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MX25L6406EM2I-12G

Public Made by Adom

by adom

MXIC(Macronix) NOR FLASH, SOP-8-200mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MX25L6406EM2I-12G

MXIC(Macronix) · NOR FLASH · SOP-8-200mil

MX25L6406EM2I-12G from MXIC(Macronix), in a SOP-8-200mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS# input Chip Select input that enables serial access to the device; when CS# is high the device is in standby mode.
2 SO/SIO1 output Serial Data Output for 1 x I/O, and SIO1 data output in Dual Output mode.
3 WP# input Write protection input.
4 GND power_in Ground.
5 SI/SIO0 bidirectional Serial Data Input for 1 x I/O, and SIO0 serial data output in Dual Output mode.
6 SCLK input Clock input for the serial interface.
7 HOLD# input Hold input to pause the device without deselecting it.
8 VCC power_in +3.3V power supply.

Key specifications

Parameter Value
Manufacturer MXIC(Macronix)
Package SOP-8-200mil
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 2.7 3.6 V read, erase, program operations 46
VCC to Ground Potential -0.5 4 V 31
Storage Temperature -65 150 °C 31
Ambient Operating Temperature -40 85 °C Industrial grade 31
Input Capacitance CIN 6 pF VIN = 0V, TA = 25°C, f = 1.0 MHz 31
Output Capacitance COUT 8 pF VOUT = 0V, TA = 25°C, f = 1.0 MHz 31
Input Load Current ILI -2 2 uA VCC = VCC Max, VIN = VCC or GND 33
Output Leakage Current ILO -2 2 uA VCC = VCC Max, VOUT = VCC or GND 33
VCC Standby Current ISB1 12 50 uA VIN = VCC or GND, CS# = VCC 33
Deep Power-down Current ISB2 20 uA VIN = VCC or GND, CS# = VCC 33
VCC Read Current ICC1 25 mA f=86MHz, fT=80MHz (2 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open 33
VCC Read Current ICC1 20 mA f=66MHz, SCLK=0.1VCC/0.9VCC, SO=Open 33
VCC Read Current ICC1 10 mA f=33MHz, SCLK=0.1VCC/0.9VCC, SO=Open 33
VCC Program Current (PP) ICC2 15 20 mA Program in Progress, CS# = VCC 33
VCC Write Status Register (WRSR) Current ICC3 20 mA Program status register in progress, CS#=VCC 33
VCC Sector Erase Current (SE) ICC4 9 20 mA Erase in Progress, CS#=VCC 33
VCC Chip Erase Current (CE) ICC5 17 20 mA Erase in Progress, CS#=VCC 33
Output Low Voltage VOL 0.2 V IOL = 100uA 33
Clock Frequency (FAST_READ etc.) fSCLK 86 MHz FAST_READ, RDSFDP, PP, SE, BE, CE, DP, RES, RDP, WREN, WRDI, RDID, RDSR, WRSR 34
Clock Frequency for READ fRSCLK 33 MHz READ instructions 34
Clock Frequency for DREAD fTSCLK 80 MHz DREAD instructions 34
Clock High Time tCH 5.5 ns fC=86MHz 34
Clock High Time tCH 13 ns fR=33MHz 34
Clock Low Time tCL 5.5 ns fC=86MHz 34
Clock Low Time tCL 13 ns fR=33MHz 34
Clock Rise Time (peak to peak) tCLCH 0.1 V/ns 34
Clock Fall Time (peak to peak) tCHCL 0.1 V/ns 34
CS# Active Setup Time tSLCH 7 ns relative to SCLK 34
CS# Not Active Hold Time tCHSL 7 ns relative to SCLK 34
Data In Setup Time tDVCH 2 ns 34
Data In Hold Time tCHDX 5 ns 34
CS# Active Hold Time tCHSH 7 ns relative to SCLK 34
CS# Not Active Setup Time tSHCH 7 ns relative to SCLK 34
CS# Deselect Time tSHSL 15 ns Read 34
CS# Deselect Time tSHSL 40 ns Write 34
Output Disable Time tSHQZ 8 ns 34
Clock Low to Output Valid tCLQV 8 ns CL=15pF, 2.7V~3.6V 34
Clock Low to Output Valid tCLQV 6 ns CL=15pF, 3.0V~3.6V 34
Output Hold Time tCLQX 0 ns 34
HOLD to Output High-Z tHLQZ 8 ns 34
Write Protect Setup Time tWHSL 20 ns 34
Write Protect Hold Time tSHWL 100 ns 34
CS# High to Deep Power-down Mode tDP 10 us 34
CS# High to Standby Mode with Electronic Signature Read tRES2 8.8 us 34
Write Status Register Cycle Time tW 5 40 ms 34
Byte-Program Time tBP 9 50 us 34
Page Program Cycle Time tPP 0.6 3 ms 34
Sector Erase Cycle Time tSE 40 200 ms 34
Block Erase Cycle Time tBE 0.4 2 s 34
Chip Erase Cycle Time tCE 25 80 s 34
CS# High to Power-Down tRPD1 100 ns 34
VCC(min) to CS# low tVSL 200 us 46
VCC Rise Time tVR 20 500000 us/V 47
Latch-up Current -100 100 mA all pins except VCC, VCC = 3.0V, one pin at a time 49
Data retention 20 years 55˚C 49
Erase/Program Cycle 100000 cycles 49

CAD (KiCad official)

  • Symbol: MX25L6406EM2I-12G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8-200mil (KiCad packages3D, STEP)
  • 3D model files: mx25l6406em2i-12g-etched.step / mx25l6406em2i-12g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mx25l6406em2i-12g.step / mx25l6406em2i-12g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MXIC(Macronix) datasheet (60 pp, sha256 b04011fcf0089e9d, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF