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MP2562DS-LF-Z

Monolithic Power Systems · DC-DC Converters · SOIC-8

MP2562DS-LF-Z from Monolithic Power Systems, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW output Switch node and output of the high-side switch; a low forward drop Schottky diode to ground is required close to the SW pins, and VSW is rated from -0.3V (-5V for <10ns) to VIN +0.3V.
2 EN input Enable input: pulling it below the specified threshold (falling threshold 1.2V, rising 1.5V) shuts the chip down, while floating or pulling it above the threshold enables the chip.
3 COMP output Output of the internal error amplifier for loop frequency compensation; COMP is clamped between 0.9V and 2.0V during operation and should not be pulled up beyond 2.6V.
4 FB input Input to the error amplifier; the output voltage is set by a resistive divider from VOUT to GND, scaling VOUT to the internal 0.8V reference (VFB 0.776V to 0.824V).
5 GND power_in Ground; connect as close as possible to the output capacitor to shorten the high-current switch paths.
6 FREQ input Switching frequency program input; a resistor from this pin to ground sets the switching frequency up to 4MHz (for example RFREQ = 18kΩ gives 3.2 to 4.8MHz).
7 VIN power_in Input supply for the internal control circuitry, both BST regulators and the high-side switch, operating from 4.5V to 50V; a decoupling capacitor to ground must be placed close to this pin.
8 BST power_out Bootstrap positive supply for the internal floating high-side MOSFET driver; a bypass capacitor connects between BST and SW, and BST to SW is rated to 6V maximum.

Key specifications

Parameter Value
Manufacturer Monolithic Power Systems
Package SOIC-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (VIN) VIN -0.3 55 V 2
Switch Voltage VSW -0.3 V -5V allowed for <10ns; upper limit printed as VIN +0.3V 2
BST to SW -0.3 6 V 2
All Other Pins -0.3 6 V 2
Storage Temperature -65 150 °C 2
Junction Temperature 150 C 2
Continuous Power Dissipation 1.3 W TA=+25C, SOIC8 2
Supply Voltage VIN (recommended) VIN 4.5 50 V 2
Output Voltage VOUT (recommended) VOUT 0.8 47 V 2
Operating Junction Temperature -40 125 C 2
Feedback Voltage VFB 0.776 0.8 0.824 V 4.5V < VIN < 50V 3
Error Amp Transconductance 40 60 80 µA/V ICOMP = ±3µA 3
VIN UVLO Threshold 2.7 3 3.3 V 3
Oscillator Frequency 1.6 2 2.4 MHz RFREQ = 45kΩ 3
Oscillator Frequency 3.2 4 4.8 MHz RFREQ = 18kΩ 3
Shutdown Supply Current 12 20 µA VEN = 0V 3
Quiescent Supply Current 120 145 µA No load, VFB = 0.9V 3
EN Up Threshold 1.3 1.5 1.7 V 3
Thermal Resistance junction-to-ambient (SOIC8) θJA 96 C/W SOIC8, measured on JESD51-7 4-layer board 2
Thermal Resistance junction-to-case (SOIC8) θJC 45 C/W SOIC8, measured on JESD51-7 4-layer board 2

CAD (KiCad official)

  • Symbol: MP2562DS-LF-Z
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mp2562ds-lf-z-etched.step / mp2562ds-lf-z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mp2562ds-lf-z.step / mp2562ds-lf-z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Monolithic Power Systems datasheet (20 pp, sha256 2644b854fdbcfbab, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF