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Contents

README

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MMBT5401 100-200

GME(银河微电) · Bipolar (BJT) · SOT-23

MMBT5401 100-200 from GME(银河微电), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B input Base of the PNP transistor; VEBO max -5 V and IEBO max -50 nA at VEB = -3V.
2 E passive Emitter of the PNP transistor; emitter-base breakdown voltage min -5 V at IE = -10uA.
3 C passive Collector of the PNP transistor; VCBO -160 V, VCEO -150 V, continuous IC -0.6 A (peak -0.8 A).

Key specifications

Parameter Value
Manufacturer GME(银河微电)
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
hFE DC current gain (grade 100-200) hFE 100 200 - VCE = -5V, IC = -10mA 2
Current-Gain-Bandwidth Product fT 100 300 MHz IC = -10mA, VCE = -10V, f = 100MHz 2
Collector-Base Breakdown Voltage V(BR)CBO -160 V IC = -100μA, IE = 0 2
Collector-Emitter Breakdown Voltage V(BR)CEO -150 V IC = -1mA, IB = 0 2
Emitter-Base Breakdown Voltage V(BR)EBO -5 V IE = -10μA, IC = 0 2
Collector Cut-off Current ICBO -50 nA VCB = -120V, IE = 0 2
Emitter Cut-off Current IEBO -50 nA VEB = -3V, IC = 0 2
Collector-emitter Saturation Voltage VCE(sat) -0.2 V IC = -10mA, IB = -1mA 2
Collector-emitter Saturation Voltage VCE(sat) -0.5 V IC = -50mA, IB = -5mA 2
Base-emitter Saturation Voltage VBE(sat) -1 V IC = -10mA, IB = -1mA 2
Collector-base Output Capacitance Ccbo 6 pF VCB = -10V, f = 1MHz, IE = 0 2
Collector-Base Voltage VCBO -160 V 1
Collector-Emitter Breakdown Voltage VCEO -150 V 1
Emitter-Base Breakdown Voltage VEBO -5 V 1
Collector Current (Continuous) IC -0.6 A 1
Collector Current (Peak) ICM -0.8 A 1
Power Dissipation PD 0.35 W Note 1: surface mounted on 15mm15mm1mm FR4-epoxy P.C.B 1
Junction Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1
Thermal Resistance Junction-to-Air RθJA 315 °C/W Note 1: surface mounted on 15mm15mm1mm FR4-epoxy P.C.B 1
Thermal Resistance Junction-to-Case RθJC 185 °C/W Note 1: surface mounted on 15mm15mm1mm FR4-epoxy P.C.B 1
Thermal Resistance Junction-to-Lead RθJL 126 °C/W Note 1: surface mounted on 15mm15mm1mm FR4-epoxy P.C.B 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Tin-plated; solderability per MIL-STD-202, Method 208 SOT-23 1

CAD (KiCad official)

  • Symbol: MMBT5401 100-200
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbt5401-100-200-etched.step / mmbt5401-100-200-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbt5401-100-200.step / mmbt5401-100-200.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GME(银河微电) datasheet (4 pp, sha256 cc1d840e7e26a92a, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF