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MR25H40CDF

Everspin Tech · SRAM · DFN-8-EP(5x6)

MR25H40CDF from Everspin Tech, in a DFN-8-EP(5x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS input Active-low chip select; when high the memory is powered down to minimize standby power, inputs are ignored and SO is Hi-Z.
2 SO tri_state Serial data output driven during a read operation and Hi-Z at all other times and when HOLD is low; data transitions on the falling edge of SCK.
3 WP input Write protect; a low on this input prevents write operations to the Status Register.
4 VSS power_in Power supply ground pin.
5 SI input Serial data input sampled on the rising edge of SCK and ignored at other times; can be tied to SO to form a single bidirectional data bus.
6 SCK input Serial clock that synchronizes the MRAM, up to 50 MHz; inputs captured on the rising edge, outputs change on the falling edge, supports SPI Mode 0 and Mode 3.
7 HOLD input A low suspends the current memory operation and the device ignores CS and SCK transitions; all HOLD transitions must occur while CS is low.
8 VDD power_in Power supply voltage from +3.0 to +3.6 volts.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Everspin Tech
Package DFN-8-EP(5x6)
Category Memory
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD -0.5 4 V 15
Voltage on any pin VIN -0.5 V max printed as VDD + 0.5 V 15
Output current per pin IOUT -20 20 mA printed ±20 15
Package power dissipation PD 0.6 W 15
Temperature under bias TBIAS -45 95 °C Industrial 15
Storage temperature Tstg -55 150 °C 15
Lead temperature during solder TLead 260 °C 3 minute max 15
Maximum magnetic field during write Hmax_write 12000 A/m Write 15
Maximum magnetic field during read or standby Hmax_read 12000 A/m Read or Standby 15
Power supply voltage VDD 3 3.6 V 16
Input high voltage VIH 2.2 V max printed as VDD + 0.3 V 16
Input low voltage VIL -0.5 0.8 V 16
Ambient temperature under bias TA -40 85 °C Industrial 16
Input leakage current ILI -1 1 µA printed ±1 16
Output leakage current ILO -1 1 µA printed ±1 16
Output low voltage VOL 0.4 V IOL = +4 mA 16
Output high voltage VOH 2.4 V IOH = -4 mA 16
Active read current IDDR 5 11 mA @ 1 MHz 17
Active read current IDDR 12 17 mA @ 40 MHz 17
Active write current IDDW 9 25 mA @ 1 MHz 17
Active write current IDDW 28 42 mA @ 40 MHz 17
AC standby current (CS high) ISB1 250 400 µA @ 40 MHz 17
CMOS standby current (CS high) ISB2 90 180 µA 17
Standby sleep mode current (CS high) IZZ 15 40 µA 17
Control input capacitance CIn 6 pF f = 1.0 MHz, dV = 3.0 V, TA = 25 °C 18
Input/Output capacitance CI/O 8 pF f = 1.0 MHz, dV = 3.0 V, TA = 25 °C 18

CAD (KiCad official)

  • Symbol: MR25H40CDF
  • Footprint: Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm
  • 3D model: DFN-8-EP(5x6) (KiCad packages3D, STEP)
  • 3D model files: mr25h40cdf-etched.step / mr25h40cdf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mr25h40cdf.step / mr25h40cdf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Everspin Tech datasheet (30 pp, sha256 a9e4056e58de94e6, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF