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MP28167GQ-Z

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Monolithic Power Systems DC-DC Converters, QFN-16(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MP28167GQ-Z

Monolithic Power Systems · DC-DC Converters · QFN-16(3x3)

MP28167GQ-Z from Monolithic Power Systems, in a QFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Supply voltage and drain of the internal power device that powers the whole chip; operates from 2.8V to 22V, and a input capacitor CIN must be placed as close to the IC as possible to limit voltage spikes.
2 GND power_in Power ground and reference ground of the regulated output voltage, requiring copper traces and vias for connection and extra care in PCB layout.
3 EN input On/off control for the entire chip: drive high to turn on, drive low or float to turn off; EN has an internal 2MΩ pull-down resistor to ground.
4 NC unconnected No connection; the datasheet states this pin should be connected to GND.
5 RSV1 passive Reserved pin that cannot be floated and can be tied to GND or VCC.
6 RSV2 passive Reserved pin that cannot be floated and can be tied to GND or VCC.
7 OC input Output constant current limit set pin, where the current-limit resistor R_OC sets the I_LIMIT value per Equation (1) and Table 1.
8 NC unconnected No connection; the datasheet states this pin should be connected to GND.
9 VCC power_out Internal 3.65V LDO regulator output that must be decoupled with a 1µF capacitor.
10 AGND power_in Analog ground that must be connected to GND.
11 GND power_in Power ground and reference ground of the regulated output voltage, requiring copper traces and vias for connection and extra care in PCB layout.
12 OUT power_out Output power pin, where the output capacitor must be placed close to OUT and GND; the regulated output is fixed at 5V and absolute OVP trips at 23V.
13 BST2 passive Bootstrap pin; a 0.1µF capacitor is connected between SW2 and BST2 to form a floating supply for the high-side switch driver.
14 SW2 passive Switching node of the second half-bridge, where one end of the inductor connects to carry the bridge current.
15 SW1 passive Switching node of the first half-bridge, where one end of the inductor connects to carry the bridge current.
16 BST1 passive Bootstrap pin; a 0.1µF capacitor is connected between SW1 and BST1 to form a floating supply for the high-side switch driver.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Monolithic Power Systems
Package QFN-16(3x3)
Category Power Management (PMIC)
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (VIN, VOUT) VIN, VOUT 24 V 4
Switch node voltage VSW1, SW2 VSW1, SW2 -0.3 V 4
Switch node voltage VSW1, SW2 (transient) VSW1, SW2 -7 V <10ns 4
Switch node voltage VSW1, SW2 (transient) VSW1, SW2 26 V <10ns 4
VEN VEN -0.3 24 V 4
All other pins -0.3 4 V 4
Continuous power dissipation 4.8 W TA = +25°C 4
Junction temperature 150 C 4
Storage temperature -65 150 C 4
Operation input voltage range 2.8 22 V 4
Output current 3 A 3A continuous current 4
Input current 4 A 4A input current 4
Operating junction temperature (TJ) TJ -40 125 C 4
Supply current (shutdown) IIN 0 3 μA VEN = 0V 5
Supply current (quiescent) IQ 1 mA Remove inductor, add 5.8V to VOUT 5
EN rising threshold VEN_Rising 1 1.1 1.2 V 5
EN hysteresis VEN_Falling 65 110 160 mV 5
EN on to VOUT > 90% delay TDelay 500 μs See Figure 7 5
VCC regulator VCC 3.3 3.65 4 V 5
VCC load regulation VCC_LOG 1 % ICC = 10mA 5
VIN under-voltage lockout threshold rising VIN_UVLO 2.5 2.65 2.8 V 5
VIN under-voltage lockout threshold hysteresis VUVLO_HYS 95 160 205 mV 5
HS switch on resistance RDSON_HS 25 40 mΩ Switch A, D 5
LS switch on resistance RDSON_LSB 21 35 mΩ Switch B, C 5
Output voltage tolerance VOUT -1.5 1.5 % 5
Output discharge resistance RDIS 60 100 Ω 5
Switch leakage SWLKG 1 μA VEN = 0V, VSW1, SW2 = 22V, TJ = +25°C 5
Switch leakage SWLKG 5 μA EN = 0V, VSW1, SW2 = 22V, TJ = -40°C to +125°C 5
Oscillator frequency tolerance fS -20 20 % TJ = +25°C 5
Minimum on time tON_MIN1 160 ns Switch A, B, C, D 5
Maximum duty cycle DMAX 85 % Buck mode, FREQ = 500kHz 5
Minimum duty cycle DMIN 15 % Boost mode, FREQ = 500kHz 5
Output over-voltage protection VOVP_R 150 160 170 % 5
Output OVP recovery VOVP_F 130 140 150 % 5
Low-side B valley limit ILIMIT2 6 8 10 A Switch B 5
Low-side C peak current limit ILIMIT3 10 A Switch C 5
Output average current tolerance IOUT_LIM2 -5 5 % VOUT = 5V, over 0-125°C temp range 5
Output UV threshold VUVP 45 50 55 % VREF 20µs deglitch, UV falling 5
Thermal shutdown rising threshold TSTD 150 C 6
Thermal hysteresis TSTD_HYS 20 C 6
EN to ground resistance REN 2 MΩ VEN = 2V 5
Output voltage VOUT 5 V 5
Oscillator frequency fS 530 kHz TJ = +25°C 5
Output average current IOUT_LIM2 3.5 A VOUT = 5V, over 0-125°C temp range 5
Thermal resistance junction-to-ambient (EV28167-Q-00A board) θJA 26 C/W EV28167-Q-00A, 4-layer PCB, 64mmx64mm 4
Thermal resistance junction-to-case (EV28167-Q-00A board) θJC 3 C/W EV28167-Q-00A, 4-layer PCB, 64mmx64mm 4
Thermal resistance junction-to-ambient (JESD51-7) θJA 50 C/W JESD51-7, 4-layer PCB 4
Thermal resistance junction-to-case (JESD51-7) θJC 12 C/W JESD51-7, 4-layer PCB 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper close to the IC’s VIN-to-GND and OUT-to￾GND pins, respectively. 2. Use a large copper plane for PGND. Add 17

CAD (KiCad official)

  • Symbol: MP28167GQ-Z
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: QFN-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: mp28167gq-z-etched.step / mp28167gq-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mp28167gq-z.step / mp28167gq-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Monolithic Power Systems datasheet (19 pp, sha256 bdc319967e4eae84, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF