component
MMBZ27VALT3G
Public Made by Adomby adom
onsemi Zener Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMMBZ27VALT3G
onsemi · Zener Diodes · SOT-23
MMBZ27VALT3G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE 1 | passive | Cathode of Zener diode 1 (unidirectional circuit tied to pins 1 and 3), 27 V nominal breakdown (25.65 V to 28.35 V at 1.0 mA) with VRWM of 22 V. |
| 2 | CATHODE 2 | passive | Cathode of Zener diode 2 (unidirectional circuit tied to pins 2 and 3), 27 V nominal breakdown (25.65 V to 28.35 V at 1.0 mA) with VRWM of 22 V. |
| 3 | ANODE | passive | Common anode shared by both Zener diodes, typically tied to ground in protection applications. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working Peak Reverse Voltage | VRWM | 22 | V | 4 | |||
| Maximum Reverse Leakage Current | IR | 50 | nA | @ VRWM | 4 | ||
| Breakdown Voltage | VBR | 25.65 | 27 | 28.35 | V | @ IT = 1.0 mA, 5% tolerance | 4 |
| Clamping Voltage | VC | 40 | V | @ IPP = 1.0 A | 4 | ||
| Maximum Reverse Peak Pulse Current | IPP | 1 | A | Surge waveform per Figure 6 | 4 | ||
| Temperature Coefficient of VBR | VBR | 24.3 | mV/°C | 4 | |||
| Forward Voltage | VF | 0.9 | V | @ IF = 10 mA | 4 | ||
| Peak Power Dissipation | Ppk | 40 | W | @ 1.0 ms, TL ≤ 25°C (MMBZ12V thru MMBZ47V) | 3 | ||
| Total Power Dissipation on FR-5 Board | PD | 225 | mW | @ TA = 25°C | 3 | ||
| Derating above 25°C (FR-5) | 1.8 | mW/°C | Derate above 25°C | 3 | |||
| Thermal Resistance Junction-to-Ambient (FR-5) | RθJA | 556 | °C/W | FR-5 board | 3 | ||
| Total Power Dissipation on Alumina Substrate | PD | 300 | mW | @ TA = 25°C | 3 | ||
| Derating above 25°C (Alumina) | 2.4 | mW/°C | Derate above 25°C | 3 | |||
| Thermal Resistance Junction-to-Ambient (Alumina) | RθJA | 417 | °C/W | Alumina substrate | 3 | ||
| Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 3 | ||
| Lead Solder Temperature | TL | 260 | °C | Maximum, 10 second duration | 3 |
CAD (KiCad official)
- Symbol:
MMBZ27VALT3G - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
mmbz27valt3g-etched.step/mmbz27valt3g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mmbz27valt3g.step/mmbz27valt3g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (9 pp, sha256
912149f423ab3c58, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).