NCP45525IMNTWG-H from onsemi, in a DFN-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VIN	power_in	Drain of the MOSFET with an input voltage range of 0.5 V to 13.5 V, and pin 1 must be connected to pin 9.
2	EN	input	For the NCP45525-H this active-high digital input turns on the MOSFET and has an internal pull-down resistor to GND, with VIH of 2 V minimum and VIL of 0.8 V maximum.
3	VCC	power_in	Supply voltage to the controller, specified at 3.0 V to 5.5 V.
4	GND	power_in	Controller ground.
5	BLEED	passive	Load bleed connection that must be tied to VOUT either directly or through a resistor of 100 MΩ or less.
6	SR	passive	Slew rate adjustment pin for the NCP45525; an external capacitor to GND can reduce the slew rate, and the pin may be left floating if not used.
7	VOUT	power_out	Source of the MOSFET connected to the load.
8	VOUT	power_out	Source of the MOSFET connected to the load, bonded in parallel with pin 7.
9	VIN	power_in	Drain of the MOSFET with an input voltage range of 0.5 V to 13.5 V, and must be connected to pin 1.

Key specifications

Parameter	Value
Manufacturer	onsemi
Package	DFN-8-EP(2x2)
Category	Power Management ICs
Pins	9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage Range	VCC	-0.3		6	V		2
Input Voltage Range	VIN	-0.3		18	V		2
Output Voltage Range	VOUT	-0.3		18	V		2
EN Digital Input Range	VEN	-0.3			V	upper limit is (VCC + 0.3) V as printed	2
Thermal Resistance, Junction-to-Ambient, Steady State	RθJA			40	°C/W	surface-mounted on FR4, 1 sq-in pad, 1 oz Cu (Note 2)	2
Thermal Resistance, Junction-to-Ambient, Steady State	RθJA			72.7	°C/W	surface-mounted on FR4, minimum recommended pad size, 1 oz Cu (Note 3)	2
Thermal Resistance, Junction-to-Case	RθJC			5.3	°C/W	VIN paddle	2
Continuous MOSFET Current	IMAX			6	A	TA = 25°C	2
Transient MOSFET Current	IMAX_TRANS			24	A	for up to 500 s	2
Total Power Dissipation	PD			2.5	W	TA = 25°C (Notes 2 and 4)	2
Total Power Dissipation	PD			1.37	W	TA = 25°C (Notes 3 and 4)	2
Storage Temperature Range	TSTG	-40		150	°C		2
Lead Temperature, Soldering	TSLD			260	°C	10 sec.	2
ESD Capability, Human Body Model	ESDHBM			3	kV	Notes 5 and 6, TA = 25°C	2
ESD Capability, Machine Model	ESDMM			200	V	Note 5, TA = 25°C	2
ESD Capability, Charged Device Model	ESDCDM			1	kV	Note 5, TA = 25°C	2
Latch-up Current Immunity	LU			100	mA	Notes 5 and 6, TA = 25°C	2
Supply Voltage	VCC	3		5.5	V		3
Input Voltage	VIN	0.5		13.5	V		3
Ambient Temperature	TA	-40		85	°C		3
Junction Temperature	TJ	-40		125	°C		3
OFF to ON Transition Energy Dissipation Limit	ETRANS	0		100	mJ	see application section	3
On-Resistance	RON		18	24	mΩ	VCC = 3.3 V; VIN = 1.8 V	3
On-Resistance	RON		18.8	25	mΩ	VCC = 3.3 V; VIN = 5 V	3
On-Resistance	RON		21.9	31.7	mΩ	VCC = 3.3 V; VIN = 12 V	3
Leakage Current	ILEAK		0.1	1	µA	VEN = 0 V; VIN = 13.5 V (Note 8)	3
Supply Standby Current	ISTBY		0.65	2	µA	VEN = 0 V; VCC = 3 V (Note 9)	3
Supply Standby Current	ISTBY		3.2	4.5	µA	VEN = 0 V; VCC = 5.5 V (Note 9)	3
Supply Dynamic Current	IDYN		180	300	µA	VEN = VCC = 3 V; VIN = 12 V (Note 10)	3
Supply Dynamic Current	IDYN		475	680	µA	VEN = VCC = 5.5 V; VIN = 1.8 V (Note 10)	3
Bleed Resistance	RBLEED	86	115	144	Ω	VEN = 0 V; VCC = 3 V	3
Bleed Resistance	RBLEED	72	97	121	Ω	VEN = 0 V; VCC = 5.5 V	3
EN Input High Voltage	VIH	2			V	VCC = 3 V - 5.5 V	3
EN Input Low Voltage	VIL			0.8	V	VCC = 3 V - 5.5 V	3
EN Input Leakage Current	IIL		90	500	nA	NCP45525-H; VEN = 0 V	3
EN Pull Down Resistance	RPD	76	100	124	kΩ	NCP45525-H	3
Slew Rate Control Constant	KSR	24	31	38	µA	NCP45525; VCC = 3 V (Note 13)	3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts	copper		the VIN and VOUT pins of the ecoSWITCH to copper	11

CAD (KiCad official)

Symbol: NCP45525IMNTWG-H
Footprint: Package_DFN_QFN:DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm
3D model: DFN-8-EP(2x2) (KiCad packages3D, STEP)
3D model files: ncp45525imntwg-h-etched.step / ncp45525imntwg-h-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp45525imntwg-h.step / ncp45525imntwg-h.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: onsemi datasheet (16 pp, sha256 214fe2c7a1e78893, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

NCP45525IMNTWG-H

Verified NCP45525IMNTWG-H

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README