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MX25L12833FMI-10G

Public Made by Adom

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MXIC Macronix NOR FLASH, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MX25L12833FMI-10G

MXIC Macronix · NOR FLASH · SOIC-16-300mil

MX25L12833FMI-10G from MXIC Macronix, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DNU/SIO3 bidirectional Do not use in the 16-pin SOP when QE is 0; when QE is 1 (Quad mode) this pin functions as SIO3 for 4xI/O data input and output and its alternate function is disabled.
2 VCC power_in +3V power supply input.
3 RESET# input Hardware reset pin, active low; an internal pull-up remains active only while this pin is not physically connected in the system.
4 NC unconnected No connection.
5 NC unconnected No connection.
6 NC unconnected No connection.
7 CS# input Chip select; serial access to the device is enabled by CS#, and the device enters standby mode when CS# is high and it is not in operation.
8 SO/SIO1 bidirectional Serial data output for 1xI/O; serial data input and output (SIO1) for 2xI/O or 4xI/O read mode.
9 WP#/SIO2 bidirectional Write protection, active low, in single I/O mode; serial data input and output (SIO2) for 4xI/O read mode, with an internal pull-up active only while not physically connected.
10 GND power_in Ground.
11 NC unconnected No connection.
12 NC unconnected No connection.
13 NC unconnected No connection.
14 NC unconnected No connection.
15 SI/SIO0 bidirectional Serial data input for 1xI/O; serial data input and output (SIO0) for 2xI/O or 4xI/O read mode.
16 SCLK input Clock input.

Key specifications

Parameter Value
Manufacturer MXIC Macronix
Package SOIC-16-300mil
Category Memory
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Operating Temperature -40 85 °C Industrial grade 73
Storage Temperature -65 150 °C 73
Applied Input Voltage -0.5 V Printed as -0.5V to VCC+0.5V; upper limit depends on VCC 73
Applied Output Voltage -0.5 V Printed as -0.5V to VCC+0.5V; upper limit depends on VCC 73
VCC to Ground Potential VCC -0.5 4 V 73
Supply voltage for read, erase and program operations VCC 2.7 3.6 V 4
Input Capacitance CIN 6 pF VIN = 0V 73
Output Capacitance COUT 8 pF VOUT = 0V 73
Input Load Current ILI -2 2 uA VCC = VCC Max, VIN = VCC or GND 75
Output Leakage Current ILO -2 2 uA VCC = VCC Max, VOUT = VCC or GND 75
VCC Standby Current ISB1 10 50 uA VIN = VCC or GND, CS# = VCC 75
VCC Read (4 x I/O read, 104MHz row) ICC1 20 mA f=104MHz, (4 x I/O read), SCLK=0.1VCC/0.9VCC, SO=Open 75
VCC Program Current (PP) ICC2 14 20 mA Program in Progress, CS# = VCC 75
VCC Write Status Register (WRSR) Current ICC3 10 12 mA Program status register in progress, CS#=VCC 75
VCC Sector/Block (32K, 64K) Erase Current (SE/BE/BE32K) ICC4 14 25 mA Erase in Progress, CS#=VCC 75
VCC Chip Erase Current (CE) ICC5 14 25 mA Erase in Progress, CS#=VCC 75
Input Low Voltage VIL -0.5 0.8 V 75
Output Low Voltage VOL 0.2 V IOL = 100uA 75
Clock Frequency for all commands (except Read) fSCLK 133 MHz 76
Clock Frequency for READ instructions fRSCLK 50 MHz 76
Clock Frequency for 2READ instructions fTSCLK 84 MHz 76
Clock Frequency for 4READ instructions fQ 84 MHz 76
Clock High Time (others, fSCLK) tCH 7 ns ≤ 66MHz 76
Clock High Time (normal read) tCH 7 ns Normal Read (fRSCLK) 76
Clock Low Time (others, fSCLK) tCL 7 ns ≤ 66MHz 76
Clock Low Time (normal read) tCL 7 ns Normal Read (fRSCLK) 76
Clock Rise Time (peak to peak) tCLCH 0.1 V/ns 76
Clock Fall Time (peak to peak) tCHCL 0.1 V/ns 76
CS# Active Setup Time (relative to SCLK) tSLCH 3 ns 76
CS# Not Active Hold Time (relative to SCLK) tCHSL 3 ns 76
Data In Setup Time tDVCH 2 ns 76
Data In Hold Time tCHDX 2 ns 76
CS# Active Hold Time (relative to SCLK) tCHSH 3 ns 76
CS# Not Active Setup Time (relative to SCLK) tSHCH 3 ns 76
CS# Deselect Time tSHSL 7 ns From Read to next Read 76
CS# Deselect Time tSHSL 30 ns From Write/Erase/Program to Read Status Register 76
Output Disable Time tSHQZ 8 ns 76
Clock Low to Output Valid tCLQV 8 ns Loading: 30pF 76
Clock Low to Output Valid tCLQV 6 ns Loading: 15pF 76
Output Hold Time tCLQX 1 ns Loading: 30pF 76
Write Protect Setup Time tWHSL 20 ns 76
Write Protect Hold Time tSHWL 100 ns 76
CS# High to Deep Power-down Mode tDP 10 us 76
CS# High to Standby Mode without Electronic Signature Read tRES1 30 us 76
CS# High to Standby Mode with Electronic Signature Read tRES2 30 us 76
Write Status/Configuration Register Cycle Time tW 40 ms 76
Byte-Program tBP 16 40 us 76
Page Program Cycle Time tPP 0.33 1.2 ms 76
Sector Erase Cycle Time tSE 25 120 ms 76
Block Erase (32KB) Cycle Time tBE32 140 650 ms 76
Block Erase (64KB) Cycle Time tBE 250 650 ms 76
Chip Erase Cycle Time tCE 26 60 s 76
Erase Suspend Latency tESL 25 us 76
Program Suspend Latency tPSL 25 us 76
Latency between Program Resume and next Suspend tPRS 0.3 100 us 76
Latency between Erase Resume and next Suspend tERS 0.3 400 us 76
VCC Rise Time tVR 500000 us/V 78

CAD (KiCad official)

  • Symbol: MX25L12833FMI-10G
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: mx25l12833fmi-10g-etched.step / mx25l12833fmi-10g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mx25l12833fmi-10g.step / mx25l12833fmi-10g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MXIC Macronix datasheet (90 pp, sha256 b26659f61da53028, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF