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NCP3420DR2G

onsemi · Gate Drivers · SOIC-8

NCP3420DR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BST power_in Upper MOSFET floating bootstrap supply; a capacitor between BST and SW holds the bootstrap voltage for the high-side MOSFET, with a recommended value between 100 nF and 1.0 µF, and an external diode is required.
2 IN input Logic-level PWM input with primary control of the drive outputs; input high requires at least 2.0 V and input low is 0.8 V maximum, with absolute maximum rating of 6.5 V.
3 OD input Output Disable input; when low, normal operation is disabled and DRVH and DRVL are forced low, with input high at least 2.0 V, input low at most 0.8 V, and absolute maximum rating of 6.5 V.
4 VCC power_in Input supply with a supply voltage range of 4.6 V to 13.2 V (absolute maximum 15 V), requiring a 1.0 µF ceramic capacitor from this pin to PGND.
5 DRVL output Output drive for the lower (low-side) MOSFET, referenced to PGND and powered from VCC.
6 PGND power_in Power ground, to be closely connected to the source of the lower MOSFET.
7 SWN passive Switch node, connected to the source of the upper MOSFET and serving as the bootstrap supply return; absolute maximum 35 V DC, 40 V for under 50 ns, and -5.0 V DC.
8 DRVH output Output drive for the upper (high-side) MOSFET, referenced to SW and powered from BST.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Range VCC 4.6 13.2 V 4
Supply Current ISYS 0.7 6 mA BST = 12 V, IN = 0 V 4
OD Input Voltage High VOD_HI 2 V 4
OD Input Voltage Low VOD_LO 0.8 V 4
OD Propagation Delay Time (turn-off) tpdlOD 1 25 45 ns 4
OD Propagation Delay Time (turn-on) tpdhOD 1 25 45 ns 4
PWM Input Voltage High VPWM_HI 2 V 4
PWM Input Voltage Low VPWM_LO 0.8 V 4
OD Input Current -1 1 A No internal pull-up or pull-down resistors 4
PWM Input Current -1 1 A No internal pull-up or pull-down resistors 4
High-Side Driver Output Resistance, Sourcing Current 1.8 3 VBST − VSW = 12 V (Note 6) 4
High-Side Driver Output Resistance, Sinking Current 1 2.5 VBST − VSW = 12 V (Note 6) 4
SW Pulldown Resistance 10 55 k SW to PGND 4
High-Side Driver Output Resistance, Unbiased 10 55 k BST−SW = 0 V 4
High-Side Driver Transition Time (rise) trDRVH 16 30 ns VBST − VSW = 12 V, CLOAD = 3.0 nF (See Figure 3) 4
High-Side Driver Transition Time (fall) tfDRVH 11 25 ns VBST − VSW = 12 V, CLOAD = 3.0 nF (See Figure 3) 4
High-Side Driver Propagation Delay (Note 5), turn-on tpdhDRVH 20 30 45 ns VBST − VSW = 12 V, CLOAD = 3.0 nF (See Figure 3) 4
High-Side Driver Propagation Delay (Note 5), turn-off tpdlDRVH 10 30 45 ns VBST − VSW = 12 V, CLOAD = 3.0 nF (See Figure 3) 4
Low-Side Driver Output Resistance, Sourcing Current 1.8 3 VCC = 12 V (Note 6) 4
Low-Side Driver Output Resistance, Sinking Current 1 2.5 VCC − PGND = 12 V (Note 6) 4
Low-Side Driver Output Resistance, Unbiased 10 55 k VCC = PGND 4
Low-Side Driver Transition Time (rise) trDRVL 16 30 ns VBST − VSW = 12 V, CLOAD = 3.0 nF (See Figure 3) 4
Low-Side Driver Transition Time (fall) tfDRVL 11 25 ns VBST − VSW = 12 V, CLOAD = 3.0 nF (See Figure 3) 4
Low-Side Driver Propagation Delay (Note 5), turn-on tpdhDRVL 15 30 45 ns VBST − VSW = 12 V, CLOAD = 3.0 nF (Note 6, tpdhDRVL Only) (See Figure 3) 4
Low-Side Driver Propagation Delay (Note 5), turn-off tpdlDRVL 10 30 45 ns VBST − VSW = 12 V, CLOAD = 3.0 nF (See Figure 3) 4
UVLO Startup 3.9 4.3 4.5 V 4
UVLO Shutdown 3.7 4.1 4.3 V 4
UVLO Hysteresis 0.1 0.2 0.4 V 4
Over Temperature Protection (thermal shutdown) 150 170 °C (Note 6) 4
Operating Ambient Temperature TA 0 85 °C 3
Operating Junction Temperature TJ 0 150 °C Note 1 3
Storage Temperature Range TS -65 150 °C 3
Lead Temperature Soldering (10 sec), Reflow Pb-Free 260 °C Reflow (SMD styles only), Pb−Free (Note 3) 3
Main Supply Voltage Input VCC -0.3 15 V 3
Bootstrap Supply Voltage Input (DC) BST 35 V DC wrt PGND 3
Bootstrap Supply Voltage Input (transient) BST 40 V < 50 ns wrt PGND 3
Bootstrap Supply Voltage Input (wrt SW) BST -0.3 15 V wrt SW 3
Switching Node (DC) SW -5 35 V DC 3
Switching Node (transient high) SW 40 V < 50 ns 3
Switching Node (transient low) SW -10 V < 200 ns 3
High-Side Driver Output (transient, wrt PGND) DRVH 35 V 50 ns wrt/PGND 3
High-Side Driver Output (wrt SW) DRVH -0.3 15 V wrt SW 3
High-Side Driver Output (transient low, wrt SW) DRVH -2 V < 200 ns wrt SW 3
Low-Side Driver Output (DC) DRVL -0.3 V DC 3
Low-Side Driver Output (transient low) DRVL -5 V < 200 ns 3
IN Control Input IN -0.3 6.5 V 3
OD Output Disable Input OD -0.3 6.5 V 3
Package Thermal Resistance SO-8, Junction-to-Case RJC 45 °C/W 3
Package Thermal Resistance SO-8, Junction-to-Ambient RJA 123 °C/W 2-Layer Board 3

CAD (KiCad official)

  • Symbol: NCP3420DR2G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ncp3420dr2g-etched.step / ncp3420dr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp3420dr2g.step / ncp3420dr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 ff86d43935c9d6be, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF