# MX25L25645GZ2I-10G

**MXIC Macronix** · NOR FLASH · WSON-8-EP(6x8)

MX25L25645GZ2I-10G from MXIC Macronix, in a WSON-8-EP(6x8). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS# | input | Chip Select input: serial access to the device is enabled by CS#, and the device is put in standby mode when CS# is high and the device is not in operation. |
| 2 | SO/SIO1 | bidirectional | Serial Data Output for 1 x I/O, becoming Serial Data Input & Output (SIO1) in 2 x I/O or 4 x I/O read mode. |
| 3 | WP#/SIO2 | bidirectional | Write Protection, active low, used with SRWD for hardware protection mode, becoming Serial Data Input & Output (SIO2) in 4 x I/O read mode, and it keeps an internal pull-up when not physically connected. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | SI/SIO0 | bidirectional | Serial Data Input for 1 x I/O, becoming Serial Data Input & Output (SIO0) in 2 x I/O or 4 x I/O read mode. |
| 6 | SCLK | input | Clock input for the serial interface, supporting clock frequencies up to 133MHz as stated in the key features. |
| 7 | RESET#/SIO3 | bidirectional | Hardware Reset pin, active low, which must be system-controlled and must be tied to VCC (not floating) when neither 4 x I/O nor hardware reset is used, becoming SIO3 in 4 x I/O read mode. |
| 8 | VCC | power_in | Power supply, +3V nominal, with the device specified for VCC = 2.7V to 3.6V in the DC characteristics. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MXIC Macronix |
| Package | WSON-8-EP(6x8) |
| Category | Memory |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage Temperature |  | -65 |  | 150 | °C |  | 103 |
| Ambient Operating Temperature |  | -40 |  | 85 | °C | Industrial grade | 103 |
| VCC to Ground Potential | VCC | -0.5 |  | 4 | V |  | 103 |
| Applied Input Voltage |  | -0.5 |  |  | V |  | 103 |
| Applied Output Voltage |  | -0.5 |  |  | V |  | 103 |
| Single power supply operation | VCC | 2.7 |  | 3.6 | V | Read, erase and program operations | 5 |
| Input Load Current | ILI | -2 |  | 2 | uA | VCC = VCC Max, VIN = VCC or GND | 105 |
| Output Leakage Current | ILO | -2 |  | 2 | uA | VCC = VCC Max, VOUT = VCC or GND | 105 |
| VCC Standby Current | ISB1 |  | 15 | 100 | uA | VIN = VCC or GND, CS# = VCC | 105 |
| VCC Read Current (DTR 4 x I/O read) | ICC1 |  | 16 | 30 | mA | f=100MHz, (DTR 4 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open | 105 |
| VCC Read Current (4 x I/O read) | ICC1 |  | 14 | 25 | mA | f=133MHz, (4 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open | 105 |
| VCC Read Current (4 x I/O read) | ICC1 |  | 12 | 20 | mA | f=104MHz, (4 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open | 105 |
| VCC Read Current | ICC1 |  | 12 | 15 | mA | f=84MHz, SCLK=0.1VCC/0.9VCC, SO=Open | 105 |
| VCC Program Current (PP) | ICC2 |  | 12 | 25 | mA | Program in Progress, CS# = VCC | 105 |
| VCC Sector/Block (32K, 64K) Erase Current (SE/BE/BE32K) | ICC4 |  | 10 | 25 | mA | Erase in Progress, CS#=VCC | 105 |
| VCC Chip Erase Current (CE) | ICC5 |  | 14 | 25 | mA | Erase in Progress, CS#=VCC | 105 |
| Input Low Voltage | VIL | -0.5 |  | 0.8 | V |  | 105 |
| Clock Frequency for all commands (except Read) | fSCLK |  |  | 120 | MHz |  | 106 |
| Byte-Program Time | tBP |  | 15 | 30 | us |  | 106 |
| Page Program Cycle Time | tPP |  | 0.25 | 0.75 | ms |  | 106 |
| Sector Erase Cycle Time | tSE |  | 30 | 400 | ms |  | 106 |
| Block Erase (32KB) Cycle Time | tBE32 |  | 180 | 1000 | ms |  | 106 |
| Block Erase (64KB) Cycle Time | tBE |  | 380 | 2000 | ms |  | 106 |
| Chip Erase Cycle Time | tCE |  | 110 | 210 | s |  | 106 |
| Latency between Program Resume and next Suspend | tPRS |  | 0.3 | 100 | us |  | 106 |
| Latency between Erase Resume and next Suspend | tERS |  | 0.3 | 400 | us |  | 106 |
| VCC Rise Time | tVR |  |  | 500000 | us/V |  | 108 |

## CAD (KiCad official)

- Symbol: `MX25L25645GZ2I-10G`
- Footprint: `Package_SON:WSON-8-1EP_8x6mm_P1.27mm_EP3.4x4.3mm`
- 3D model: WSON-8-EP(6x8), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `mx25l25645gz2i-10g-etched.step` / `mx25l25645gz2i-10g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mx25l25645gz2i-10g.step` / `mx25l25645gz2i-10g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MXIC Macronix datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590178452432457728) (123 pp, sha256 `3ab1fa34cfd56360`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mx25l25645gz2i-10g-datasheet.pdf)