component

MMBD352LT1G

Public Made by Adom

by adom

onsemi Schottky Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MMBD352LT1G

onsemi · Schottky Diodes · SOT-23

MMBD352LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Anode of the first diode in the dual hot carrier mixer pair; each diode is rated for a continuous reverse voltage VR of 7.0 V.
2 CATHODE passive Cathode of the second diode in the dual hot carrier mixer pair; each diode is rated for a continuous reverse voltage VR of 7.0 V.
3 CATHODE-ANODE passive Common node shared by the two diodes (cathode of one diode tied to anode of the other, per the datasheet's Style 11 pin labeling); each diode is rated for a continuous reverse voltage VR of 7.0 V.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage VF 0.6 V IF = 10 mAdc 2
Reverse Leakage Current IR 0.25 µA VR = 3.0 V 2
Reverse Leakage Current IR 10 µA VR = 7.0 V 2
Capacitance C 1 pF VR = 0 V, f = 1.0 MHz 2
Continuous Reverse Voltage VR 7 V Maximum Ratings, each diode 1
Total Device Dissipation FR-5 Board PD 225 mW TA = 25°C, FR-5 board (Note 1) 1
Thermal Resistance, Junction-to-Ambient, FR-5 Board RθJA 556 °C/W FR-5 board (Note 1) 1
Total Device Dissipation Alumina Substrate PD 300 mW TA = 25°C, alumina substrate (Note 2) 1
Thermal Resistance, Junction-to-Ambient, Alumina Substrate RθJA 417 °C/W alumina substrate (Note 2) 1
Junction and Storage Temperature TJ, Tstg -55 150 °C 1

CAD (KiCad official)

  • Symbol: MMBD352LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbd352lt1g-etched.step / mmbd352lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbd352lt1g.step / mmbd352lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (3 pp, sha256 3d25cf059d274449, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF