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NCP163AMX300TBG

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onsemi Global Sourcing Parts, XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NCP163AMX300TBG

onsemi · Global Sourcing Parts · XDFN-4-EP(1x1)

NCP163AMX300TBG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output voltage that should be bypassed with a small 1 µF ceramic capacitor placed close to the pin.
2 GND power_in Common ground connection; the exposed pad can be tied to this pin for better power dissipation.
3 EN input Chip enable: VEN below 0.4 V disables the regulator and VEN above 1.2 V enables the LDO; an internal pull-down (typ. 200 nA) keeps it off when unconnected.
4 IN power_in Input voltage supply pin with an operating range of 2.2 V to 5.5 V (absolute maximum −0.3 V to 6 V).
5 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer onsemi
Package XDFN-4-EP(1x1)
Category Global Sourcing Parts
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 2.2 5.5 V 3
Output Voltage Accuracy VOUT -2 2 % VIN = (VOUT(NOM) + 1 V) to 5.5 V; 0 mA ≤ IOUT ≤ 250 mA 3
Dropout Voltage (XDFN4, VOUT(NOM) = 3.0 V) VDO 90 155 mV IOUT = 250 mA (WLCSP, XDFN4 packages), VOUT(NOM) = 3.0 V 3
Output Current Limit ICL 250 700 mA VOUT = 90% VOUT(NOM) 3
Quiescent Current IQ 12 20 µA IOUT = 0 mA 3
Shutdown Current IDIS 0.01 1 µA VEN ≤ 0.4 V, VIN = 4.8 V 3
EN Input Voltage "H" VENH 1.2 V 3
EN Input Voltage "L" VENL 0.4 V 3
EN Pull Down Current IEN 0.2 0.5 µA VEN = 4.8 V 3
Line Transient TranLINE -1 mV VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V) in 30 µs, IOUT = 1 mA 4
Line Transient TranLINE 1 mV VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V) in 30 µs, IOUT = 1 mA 4
Load Transient TranLOAD -40 mV IOUT = 1 mA to 200 mA in 10 µs 4
Load Transient TranLOAD 40 mV IOUT = 200 mA to 1 mA in 10 µs 4
Input Voltage (Absolute Maximum) VIN -0.3 6 V 2
Output Voltage (Absolute Maximum) VOUT -0.3 6 V −0.3 to VIN + 0.3, max. 6 V 2
Chip Enable Input (Absolute Maximum) VCE -0.3 6 V 2
Maximum Junction Temperature TJ 150 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V EIA/JESD22-A114 2
ESD Capability, Machine Model ESDMM 200 V EIA/JESD22-A115 2
ESD Capability, Charged Device Model ESDCDM 1000 V EIA/JESD22-C101 2
Operating Junction Temperature Range TJ -40 125 °C Electrical characteristics temperature range 3
Input Capacitor CIN 1 µF Ceramic, X7R or X5R recommended 13
Output Capacitor Effective Capacitance COUT 0.7 µF Minimum effective capacitance over temperature, DC bias and package size 13
Output Capacitor ESR ESR 2 Ω COUT maximum ESR 13
Thermal Resistance, Junction-to-Air (XDFN4) RJA 198.1 °C/W Note 3, JEDEC board (JESD51-7) 3

CAD (KiCad official)

  • Symbol: NCP163AMX300TBG
  • Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: ncp163amx300tbg-etched.step / ncp163amx300tbg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp163amx300tbg.step / ncp163amx300tbg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (23 pp, sha256 024c06f95e392f4d, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF