# MMDT3052DW

**MSKSEMI** · Bipolar (BJT) · SOT-363

MMDT3052DW from MSKSEMI, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | E1 | passive | Emitter of transistor 1 (NPN); VEBO max 6 V, IC max 200 mA per transistor. |
| 2 | B1 | passive | Base of transistor 1 (NPN); VEBO max 6 V, IEBO max 100 nA at VEB = 6 V. |
| 3 | C2 | passive | Collector of transistor 2 (NPN); VCEO 50 V, VCBO 50 V, IC max 200 mA. |
| 4 | E2 | passive | Emitter of transistor 2 (NPN); VEBO max 6 V, IC max 200 mA per transistor. |
| 5 | B2 | passive | Base of transistor 2 (NPN); VEBO max 6 V, IEBO max 100 nA at VEB = 6 V. |
| 6 | C1 | passive | Collector of transistor 1 (NPN); VCEO 50 V, VCBO 50 V, IC max 200 mA. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SOT-363 |
| Category | Transistors/Thyristors |
| Pins | 6 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector Base Cutoff Current | ICBO |  |  | 100 | nA | at VCB = 50 V | 2 |
| Emitter Base Cutoff Current | IEBO |  |  | 100 | nA | at VEB = 6 V | 2 |
| Collector Emitter Breakdown Voltage | V(BR)CEO | 50 |  |  | V | at IC = 100 µA | 2 |
| Collector Emitter Saturation Voltage | VCE(sat) |  |  | 0.3 | V | at IC = 100 mA, IB = 10 mA | 2 |
| Collector Base Voltage | VCBO |  |  | 50 | V |  | 2 |
| Collector Emitter Voltage | VCEO |  |  | 50 | V |  | 2 |
| Emitter Base Voltage | VEBO |  |  | 6 | V |  | 2 |
| Collector Current | IC |  |  | 200 | mA |  | 2 |
| Power Dissipation | Ptot |  |  | 150 | mW |  | 2 |
| Junction Temperature | Tj |  |  | 125 | ℃ |  | 2 |
| Storage Temperature Range | Tstg | -55 |  | 125 | ℃ |  | 2 |

## CAD (KiCad official)

- Symbol: `MMDT3052DW`
- Footprint: `Package_TO_SOT_SMD:SOT-363_SC-70-6`
- 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files: `mmdt3052dw-etched.step` / `mmdt3052dw-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mmdt3052dw.step` / `mmdt3052dw.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MSKSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590452035348041728) (5 pp, sha256 `93f527bb0b6cc788`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mmdt3052dw-datasheet.pdf)