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MX25L6406EM2I-12G

MXIC(Macronix) · NOR FLASH · SOP-8-200mil

MX25L6406EM2I-12G from MXIC(Macronix), in a SOP-8-200mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	CS#	input	Chip Select input that enables serial access to the device; when CS# is high the device is in standby mode.
2	SO/SIO1	output	Serial Data Output for 1 x I/O, and SIO1 data output in Dual Output mode.
3	WP#	input	Write protection input.
4	GND	power_in	Ground.
5	SI/SIO0	bidirectional	Serial Data Input for 1 x I/O, and SIO0 serial data output in Dual Output mode.
6	SCLK	input	Clock input for the serial interface.
7	HOLD#	input	Hold input to pause the device without deselecting it.
8	VCC	power_in	+3.3V power supply.

Key specifications

Parameter	Value
Manufacturer	MXIC(Macronix)
Package	SOP-8-200mil
Category	Memory
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage	VCC	2.7		3.6	V	read, erase, program operations	46
VCC to Ground Potential		-0.5		4	V		31
Storage Temperature		-65		150	°C		31
Ambient Operating Temperature		-40		85	°C	Industrial grade	31
Input Capacitance	CIN			6	pF	VIN = 0V, TA = 25°C, f = 1.0 MHz	31
Output Capacitance	COUT			8	pF	VOUT = 0V, TA = 25°C, f = 1.0 MHz	31
Input Load Current	ILI	-2		2	uA	VCC = VCC Max, VIN = VCC or GND	33
Output Leakage Current	ILO	-2		2	uA	VCC = VCC Max, VOUT = VCC or GND	33
VCC Standby Current	ISB1		12	50	uA	VIN = VCC or GND, CS# = VCC	33
Deep Power-down Current	ISB2			20	uA	VIN = VCC or GND, CS# = VCC	33
VCC Read Current	ICC1			25	mA	f=86MHz, fT=80MHz (2 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open	33
VCC Read Current	ICC1			20	mA	f=66MHz, SCLK=0.1VCC/0.9VCC, SO=Open	33
VCC Read Current	ICC1			10	mA	f=33MHz, SCLK=0.1VCC/0.9VCC, SO=Open	33
VCC Program Current (PP)	ICC2		15	20	mA	Program in Progress, CS# = VCC	33
VCC Write Status Register (WRSR) Current	ICC3			20	mA	Program status register in progress, CS#=VCC	33
VCC Sector Erase Current (SE)	ICC4		9	20	mA	Erase in Progress, CS#=VCC	33
VCC Chip Erase Current (CE)	ICC5		17	20	mA	Erase in Progress, CS#=VCC	33
Output Low Voltage	VOL			0.2	V	IOL = 100uA	33
Clock Frequency (FAST_READ etc.)	fSCLK			86	MHz	FAST_READ, RDSFDP, PP, SE, BE, CE, DP, RES, RDP, WREN, WRDI, RDID, RDSR, WRSR	34
Clock Frequency for READ	fRSCLK			33	MHz	READ instructions	34
Clock Frequency for DREAD	fTSCLK			80	MHz	DREAD instructions	34
Clock High Time	tCH	5.5			ns	fC=86MHz	34
Clock High Time	tCH	13			ns	fR=33MHz	34
Clock Low Time	tCL	5.5			ns	fC=86MHz	34
Clock Low Time	tCL	13			ns	fR=33MHz	34
Clock Rise Time (peak to peak)	tCLCH	0.1			V/ns		34
Clock Fall Time (peak to peak)	tCHCL	0.1			V/ns		34
CS# Active Setup Time	tSLCH	7			ns	relative to SCLK	34
CS# Not Active Hold Time	tCHSL	7			ns	relative to SCLK	34
Data In Setup Time	tDVCH	2			ns		34
Data In Hold Time	tCHDX	5			ns		34
CS# Active Hold Time	tCHSH	7			ns	relative to SCLK	34
CS# Not Active Setup Time	tSHCH	7			ns	relative to SCLK	34
CS# Deselect Time	tSHSL	15			ns	Read	34
CS# Deselect Time	tSHSL	40			ns	Write	34
Output Disable Time	tSHQZ			8	ns		34
Clock Low to Output Valid	tCLQV			8	ns	CL=15pF, 2.7V~3.6V	34
Clock Low to Output Valid	tCLQV			6	ns	CL=15pF, 3.0V~3.6V	34
Output Hold Time	tCLQX	0			ns		34
HOLD to Output High-Z	tHLQZ			8	ns		34
Write Protect Setup Time	tWHSL	20			ns		34
Write Protect Hold Time	tSHWL	100			ns		34
CS# High to Deep Power-down Mode	tDP			10	us		34
CS# High to Standby Mode with Electronic Signature Read	tRES2			8.8	us		34
Write Status Register Cycle Time	tW		5	40	ms		34
Byte-Program Time	tBP		9	50	us		34
Page Program Cycle Time	tPP		0.6	3	ms		34
Sector Erase Cycle Time	tSE		40	200	ms		34
Block Erase Cycle Time	tBE		0.4	2	s		34
Chip Erase Cycle Time	tCE		25	80	s		34
CS# High to Power-Down	tRPD1			100	ns		34
VCC(min) to CS# low	tVSL	200			us		46
VCC Rise Time	tVR	20		500000	us/V		47
Latch-up Current		-100		100	mA	all pins except VCC, VCC = 3.0V, one pin at a time	49
Data retention		20			years	55˚C	49
Erase/Program Cycle			100000		cycles		49

CAD (KiCad official)

Symbol: MX25L6406EM2I-12G
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOP-8-200mil (KiCad packages3D, STEP)
3D model files: mx25l6406em2i-12g-etched.step / mx25l6406em2i-12g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mx25l6406em2i-12g.step / mx25l6406em2i-12g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: MXIC(Macronix) datasheet (60 pp, sha256 b04011fcf0089e9d, retrieved 2026-10-22, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF