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NCP1392BDR2G

Public Made by Adom

by adom

onsemi Gate Drive ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NCP1392BDR2G

onsemi · Gate Drive ICs · SOIC-8

NCP1392BDR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supplies the driver; accepts up to 16 V given by the internal zener clamp (VCCclamp typ 16 V), with current into the pin limited to 20 mA max.
2 Rt passive Timing resistor connected between this pin and GND sets the operating frequency (25 kHz to 480 kHz); Rt pin reference voltage is 3.5 V and capacitance on the pin must be under 100 pF.
3 BO input Brown-out/enable input with 1 V brown-out level and 18.2 µA hysteresis current; on the B version, enable above Vref_EN (2 V) stops the driver and operation restores when it drops 100 mV below.
4 GND power_in IC ground.
5 Mlower output Low-side driver output that drives the lower side MOSFET, with output range -0.3 V to VCC + 0.3 V.
6 HB passive Half-bridge connection to the half-bridge output, rated -1 V to +600 V.
7 Mupper output High-side driver output that drives the higher side MOSFET, with output range Vbridge - 0.3 V to Vboot + 0.3 V.
8 Vboot power_in Bootstrap pin, the floating supply terminal for the upper stage, with Vboot-Vbridge rated 0 to 20 V.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Turn-On Threshold Level, VCC Going Up VCCON 10 11 12 V VCC = 12 V 6
Minimum Operating Voltage after Turn-On VCCmin 8 9 10 V 6
Startup Voltage on the Floating Section VbootON 7.8 8.8 9.8 V 6
Cutoff Voltage on the Floating Section Vbootmin 7 8 9 V 6
Startup Current ICC 50 µA VCC < VCCON, 0°C ≤ Tamb ≤ +125°C 6
Startup Current ICC 65 µA VCC < VCCON, -40°C ≤ Tamb < 0°C 6
Consumption During PFC Delay Period ICC4 400 µA 0°C ≤ Tamb ≤ +125°C 6
Consumption During PFC Delay Period ICC4 470 µA -40°C ≤ Tamb < 0°C 6
VCC Zener Clamp Voltage VCCclamp 15.4 16 17.5 V @ 20 mA 6
Minimum Switching Frequency FSW min 24.25 25 25.75 kHz Rt = 35 k on Pin 2 for DT = 600 ns 6
Maximum Switching Frequency (B Version) FSW maxB 208 245 282 kHz Rt = 3.5 k on Pin 2, DT = 600 ns 6
Reference Voltage for all Current Generations Vref RT 3.33 3.5 3.67 V 6
Operating Duty Cycle Symmetry DC 48 50 52 % 6
Deadtime (B Version) TdeadB 540 610 720 ns 6
Leakage Current on High Voltage Pins to GND IHVLeak 5 µA 600 Vdc 6
Brown-Out Level VBO 0.95 1 1.05 V 6
Hysteresis Current IBO 15.6 18.2 20.7 µA Vpin3 < VBO 6
Reference Voltage for EN Input (B Version) Vref EN 1.9 2 2.1 V 6
Temperature Shutdown TSD 140 °C 7
Internal IC Consumption, No Output Load ICC1 2.2 mA No Output Load on Pins 8/7 - 5/4, Fsw = 100 kHz 6
Internal IC Consumption, 1 nF Output Load ICC2 3.4 mA 1 nF Output Load on Pins 8/7 - 5/4, Fsw = 100 kHz 6
Consumption in Fault Mode ICC3 2.56 mA Drivers Disabled, VCC > VCC(min), RT = 3.5 k 6
Output Voltage Rise Time Tr 40 ns CL = 1 nF, 10-90% of Output Signal 6
Output Voltage Fall Time Tf 20 ns CL = 1 nF, 10-90% of Output Signal 6
Source Resistance ROH 12 Ω 6
Sink Resistance ROL 5 Ω 6
Delay Before Any Driver Restart (B Version) PFC Delay 100 ms 7
Bridge Pin Voltage Vbridge -1 600 V Pin 6 5
Floating Supply Voltage Vboot - Vbridge 0 20 V 5
Allowable Output Slew Rate dVbridge/dt 50 V/ns 5
Maximum Current into VCC Pin ICC 20 mA Pin 1, VBO = 0 V 5
Rt Pin Voltage V_Rt -0.3 5 V 5
Maximum Voltage, All Pins (Except Pins 4 and 5) -0.3 10 V 5
Storage Temperature Range -60 150 °C 5
ESD Capability, HBM (All Pins Except HV Pins 6, 7 and 8) 2 kV Human Body Model 5
ESD Capability, HBM (HV Pins 6, 7 and 8) 1.5 kV Human Body Model 5
ESD Capability, Machine Model 200 V 5
Thermal Resistance Junction-to-Air RθJA 178 °C/W IC Soldered on 50 mm2 Copper 35 µm 5
Thermal Resistance Junction-to-Air RθJA 147 °C/W IC Soldered on 200 mm2 Copper 35 µm 5

CAD (KiCad official)

  • Symbol: NCP1392BDR2G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ncp1392bdr2g-etched.step / ncp1392bdr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp1392bdr2g.step / ncp1392bdr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (21 pp, sha256 dcd05630362c2867, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF