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NCE6003XY

Wuxi NCE Power Semiconductor · MOSFETs · SOT-23-3L

NCE6003XY from Wuxi NCE Power Semiconductor, in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal; gate-source voltage is limited to ±20V, with VGS(th) of 0.9V min to 2.0V max at ID=250μA.
2 S passive Source terminal; continuous drain current is 3A and the body diode forward current IS is 3A max.
3 D passive Drain terminal; drain-source voltage is rated 60V, with continuous ID of 3A and pulsed IDM of 10A.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package SOT-23-3L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 3 A 1
Drain Current-Pulsed IDM 10 A Repetitive rating: pulse width limited by maximum junction temperature (Note 1) 1
Maximum Power Dissipation PD 1.7 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Drain-Source Breakdown Voltage BVDSS 60 V VGS=0V ID=250μA 1
Zero Gate Voltage Drain Current IDSS 1 μA VDS=60V,VGS=0V 1
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 0.9 1.3 2 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 68 90 mΩ VGS=10V, ID=3A 2
Drain-Source On-State Resistance RDS(ON) 80 110 mΩ VGS=4.5V, ID=3A 2
Diode Forward Voltage VSD 1.2 V VGS=0V,IS=3A 2
Diode Forward Current IS 3 A 2
Thermal Resistance, Junction-to-Ambient RθJA 73.5 ℃/W Surface mounted on FR4 board, t ≤ 10 sec (Note 2) 1

CAD (KiCad official)

  • Symbol: NCE6003XY
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3L (KiCad packages3D, STEP)
  • 3D model files: nce6003xy-etched.step / nce6003xy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce6003xy.step / nce6003xy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 64b27acfbd203414, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF