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Contents

README

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MP9485GN-Z

MONOLITHIC POWER SYSTEMS (MPS) · Global Sourcing Parts · SOIC-8-EP

MP9485GN-Z from MONOLITHIC POWER SYSTEMS (MPS), in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FB input Feedback input to the voltage-feedback hysteretic comparator, which switches the power MOSFET at FB thresholds of 215mV (rising) and 185mV (falling) with FB input current limited to ±300nA.
2 NC unconnected No connection; the pin is not connected internally.
3 VIN power_in Input supply for the internal control circuitry, both BST regulators and the high-side switch, with a recommended supply range of 4.5V to 95V and a decoupling capacitor to be placed close to VIN.
4 BST power_out Positive supply for the internal floating high-side MOSFET driver, bypassed with a capacitor connected between BST and SW, with BST-to-SW limited to -0.3V to +6V.
5 SW output Output from the high-side switch node, which requires a low forward-voltage Schottky rectifier to ground placed close to SW, with the switch voltage rated -0.5V (-4V for under 10ns) to VIN + 0.5V.
6 DIM input PWM dimming input with a DIM up threshold of 0.8V to 1.5V (1.15V typical) that must be pulled below the threshold to turn dimming off and above it to turn dimming on, and which should be tied to EN when dimming is not needed.
7 EN input Positive-logic enable input with an EN up threshold of 1.4V to 1.7V (1.55V typical) that shuts the device down when pulled below threshold, and which enables the device when pulled above threshold or left floating (internal 2µA pull-up).
8 GND power_in Ground, to be placed as close to the output capacitor as possible to avoid the high-current switch paths, with the exposed pad connected to the GND plane for thermal performance.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer MONOLITHIC POWER SYSTEMS (MPS)
Package SOIC-8-EP
Category Global Sourcing Parts
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN UVLO threshold 3.6 4 4.4 V 4
Shutdown supply current 2 5 µA VEN = 0V 4
Quiescent supply current 170 220 µA No load, VFB = 250mV 4
Upper switch leakage current ISWLK 0.01 1 µA VEN = 0V, VSW = 0V 4
EN up threshold VENH 1.4 1.55 1.7 V 4
EN input current IENI 0.01 1 µA VEN = 5V 4
EN sinking current IENS 2 3 µA VEN = 2V 4
DIM up threshold VDIMH 0.8 1.15 1.5 V 4
DIM input current IDIM -1 1 µA VDIM = 5V or 0V 4
FB voltage threshold high VFBH 209 215 221 mV 4.5V < VIN < 95V, VFB rising from 0V until VSW < 30V 4
FB voltage threshold low VFBL 179 185 191 mV 4.5V < VIN < 95V, VFB falling from 0.25V until VSW > 30V 4
FB input current IFB -300 300 nA VFB = 5V or 0V 4
Supply voltage (VIN) VIN -0.3 100 V 3
Switch voltage VSW -0.5 V -4V for <10ns; upper limit printed as VIN + 0.5V 3
BST to SW -0.3 6 V 3
All other pins -0.3 6 V 3
Junction temperature 150 °C 3
Continuous power dissipation 2.5 W TA = +25°C 3
Storage temperature -65 150 °C 3
Supply voltage (VIN) VIN 4.5 95 V 3
EN and DIM voltages 0 5 V 3
Max switching frequency 2 MHz 3
Operating junction temperature -40 125 °C 3
Thermal resistance junction-to-ambient θJA 50 °C/W SOIC-8 EP; measured on JESD51-7 4-layer board (note 4) 3
Thermal resistance junction-to-case θJC 10 °C/W SOIC-8 EP; measured on JESD51-7 4-layer board (note 4) 3

CAD (KiCad official)

  • Symbol: MP9485GN-Z
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)
  • 3D model files: mp9485gn-z-etched.step / mp9485gn-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mp9485gn-z.step / mp9485gn-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MONOLITHIC POWER SYSTEMS (MPS) datasheet (16 pp, sha256 514faab28c970cbf, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF