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MX25L25645GZ2I-10G

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MXIC Macronix NOR FLASH, WSON-8-EP(6x8). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MX25L25645GZ2I-10G

MXIC Macronix · NOR FLASH · WSON-8-EP(6x8)

MX25L25645GZ2I-10G from MXIC Macronix, in a WSON-8-EP(6x8). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS# input Chip Select input: serial access to the device is enabled by CS#, and the device is put in standby mode when CS# is high and the device is not in operation.
2 SO/SIO1 bidirectional Serial Data Output for 1 x I/O, becoming Serial Data Input & Output (SIO1) in 2 x I/O or 4 x I/O read mode.
3 WP#/SIO2 bidirectional Write Protection, active low, used with SRWD for hardware protection mode, becoming Serial Data Input & Output (SIO2) in 4 x I/O read mode, and it keeps an internal pull-up when not physically connected.
4 GND power_in Ground reference for the device.
5 SI/SIO0 bidirectional Serial Data Input for 1 x I/O, becoming Serial Data Input & Output (SIO0) in 2 x I/O or 4 x I/O read mode.
6 SCLK input Clock input for the serial interface, supporting clock frequencies up to 133MHz as stated in the key features.
7 RESET#/SIO3 bidirectional Hardware Reset pin, active low, which must be system-controlled and must be tied to VCC (not floating) when neither 4 x I/O nor hardware reset is used, becoming SIO3 in 4 x I/O read mode.
8 VCC power_in Power supply, +3V nominal, with the device specified for VCC = 2.7V to 3.6V in the DC characteristics.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer MXIC Macronix
Package WSON-8-EP(6x8)
Category Memory
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Storage Temperature -65 150 °C 103
Ambient Operating Temperature -40 85 °C Industrial grade 103
VCC to Ground Potential VCC -0.5 4 V 103
Applied Input Voltage -0.5 V 103
Applied Output Voltage -0.5 V 103
Single power supply operation VCC 2.7 3.6 V Read, erase and program operations 5
Input Load Current ILI -2 2 uA VCC = VCC Max, VIN = VCC or GND 105
Output Leakage Current ILO -2 2 uA VCC = VCC Max, VOUT = VCC or GND 105
VCC Standby Current ISB1 15 100 uA VIN = VCC or GND, CS# = VCC 105
VCC Read Current (DTR 4 x I/O read) ICC1 16 30 mA f=100MHz, (DTR 4 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open 105
VCC Read Current (4 x I/O read) ICC1 14 25 mA f=133MHz, (4 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open 105
VCC Read Current (4 x I/O read) ICC1 12 20 mA f=104MHz, (4 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open 105
VCC Read Current ICC1 12 15 mA f=84MHz, SCLK=0.1VCC/0.9VCC, SO=Open 105
VCC Program Current (PP) ICC2 12 25 mA Program in Progress, CS# = VCC 105
VCC Sector/Block (32K, 64K) Erase Current (SE/BE/BE32K) ICC4 10 25 mA Erase in Progress, CS#=VCC 105
VCC Chip Erase Current (CE) ICC5 14 25 mA Erase in Progress, CS#=VCC 105
Input Low Voltage VIL -0.5 0.8 V 105
Clock Frequency for all commands (except Read) fSCLK 120 MHz 106
Byte-Program Time tBP 15 30 us 106
Page Program Cycle Time tPP 0.25 0.75 ms 106
Sector Erase Cycle Time tSE 30 400 ms 106
Block Erase (32KB) Cycle Time tBE32 180 1000 ms 106
Block Erase (64KB) Cycle Time tBE 380 2000 ms 106
Chip Erase Cycle Time tCE 110 210 s 106
Latency between Program Resume and next Suspend tPRS 0.3 100 us 106
Latency between Erase Resume and next Suspend tERS 0.3 400 us 106
VCC Rise Time tVR 500000 us/V 108

CAD (KiCad official)

  • Symbol: MX25L25645GZ2I-10G
  • Footprint: Package_SON:WSON-8-1EP_8x6mm_P1.27mm_EP3.4x4.3mm
  • 3D model: WSON-8-EP(6x8), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: mx25l25645gz2i-10g-etched.step / mx25l25645gz2i-10g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mx25l25645gz2i-10g.step / mx25l25645gz2i-10g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MXIC Macronix datasheet (123 pp, sha256 3ab1fa34cfd56360, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF