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NCP163AMX300TBG
Public Made by Adomby adom
onsemi Global Sourcing Parts, XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownNCP163AMX300TBG
onsemi · Global Sourcing Parts · XDFN-4-EP(1x1)
NCP163AMX300TBG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output voltage that should be bypassed with a small 1 µF ceramic capacitor placed close to the pin. |
| 2 | GND | power_in | Common ground connection; the exposed pad can be tied to this pin for better power dissipation. |
| 3 | EN | input | Chip enable: VEN below 0.4 V disables the regulator and VEN above 1.2 V enables the LDO; an internal pull-down (typ. 200 nA) keeps it off when unconnected. |
| 4 | IN | power_in | Input voltage supply pin with an operating range of 2.2 V to 5.5 V (absolute maximum −0.3 V to 6 V). |
| 5 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | XDFN-4-EP(1x1) |
| Category | Global Sourcing Parts |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Input Voltage | VIN | 2.2 | 5.5 | V | 3 | ||
| Output Voltage Accuracy | VOUT | -2 | 2 | % | VIN = (VOUT(NOM) + 1 V) to 5.5 V; 0 mA ≤ IOUT ≤ 250 mA | 3 | |
| Dropout Voltage (XDFN4, VOUT(NOM) = 3.0 V) | VDO | 90 | 155 | mV | IOUT = 250 mA (WLCSP, XDFN4 packages), VOUT(NOM) = 3.0 V | 3 | |
| Output Current Limit | ICL | 250 | 700 | mA | VOUT = 90% VOUT(NOM) | 3 | |
| Quiescent Current | IQ | 12 | 20 | µA | IOUT = 0 mA | 3 | |
| Shutdown Current | IDIS | 0.01 | 1 | µA | VEN ≤ 0.4 V, VIN = 4.8 V | 3 | |
| EN Input Voltage "H" | VENH | 1.2 | V | 3 | |||
| EN Input Voltage "L" | VENL | 0.4 | V | 3 | |||
| EN Pull Down Current | IEN | 0.2 | 0.5 | µA | VEN = 4.8 V | 3 | |
| Line Transient | TranLINE | -1 | mV | VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V) in 30 µs, IOUT = 1 mA | 4 | ||
| Line Transient | TranLINE | 1 | mV | VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V) in 30 µs, IOUT = 1 mA | 4 | ||
| Load Transient | TranLOAD | -40 | mV | IOUT = 1 mA to 200 mA in 10 µs | 4 | ||
| Load Transient | TranLOAD | 40 | mV | IOUT = 200 mA to 1 mA in 10 µs | 4 | ||
| Input Voltage (Absolute Maximum) | VIN | -0.3 | 6 | V | 2 | ||
| Output Voltage (Absolute Maximum) | VOUT | -0.3 | 6 | V | −0.3 to VIN + 0.3, max. 6 V | 2 | |
| Chip Enable Input (Absolute Maximum) | VCE | -0.3 | 6 | V | 2 | ||
| Maximum Junction Temperature | TJ | 150 | °C | 2 | |||
| Storage Temperature | TSTG | -55 | 150 | °C | 2 | ||
| ESD Capability, Human Body Model | ESDHBM | 2000 | V | EIA/JESD22-A114 | 2 | ||
| ESD Capability, Machine Model | ESDMM | 200 | V | EIA/JESD22-A115 | 2 | ||
| ESD Capability, Charged Device Model | ESDCDM | 1000 | V | EIA/JESD22-C101 | 2 | ||
| Operating Junction Temperature Range | TJ | -40 | 125 | °C | Electrical characteristics temperature range | 3 | |
| Input Capacitor | CIN | 1 | µF | Ceramic, X7R or X5R recommended | 13 | ||
| Output Capacitor Effective Capacitance | COUT | 0.7 | µF | Minimum effective capacitance over temperature, DC bias and package size | 13 | ||
| Output Capacitor ESR | ESR | 2 | Ω | COUT maximum ESR | 13 | ||
| Thermal Resistance, Junction-to-Air (XDFN4) | RJA | 198.1 | °C/W | Note 3, JEDEC board (JESD51-7) | 3 |
CAD (KiCad official)
- Symbol:
NCP163AMX300TBG - Footprint:
Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm - 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files:
ncp163amx300tbg-etched.step/ncp163amx300tbg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ncp163amx300tbg.step/ncp163amx300tbg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (23 pp, sha256
024c06f95e392f4d, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).