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MMBZ27VALT3G

Public Made by Adom

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onsemi Zener Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MMBZ27VALT3G

onsemi · Zener Diodes · SOT-23

MMBZ27VALT3G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE 1 passive Cathode of Zener diode 1 (unidirectional circuit tied to pins 1 and 3), 27 V nominal breakdown (25.65 V to 28.35 V at 1.0 mA) with VRWM of 22 V.
2 CATHODE 2 passive Cathode of Zener diode 2 (unidirectional circuit tied to pins 2 and 3), 27 V nominal breakdown (25.65 V to 28.35 V at 1.0 mA) with VRWM of 22 V.
3 ANODE passive Common anode shared by both Zener diodes, typically tied to ground in protection applications.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working Peak Reverse Voltage VRWM 22 V 4
Maximum Reverse Leakage Current IR 50 nA @ VRWM 4
Breakdown Voltage VBR 25.65 27 28.35 V @ IT = 1.0 mA, 5% tolerance 4
Clamping Voltage VC 40 V @ IPP = 1.0 A 4
Maximum Reverse Peak Pulse Current IPP 1 A Surge waveform per Figure 6 4
Temperature Coefficient of VBR VBR 24.3 mV/°C 4
Forward Voltage VF 0.9 V @ IF = 10 mA 4
Peak Power Dissipation Ppk 40 W @ 1.0 ms, TL ≤ 25°C (MMBZ12V thru MMBZ47V) 3
Total Power Dissipation on FR-5 Board PD 225 mW @ TA = 25°C 3
Derating above 25°C (FR-5) 1.8 mW/°C Derate above 25°C 3
Thermal Resistance Junction-to-Ambient (FR-5) RθJA 556 °C/W FR-5 board 3
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C 3
Derating above 25°C (Alumina) 2.4 mW/°C Derate above 25°C 3
Thermal Resistance Junction-to-Ambient (Alumina) RθJA 417 °C/W Alumina substrate 3
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 3
Lead Solder Temperature TL 260 °C Maximum, 10 second duration 3

CAD (KiCad official)

  • Symbol: MMBZ27VALT3G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbz27valt3g-etched.step / mmbz27valt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz27valt3g.step / mmbz27valt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 912149f423ab3c58, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF