance RPD 76 100 124 kΩ NCP45525-H 3
Slew Rate Control Constant KSR 24 31 38 µA NCP45525; VCC = 3 V (Note 13) 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper the VIN and VOUT pins of the ecoSWITCH to copper 11

CAD (KiCad official)

  • Symbol: NCP45525IMNTWG-H
  • Footprint: Package_DFN_QFN:DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm
  • 3D model: DFN-8-EP(2x2) (KiCad packages3D, STEP)
  • 3D model files: ncp45525imntwg-h-etched.step / ncp45525imntwg-h-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp45525imntwg-h.step / ncp45525imntwg-h.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (16 pp, sha256 214fe2c7a1e78893, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF