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MM74HCT32M

onsemi · Logic Gates · SOIC-14

MM74HCT32M from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 input Gate 1 input A; TTL-compatible threshold with VIH min 2.0V and VIL max 0.8V.
2 B1 input Gate 1 input B; TTL-compatible threshold with VIH min 2.0V and VIL max 0.8V.
3 Y1 output Gate 1 OR output (Y1 = A1 + B1); rated for ±25mA maximum DC output current per pin.
4 A2 input Gate 2 input A; TTL-compatible threshold with VIH min 2.0V and VIL max 0.8V.
5 B2 input Gate 2 input B; TTL-compatible threshold with VIH min 2.0V and VIL max 0.8V.
6 Y2 output Gate 2 OR output (Y2 = A2 + B2); rated for ±25mA maximum DC output current per pin.
7 GND power_in Ground pin (0V reference); absolute maximum VCC or GND current is ±50mA per pin.
8 Y3 output Gate 3 OR output (Y3 = A3 + B3); rated for ±25mA maximum DC output current per pin.
9 A3 input Gate 3 input A; TTL-compatible threshold with VIH min 2.0V and VIL max 0.8V.
10 B3 input Gate 3 input B; TTL-compatible threshold with VIH min 2.0V and VIL max 0.8V.
11 Y4 output Gate 4 OR output (Y4 = A4 + B4); rated for ±25mA maximum DC output current per pin.
12 A4 input Gate 4 input A; TTL-compatible threshold with VIH min 2.0V and VIL max 0.8V.
13 B4 input Gate 4 input B; TTL-compatible threshold with VIH min 2.0V and VIL max 0.8V.
14 VCC power_in Positive supply; recommended operating range 4.5V to 5.5V, absolute maximum -0.5 to +7.0V.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-14
Category Logic
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC 4.5 5.5 V 4
Operating Temperature Range TA -40 85 °C 4
Input Rise or Fall Times tr, tf 500 ns 4
DC Input or Output Voltage VIN, VOUT 0 V max = VCC 4
Supply Voltage (absolute) VCC -0.5 7 V 4
DC Input Voltage (absolute) VIN -1.5 V max = VCC+1.5V 4
DC Output Voltage (absolute) VOUT -0.5 V max = VCC+0.5V 4
Clamp Diode Current IIK, IOK -20 20 mA 4
DC Output Current, per pin IOUT -25 25 mA 4
DC VCC or GND Current, per pin ICC -50 50 mA 4
Storage Temperature Range TSTG -65 150 °C 4
Power Dissipation PD 600 mW Note 2 4
Power Dissipation S.O. Package PD 500 mW S.O. package only 4
Lead Temperature (Soldering 10 seconds) TL 260 °C 10 seconds soldering 4
Minimum HIGH Level Input Voltage VIH 2 2 V VCC = 5V ± 10% 5
Maximum LOW Level Input Voltage VIL 0.8 0.8 V VCC = 5V ± 10% 5
Minimum HIGH Level Output Voltage VOH 3.98 4.2 V VIN = VIH or VIL, /IOUT/ = 4.0mA, VCC = 4.5V, TA = 25°C 5
Minimum HIGH Level Output Voltage VOH 3.84 4.2 V VIN = VIH or VIL, /IOUT/ = 4.0mA, VCC = 4.5V, TA = -40°C to +85°C 5
Minimum HIGH Level Output Voltage VOH 4.98 5.2 V VIN = VIH or VIL, /IOUT/ = 4.8mA, VCC = 5.5V, TA = 25°C 5
Minimum HIGH Level Output Voltage VOH 4.84 5.2 V VIN = VIH or VIL, /IOUT/ = 4.8mA, VCC = 5.5V, TA = -40°C to +85°C 5
Maximum LOW Level Output Voltage VOL 0 0.1 V VIN = VIH, /IOUT/ = 20µA, TA = 25°C 5
Maximum LOW Level Output Voltage VOL 0.2 0.26 V VIN = VIH, /IOUT/ = 4.0mA, VCC = 4.5V, TA = 25°C 5
Maximum LOW Level Output Voltage VOL 0.2 0.33 V VIN = VIH, /IOUT/ = 4.0mA, VCC = 4.5V, TA = -40°C to +85°C 5
Maximum Input Current IIN -1 0.1 1 µA VIN = VCC or GND, VIH or VIL 5
Maximum Quiescent Supply Current ICC 2 20 µA VIN = VCC or GND, IOUT = 0µA 5
Maximum Quiescent Supply Current ICC 1.2 1.4 mA VIN = 2.4V or 0.5V 5
Maximum Propagation Delay tPLH, tPHL 12 20 ns VCC = 5.0V ± 10%, tr = tf = 6ns, CL = 15pF, TA = 25°C 5
Maximum Propagation Delay tPLH, tPHL 12 25 ns VCC = 5.0V ± 10%, tr = tf = 6ns, CL = 15pF, TA = -40°C to +85°C 5
Maximum Output Rise & Fall Time tTHL, tTLH 8 15 ns VCC = 5.0V ± 10%, tr = tf = 6ns, CL = 15pF, TA = 25°C 5
Maximum Output Rise & Fall Time tTHL, tTLH 8 19 ns VCC = 5.0V ± 10%, tr = tf = 6ns, CL = 15pF, TA = -40°C to +85°C 5
Input Capacitance CIN 5 10 pF TA = 25°C 5

CAD (KiCad official)

  • Symbol: MM74HCT32M
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: mm74hct32m-etched.step / mm74hct32m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mm74hct32m.step / mm74hct32m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 f6f9a855f466c557, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF