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MP3414AGJ-Z

Monolithic Power Systems · DC-DC Converters · TSOT-23-8

MP3414AGJ-Z from Monolithic Power Systems, in a TSOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Power supply input whose start-up bias is derived from IN and must be bypassed locally, with bias moving to OUT once VOUT exceeds VIN.
2 OUT power_out Output at the drain of the internal synchronous rectifier MOSFET, which derives bias power from OUT when VOUT is higher than VIN and allows OUT to be disconnected completely from IN when EN is low, with the trace to the output filter capacitors kept as short and wide as possible.
3 SW output Power switch output connecting the internal low-side and synchronous MOSFETs, where the power inductor connects between SW and the input supply and the trace should be kept short and wide to reduce EMI and voltage spikes.
4 PGND power_in Power ground.
5 FTY passive Factory use only; leave floating or connect it to ground in the application.
6 AGND power_in Analog ground.
7 FB input Feedback input to be connected to the tap of an external resistive voltage divider from the output, which sets the output voltage.
8 EN input Chip enable control input that turns the regulator on when set higher than 1.2V and turns it off when set lower than 0.4V.

Key specifications

Parameter Value
Manufacturer Monolithic Power Systems
Package TSOT-23-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
SW, OUT pin voltage (absolute maximum) -0.3 6.5 V 3
SW pin voltage, <5ns (absolute maximum) -1 9 V <5ns 3
All other pins voltage (absolute maximum) -0.3 6.5 V 3
Continuous power dissipation (absolute maximum) 1.25 W TA = +25°C 3
Junction temperature (absolute maximum) 150 °C 3
Lead temperature (absolute maximum) 260 °C 3
Storage temperature (absolute maximum) -65 150 °C 3
Supply voltage (recommended operating) VIN 1.8 5.5 V 3
Output voltage (recommended operating) VOUT 5.5 V Min is VIN-MAX x 106% (not numeric, see note 4) 3
Operating junction temperature (recommended operating) TJ -40 125 °C 3
Quiescent current measured on OUT IQ 22 30 µA VEN = VIN = 3.3V, VOUT = 5V, no load, VFB = 0.65V, measured on OUT, TJ = 25°C 4
Quiescent current measured on IN IQ 8 12 µA VEN = VIN = 3.3V, VOUT = 5V, no load, VFB = 0.65V, measured on IN, TJ=25°C 4
Shutdown current ISD 0.1 1 µA VEN = VOUT = 0V, measured on IN TJ = 25°C 4
IN under-voltage lockout VIN UVLO 1.65 1.7 V VIN rising, TJ = 25°C 4
Operation frequency FSW 0.8 1 1.2 MHz 4
Feedback voltage reference VFB 594 600 606 mV TJ = 25°C 4
Feedback voltage reference VFB 591 600 609 mV TJ = -40°C to 125°C 4
Feedback input current IFB 1 50 nA VFB = 0.63V 4
NMOS leakage current IN LK 0.1 1 µA VSW = 6.5V, TJ = 25°C 4
PMOS leakage current IP LK 0.1 1 µA VSW = 6.5V, VOUT = 0V, TJ = 25°C 4
Maximum duty cycle DMAX 85 95 % 4
NMOS current limit ISW LIMIT 3 3.6 A Duty = 40% 4
EN input high-level voltage VEN H 1.2 V 4
EN input low-level voltage VEN L 0.4 V 4
IN under-voltage lockout hysteresis 100 mV 4
NMOS on resistance RNDS ON 70 mΩ 4
PMOS on resistance RPDS ON 80 mΩ 4
Start-up current limit IST_LIMIT 0.3 A VIN = 4V, Vo = 0V 4
Start-up current limit IST_LIMIT 0.8 A VIN = 4V, Vo setting = 3.6V, pull Vo to 3.3V 4
EN input current IEN 10 nA Connect to VIN 4
Thermal shutdown (guaranteed by characterization, not production tested) 155 °C 4
Over-temperature hysteresis (guaranteed by characterization, not production tested) 25 °C 4
Thermal resistance junction-to-ambient, TSOT23-8 θJA 100 °C/W Measured on JESD51-7, 4-layer PCB 3
Thermal resistance junction-to-case, TSOT23-8 θJC 55 °C/W Measured on JESD51-7, 4-layer PCB 3

CAD (KiCad official)

  • Symbol: MP3414AGJ-Z
  • Footprint: Package_TO_SOT_SMD:TSOT-23-8
  • 3D model: TSOT-23-8 (KiCad packages3D, STEP)
  • 3D model files: mp3414agj-z-etched.step / mp3414agj-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mp3414agj-z.step / mp3414agj-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Monolithic Power Systems datasheet (17 pp, sha256 ecb17e521f7f9b5c, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF